Reductions in the Lattice Thermal Conductivity of Ball-milled and Shock compacted TiNiSn1−XSbX Half-Heusler alloys View Full Text


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Article Info

DATE

2001

AUTHORS

S. Bhattacharya, Y. Xia, V. Ponnambalam, S.J. Poon, N. Thadani, T.M. Tritt

ABSTRACT

ABSTRACT Half-Heusler alloys are currently being investigated for their potential as thermoelectric materials [1], [2]. They exhibit high negative thermopower (40-250μV/K) and favorable electrical resistivity (0.1-8mW•cm) at room temperature. Attractive power factors (α 2 σT) of about (0.2-1.0W/m•K) at room temperature and about 4W/m•K at 600K [3] have been reported in these materials. But in order to achieve a high figure-of-merit in the half-Heusler alloys, the relatively high thermal conductivity in these materials (∼ 10 W/m•K) must be reduced. The thermal conductivity in these materials is composed of mainly a lattice contribution, compared to a very small electronic component. The challenge is to reduce the relatively high lattice thermal conductivity in these materials. Reported in this paper is a significant reduction of lattice thermal conductivity (∼1.5 - 3.5W/m•K) in some Ti-based half-Heusler alloys. Samples have been prepared by ball milling and followed by shock-compaction that has resulted into reduced grain sizes in these materials. The effects of the microstructure on the thermal transport properties of the Half-Heusler alloys have been investigated and are presented and discussed herein. More... »

PAGES

g7.1

References to SciGraph publications

  • 1990-10. Narrow band in the intermetallic compounds MNiSn (M=Ti, Zr, Hf) in ZEITSCHRIFT FÜR PHYSIK B CONDENSED MATTER
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    http://scigraph.springernature.com/pub.10.1557/proc-691-g7.1

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