Thermal placement of elements of integrated circuits on crystal surface View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2017-07

AUTHORS

A. G. Harutyunyan

ABSTRACT

The criterion and the corresponding approach for the thermal placement of integrated circuits (IC) elements on the crystal surface are proposed. The criterion of placement is identical to the traditional criteria of minimizing the total length of connections between elements, which at the placement stage enables to apply an additive multiparametric criterion of joint consideration of electrical and thermal modes for operating of the IC elements. More... »

PAGES

276-280

Identifiers

URI

http://scigraph.springernature.com/pub.10.3103/s1068337217030148

DOI

http://dx.doi.org/10.3103/s1068337217030148

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1091353933


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