Fracture analysis of anodically bonded silicon substrates during the CMP process View Full Text


Ontology type: schema:ScholarlyArticle      Open Access: True


Article Info

DATE

2018-12

AUTHORS

Sung-min Sim, Yeonsu Lee, Hye-Lim Kang, Youngsuk Hwang, Chi-Hyun Park, Ignacio Llamas-Garro, Jung-Mu Kim

ABSTRACT

In this paper, a stress and fracture study, occurring during the chemical mechanical polishing (CMP) of anodically bonded substrates is presented. The samples contain glass pillars, used to form the glass cavities and a silicon substrate sealing the glass structure, the samples are fabricated using the anodic bonding process. The mechanical stresses of the bonded silicon substrate are simulated using the COMSOL software. The fracture strength after post-processing is investigated based on the criterion value, which is the ratio of the anodically bonded area over the cavity area. It is found that the bonded area and the distribution of pillars are related to the mechanical stability of the bonded substrate during the CMP process. Studies on the stability of subsequent processes, like CMP after anodic bonding, plays an important role in improving the fabrication yield of anodic bonded devices. More... »

PAGES

13

References to SciGraph publications

  • 2011-01-07. Wafer Bonding in MEMS MATERIALS AND PROCESSES HANDBOOK
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    http://scigraph.springernature.com/pub.10.1186/s40486-018-0075-0

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    http://dx.doi.org/10.1186/s40486-018-0075-0

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    [
      {
        "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
        "about": [
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Materials Engineering", 
            "type": "DefinedTerm"
          }, 
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Engineering", 
            "type": "DefinedTerm"
          }
        ], 
        "author": [
          {
            "affiliation": {
              "alternateName": "Chonbuk National University", 
              "id": "https://www.grid.ac/institutes/grid.411545.0", 
              "name": [
                "Division of Electronics and Information Engineering, Chonbuk National University, 54896, Jeonju, Republic of Korea"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Sim", 
            "givenName": "Sung-min", 
            "id": "sg:person.010015134171.51", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010015134171.51"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "Chonbuk National University", 
              "id": "https://www.grid.ac/institutes/grid.411545.0", 
              "name": [
                "Division of Electronics and Information Engineering, Chonbuk National University, 54896, Jeonju, Republic of Korea"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Lee", 
            "givenName": "Yeonsu", 
            "id": "sg:person.011410075171.28", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011410075171.28"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "Chonbuk National University", 
              "id": "https://www.grid.ac/institutes/grid.411545.0", 
              "name": [
                "Division of Electronics and Information Engineering, Chonbuk National University, 54896, Jeonju, Republic of Korea"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Kang", 
            "givenName": "Hye-Lim", 
            "id": "sg:person.013003036171.53", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.013003036171.53"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "name": [
                "Microinfinity Co., Ltd, 16229, Suwon, Republic of Korea"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Hwang", 
            "givenName": "Youngsuk", 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "name": [
                "Microinfinity Co., Ltd, 16229, Suwon, Republic of Korea"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Park", 
            "givenName": "Chi-Hyun", 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "Centre Tecnologic De Telecomunicacions De Catalunya", 
              "id": "https://www.grid.ac/institutes/grid.28409.37", 
              "name": [
                "Centre Tecnol\u00f2gic de Telecomunicacions de Catalunya, CERCA, Castelldefels, 08860, Barcelona, Spain"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Llamas-Garro", 
            "givenName": "Ignacio", 
            "id": "sg:person.015553306156.85", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015553306156.85"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "Chonbuk National University", 
              "id": "https://www.grid.ac/institutes/grid.411545.0", 
              "name": [
                "Department of Electronic Engineering, Chonbuk National University, 54896, Jeonju, Republic of Korea"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Kim", 
            "givenName": "Jung-Mu", 
            "id": "sg:person.012766067623.24", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012766067623.24"
            ], 
            "type": "Person"
          }
        ], 
        "citation": [
          {
            "id": "https://doi.org/10.1016/j.sna.2006.02.016", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1015907684"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/978-0-387-47318-5_11", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1023982880", 
              "https://doi.org/10.1007/978-0-387-47318-5_11"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/978-0-387-47318-5_11", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1023982880", 
              "https://doi.org/10.1007/978-0-387-47318-5_11"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1088/0960-1317/13/5/318", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1024389084"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1149/1.2426877", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1047284688"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.3390/s18041240", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1103405533"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1016/j.microrel.2018.06.019", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1105291722"
            ], 
            "type": "CreativeWork"
          }
        ], 
        "datePublished": "2018-12", 
        "datePublishedReg": "2018-12-01", 
        "description": "In this paper, a stress and fracture study, occurring during the chemical mechanical polishing (CMP) of anodically bonded substrates is presented. The samples contain glass pillars, used to form the glass cavities and a silicon substrate sealing the glass structure, the samples are fabricated using the anodic bonding process. The mechanical stresses of the bonded silicon substrate are simulated using the COMSOL software. The fracture strength after post-processing is investigated based on the criterion value, which is the ratio of the anodically bonded area over the cavity area. It is found that the bonded area and the distribution of pillars are related to the mechanical stability of the bonded substrate during the CMP process. Studies on the stability of subsequent processes, like CMP after anodic bonding, plays an important role in improving the fabrication yield of anodic bonded devices.", 
        "genre": "non_research_article", 
        "id": "sg:pub.10.1186/s40486-018-0075-0", 
        "inLanguage": [
          "en"
        ], 
        "isAccessibleForFree": true, 
        "isPartOf": [
          {
            "id": "sg:journal.1136003", 
            "issn": [
              "2213-9621"
            ], 
            "name": "Micro and Nano Systems Letters", 
            "type": "Periodical"
          }, 
          {
            "issueNumber": "1", 
            "type": "PublicationIssue"
          }, 
          {
            "type": "PublicationVolume", 
            "volumeNumber": "6"
          }
        ], 
        "name": "Fracture analysis of anodically bonded silicon substrates during the CMP process", 
        "pagination": "13", 
        "productId": [
          {
            "name": "readcube_id", 
            "type": "PropertyValue", 
            "value": [
              "12516602a8e3551a30bc3e4c282045976d328537904405d2bac1a9c0c30201f7"
            ]
          }, 
          {
            "name": "doi", 
            "type": "PropertyValue", 
            "value": [
              "10.1186/s40486-018-0075-0"
            ]
          }, 
          {
            "name": "dimensions_id", 
            "type": "PropertyValue", 
            "value": [
              "pub.1110465262"
            ]
          }
        ], 
        "sameAs": [
          "https://doi.org/10.1186/s40486-018-0075-0", 
          "https://app.dimensions.ai/details/publication/pub.1110465262"
        ], 
        "sdDataset": "articles", 
        "sdDatePublished": "2019-04-11T08:21", 
        "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
        "sdPublisher": {
          "name": "Springer Nature - SN SciGraph project", 
          "type": "Organization"
        }, 
        "sdSource": "s3://com-uberresearch-data-dimensions-target-20181106-alternative/cleanup/v134/2549eaecd7973599484d7c17b260dba0a4ecb94b/merge/v9/a6c9fde33151104705d4d7ff012ea9563521a3ce/jats-lookup/v90/0000000290_0000000290/records_34910_00000000.jsonl", 
        "type": "ScholarlyArticle", 
        "url": "https://link.springer.com/10.1186%2Fs40486-018-0075-0"
      }
    ]
     

    Download the RDF metadata as:  json-ld nt turtle xml License info

    HOW TO GET THIS DATA PROGRAMMATICALLY:

    JSON-LD is a popular format for linked data which is fully compatible with JSON.

    curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1186/s40486-018-0075-0'

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    curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1186/s40486-018-0075-0'

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    This table displays all metadata directly associated to this object as RDF triples.

    127 TRIPLES      21 PREDICATES      33 URIs      19 LITERALS      7 BLANK NODES

    Subject Predicate Object
    1 sg:pub.10.1186/s40486-018-0075-0 schema:about anzsrc-for:09
    2 anzsrc-for:0912
    3 schema:author N6ff579d5d7684878824af5c452930433
    4 schema:citation sg:pub.10.1007/978-0-387-47318-5_11
    5 https://doi.org/10.1016/j.microrel.2018.06.019
    6 https://doi.org/10.1016/j.sna.2006.02.016
    7 https://doi.org/10.1088/0960-1317/13/5/318
    8 https://doi.org/10.1149/1.2426877
    9 https://doi.org/10.3390/s18041240
    10 schema:datePublished 2018-12
    11 schema:datePublishedReg 2018-12-01
    12 schema:description In this paper, a stress and fracture study, occurring during the chemical mechanical polishing (CMP) of anodically bonded substrates is presented. The samples contain glass pillars, used to form the glass cavities and a silicon substrate sealing the glass structure, the samples are fabricated using the anodic bonding process. The mechanical stresses of the bonded silicon substrate are simulated using the COMSOL software. The fracture strength after post-processing is investigated based on the criterion value, which is the ratio of the anodically bonded area over the cavity area. It is found that the bonded area and the distribution of pillars are related to the mechanical stability of the bonded substrate during the CMP process. Studies on the stability of subsequent processes, like CMP after anodic bonding, plays an important role in improving the fabrication yield of anodic bonded devices.
    13 schema:genre non_research_article
    14 schema:inLanguage en
    15 schema:isAccessibleForFree true
    16 schema:isPartOf N5509ab8eca7148448255974649c64192
    17 Nc2f5e4587cc7419e8bda71b227903cbb
    18 sg:journal.1136003
    19 schema:name Fracture analysis of anodically bonded silicon substrates during the CMP process
    20 schema:pagination 13
    21 schema:productId N4fc5e5ed61d446ca85f7172efda57b9c
    22 Ndcd4e50307ec45818a095cea49fdb2ae
    23 Ndd0e6766ded34958aacc5fc12dd78812
    24 schema:sameAs https://app.dimensions.ai/details/publication/pub.1110465262
    25 https://doi.org/10.1186/s40486-018-0075-0
    26 schema:sdDatePublished 2019-04-11T08:21
    27 schema:sdLicense https://scigraph.springernature.com/explorer/license/
    28 schema:sdPublisher N5893b3ad760e439f92a045e9e459c626
    29 schema:url https://link.springer.com/10.1186%2Fs40486-018-0075-0
    30 sgo:license sg:explorer/license/
    31 sgo:sdDataset articles
    32 rdf:type schema:ScholarlyArticle
    33 N0706b27ba09b492ba022f8dad2dac7b7 schema:name Microinfinity Co., Ltd, 16229, Suwon, Republic of Korea
    34 rdf:type schema:Organization
    35 N390a6b1ecd754e06ae149838311ae7a1 rdf:first N4ddbbfb756084122b46a46e8d52f1927
    36 rdf:rest N4f07d36fc80446d894638dbdfa8b50ff
    37 N4ddbbfb756084122b46a46e8d52f1927 schema:affiliation Nad01d454774b438c9ac395df205d5143
    38 schema:familyName Hwang
    39 schema:givenName Youngsuk
    40 rdf:type schema:Person
    41 N4f07d36fc80446d894638dbdfa8b50ff rdf:first N891e65d64db247afa27a0d12f386d3b8
    42 rdf:rest N9aeb22a9af9e46d28944a3d5c3102fe6
    43 N4fc5e5ed61d446ca85f7172efda57b9c schema:name readcube_id
    44 schema:value 12516602a8e3551a30bc3e4c282045976d328537904405d2bac1a9c0c30201f7
    45 rdf:type schema:PropertyValue
    46 N5509ab8eca7148448255974649c64192 schema:volumeNumber 6
    47 rdf:type schema:PublicationVolume
    48 N5893b3ad760e439f92a045e9e459c626 schema:name Springer Nature - SN SciGraph project
    49 rdf:type schema:Organization
    50 N6ff579d5d7684878824af5c452930433 rdf:first sg:person.010015134171.51
    51 rdf:rest Na395041a878b48b989e99c758c18ab07
    52 N891e65d64db247afa27a0d12f386d3b8 schema:affiliation N0706b27ba09b492ba022f8dad2dac7b7
    53 schema:familyName Park
    54 schema:givenName Chi-Hyun
    55 rdf:type schema:Person
    56 N9aeb22a9af9e46d28944a3d5c3102fe6 rdf:first sg:person.015553306156.85
    57 rdf:rest Nc73985ae696a4aa690c0a32c425d7bf0
    58 Na395041a878b48b989e99c758c18ab07 rdf:first sg:person.011410075171.28
    59 rdf:rest Nb0601dc67b2e48d0bd045df40d48acb9
    60 Nad01d454774b438c9ac395df205d5143 schema:name Microinfinity Co., Ltd, 16229, Suwon, Republic of Korea
    61 rdf:type schema:Organization
    62 Nb0601dc67b2e48d0bd045df40d48acb9 rdf:first sg:person.013003036171.53
    63 rdf:rest N390a6b1ecd754e06ae149838311ae7a1
    64 Nc2f5e4587cc7419e8bda71b227903cbb schema:issueNumber 1
    65 rdf:type schema:PublicationIssue
    66 Nc73985ae696a4aa690c0a32c425d7bf0 rdf:first sg:person.012766067623.24
    67 rdf:rest rdf:nil
    68 Ndcd4e50307ec45818a095cea49fdb2ae schema:name dimensions_id
    69 schema:value pub.1110465262
    70 rdf:type schema:PropertyValue
    71 Ndd0e6766ded34958aacc5fc12dd78812 schema:name doi
    72 schema:value 10.1186/s40486-018-0075-0
    73 rdf:type schema:PropertyValue
    74 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
    75 schema:name Engineering
    76 rdf:type schema:DefinedTerm
    77 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
    78 schema:name Materials Engineering
    79 rdf:type schema:DefinedTerm
    80 sg:journal.1136003 schema:issn 2213-9621
    81 schema:name Micro and Nano Systems Letters
    82 rdf:type schema:Periodical
    83 sg:person.010015134171.51 schema:affiliation https://www.grid.ac/institutes/grid.411545.0
    84 schema:familyName Sim
    85 schema:givenName Sung-min
    86 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010015134171.51
    87 rdf:type schema:Person
    88 sg:person.011410075171.28 schema:affiliation https://www.grid.ac/institutes/grid.411545.0
    89 schema:familyName Lee
    90 schema:givenName Yeonsu
    91 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011410075171.28
    92 rdf:type schema:Person
    93 sg:person.012766067623.24 schema:affiliation https://www.grid.ac/institutes/grid.411545.0
    94 schema:familyName Kim
    95 schema:givenName Jung-Mu
    96 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012766067623.24
    97 rdf:type schema:Person
    98 sg:person.013003036171.53 schema:affiliation https://www.grid.ac/institutes/grid.411545.0
    99 schema:familyName Kang
    100 schema:givenName Hye-Lim
    101 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.013003036171.53
    102 rdf:type schema:Person
    103 sg:person.015553306156.85 schema:affiliation https://www.grid.ac/institutes/grid.28409.37
    104 schema:familyName Llamas-Garro
    105 schema:givenName Ignacio
    106 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015553306156.85
    107 rdf:type schema:Person
    108 sg:pub.10.1007/978-0-387-47318-5_11 schema:sameAs https://app.dimensions.ai/details/publication/pub.1023982880
    109 https://doi.org/10.1007/978-0-387-47318-5_11
    110 rdf:type schema:CreativeWork
    111 https://doi.org/10.1016/j.microrel.2018.06.019 schema:sameAs https://app.dimensions.ai/details/publication/pub.1105291722
    112 rdf:type schema:CreativeWork
    113 https://doi.org/10.1016/j.sna.2006.02.016 schema:sameAs https://app.dimensions.ai/details/publication/pub.1015907684
    114 rdf:type schema:CreativeWork
    115 https://doi.org/10.1088/0960-1317/13/5/318 schema:sameAs https://app.dimensions.ai/details/publication/pub.1024389084
    116 rdf:type schema:CreativeWork
    117 https://doi.org/10.1149/1.2426877 schema:sameAs https://app.dimensions.ai/details/publication/pub.1047284688
    118 rdf:type schema:CreativeWork
    119 https://doi.org/10.3390/s18041240 schema:sameAs https://app.dimensions.ai/details/publication/pub.1103405533
    120 rdf:type schema:CreativeWork
    121 https://www.grid.ac/institutes/grid.28409.37 schema:alternateName Centre Tecnologic De Telecomunicacions De Catalunya
    122 schema:name Centre Tecnològic de Telecomunicacions de Catalunya, CERCA, Castelldefels, 08860, Barcelona, Spain
    123 rdf:type schema:Organization
    124 https://www.grid.ac/institutes/grid.411545.0 schema:alternateName Chonbuk National University
    125 schema:name Department of Electronic Engineering, Chonbuk National University, 54896, Jeonju, Republic of Korea
    126 Division of Electronics and Information Engineering, Chonbuk National University, 54896, Jeonju, Republic of Korea
    127 rdf:type schema:Organization
     




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