Flexible Low Dielectric Polyimide/Fluorinated Ethylene Propylene Composite Films for Flexible Integrated Circuits View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2022-02-09

AUTHORS

Xiuwei Lv, Juan Yv, Xiaodong Wang, Pei Huang

ABSTRACT

Fluorinated ethylene propylene was used as filler to reduce the permittivity of polyimide. However, fluorinated ethylene propylene dispersion in N,N-dimethylacetamide is very poor. Therefore, fluorinated ethylene propylene was dispersed in N,N-dimethylacetamide solvent by substituting solvent. Then polyimide/fluorinated ethylene propylene composite membrane was prepared by in situ polymerization. A series of polyimide/fluorinated ethylene propylene composite films were prepared by adjusting the mass ratio of fluorinated ethylene propylene powder to polyimide. The effects of the addition of fluorinated ethylene propylene powder on the morphological, mechanical, thermal and dielectric properties of the composite film are investigated. Experimental results show that the dielectric constant of the composite film is lower than that of pure polyimide film. And can maintain thermal stability, to ensure certain mechanical properties. The results show that the composite film can be used as flexible integrated circuit substrate. More... »

PAGES

219-228

Identifiers

URI

http://scigraph.springernature.com/pub.10.1134/s1560090422020063

DOI

http://dx.doi.org/10.1134/s1560090422020063

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1145408376


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[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "Nanjing Tech University, 211816, Nanjing, China", 
          "id": "http://www.grid.ac/institutes/grid.412022.7", 
          "name": [
            "Nanjing Tech University, 211816, Nanjing, China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Xiuwei Lv", 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Nanjing Tech University, 211816, Nanjing, China", 
          "id": "http://www.grid.ac/institutes/grid.412022.7", 
          "name": [
            "Nanjing Tech University, 211816, Nanjing, China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Yv", 
        "givenName": "Juan", 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Nanjing Tech University, 211816, Nanjing, China", 
          "id": "http://www.grid.ac/institutes/grid.412022.7", 
          "name": [
            "Nanjing Tech University, 211816, Nanjing, China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Wang", 
        "givenName": "Xiaodong", 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Nanjing Tech University, 211816, Nanjing, China", 
          "id": "http://www.grid.ac/institutes/grid.412022.7", 
          "name": [
            "Nanjing Tech University, 211816, Nanjing, China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Huang", 
        "givenName": "Pei", 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1007/s10118-021-2514-2", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1132620456", 
          "https://doi.org/10.1007/s10118-021-2514-2"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10854-019-01839-3", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1119866213", 
          "https://doi.org/10.1007/s10854-019-01839-3"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11249-011-9892-5", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1003831283", 
          "https://doi.org/10.1007/s11249-011-9892-5"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2022-02-09", 
    "datePublishedReg": "2022-02-09", 
    "description": "Fluorinated ethylene propylene was used as filler to reduce the permittivity of polyimide. However, fluorinated ethylene propylene dispersion in N,N-dimethylacetamide is very poor. Therefore, fluorinated ethylene propylene was dispersed in N,N-dimethylacetamide solvent by substituting solvent. Then polyimide/fluorinated ethylene propylene composite membrane was prepared by in situ polymerization. A series of polyimide/fluorinated ethylene propylene composite films were prepared by adjusting the mass ratio of fluorinated ethylene propylene powder to polyimide. The effects of the addition of fluorinated ethylene propylene powder on the morphological, mechanical, thermal and dielectric properties of the composite film are investigated. Experimental results show that the dielectric constant of the composite film is lower than that of pure polyimide film. And can maintain thermal stability, to ensure certain mechanical properties. The results show that the composite film can be used as flexible integrated circuit substrate.", 
    "genre": "article", 
    "id": "sg:pub.10.1134/s1560090422020063", 
    "isAccessibleForFree": false, 
    "isPartOf": [
      {
        "id": "sg:journal.1400109", 
        "issn": [
          "0965-545X", 
          "1023-3091"
        ], 
        "name": "Polymer Science, Series B", 
        "publisher": "Pleiades Publishing", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "2", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "64"
      }
    ], 
    "keywords": [
      "composite films", 
      "ethylene propylene", 
      "Flexible integrated circuits", 
      "pure polyimide film", 
      "certain mechanical properties", 
      "fluorinated ethylene propylene", 
      "composite membranes", 
      "mechanical properties", 
      "polyimide films", 
      "Integrated Circuits", 
      "N-dimethylacetamide solvent", 
      "circuit substrate", 
      "situ polymerization", 
      "dielectric properties", 
      "thermal stability", 
      "films", 
      "mass ratio", 
      "powder", 
      "experimental results", 
      "filler", 
      "N-dimethylacetamide", 
      "polyimide", 
      "properties", 
      "dielectric", 
      "permittivity", 
      "propylene", 
      "circuit", 
      "solvent", 
      "dispersion", 
      "substrate", 
      "stability", 
      "results", 
      "ratio", 
      "polymerization", 
      "addition", 
      "effect", 
      "membrane", 
      "series"
    ], 
    "name": "Flexible Low Dielectric Polyimide/Fluorinated Ethylene Propylene Composite Films for Flexible Integrated Circuits", 
    "pagination": "219-228", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1145408376"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1134/s1560090422020063"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1134/s1560090422020063", 
      "https://app.dimensions.ai/details/publication/pub.1145408376"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2022-08-04T17:10", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-springernature-scigraph/baseset/20220804/entities/gbq_results/article/article_921.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://doi.org/10.1134/s1560090422020063"
  }
]
 

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This table displays all metadata directly associated to this object as RDF triples.

123 TRIPLES      21 PREDICATES      65 URIs      54 LITERALS      6 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1134/s1560090422020063 schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author N698b407d811f483f98ea8d52844f3a10
4 schema:citation sg:pub.10.1007/s10118-021-2514-2
5 sg:pub.10.1007/s10854-019-01839-3
6 sg:pub.10.1007/s11249-011-9892-5
7 schema:datePublished 2022-02-09
8 schema:datePublishedReg 2022-02-09
9 schema:description Fluorinated ethylene propylene was used as filler to reduce the permittivity of polyimide. However, fluorinated ethylene propylene dispersion in N,N-dimethylacetamide is very poor. Therefore, fluorinated ethylene propylene was dispersed in N,N-dimethylacetamide solvent by substituting solvent. Then polyimide/fluorinated ethylene propylene composite membrane was prepared by in situ polymerization. A series of polyimide/fluorinated ethylene propylene composite films were prepared by adjusting the mass ratio of fluorinated ethylene propylene powder to polyimide. The effects of the addition of fluorinated ethylene propylene powder on the morphological, mechanical, thermal and dielectric properties of the composite film are investigated. Experimental results show that the dielectric constant of the composite film is lower than that of pure polyimide film. And can maintain thermal stability, to ensure certain mechanical properties. The results show that the composite film can be used as flexible integrated circuit substrate.
10 schema:genre article
11 schema:isAccessibleForFree false
12 schema:isPartOf N31da00420e3a404eba53a51eace65d39
13 Nd2f01b1e34724847b9678b244952b248
14 sg:journal.1400109
15 schema:keywords Flexible integrated circuits
16 Integrated Circuits
17 N-dimethylacetamide
18 N-dimethylacetamide solvent
19 addition
20 certain mechanical properties
21 circuit
22 circuit substrate
23 composite films
24 composite membranes
25 dielectric
26 dielectric properties
27 dispersion
28 effect
29 ethylene propylene
30 experimental results
31 filler
32 films
33 fluorinated ethylene propylene
34 mass ratio
35 mechanical properties
36 membrane
37 permittivity
38 polyimide
39 polyimide films
40 polymerization
41 powder
42 properties
43 propylene
44 pure polyimide film
45 ratio
46 results
47 series
48 situ polymerization
49 solvent
50 stability
51 substrate
52 thermal stability
53 schema:name Flexible Low Dielectric Polyimide/Fluorinated Ethylene Propylene Composite Films for Flexible Integrated Circuits
54 schema:pagination 219-228
55 schema:productId Nb18c70d3693a490193996bf004fac86f
56 Nca0db9e4cc954f4e98c1436834f5e04e
57 schema:sameAs https://app.dimensions.ai/details/publication/pub.1145408376
58 https://doi.org/10.1134/s1560090422020063
59 schema:sdDatePublished 2022-08-04T17:10
60 schema:sdLicense https://scigraph.springernature.com/explorer/license/
61 schema:sdPublisher N11e881444b22462890f5707bb266e9ba
62 schema:url https://doi.org/10.1134/s1560090422020063
63 sgo:license sg:explorer/license/
64 sgo:sdDataset articles
65 rdf:type schema:ScholarlyArticle
66 N04cf2f242f13494b85998968513c48d7 rdf:first N3e1363f638b849059126584f03cc235c
67 rdf:rest rdf:nil
68 N11e881444b22462890f5707bb266e9ba schema:name Springer Nature - SN SciGraph project
69 rdf:type schema:Organization
70 N225d33605bca4dbbb21999681a846c02 schema:affiliation grid-institutes:grid.412022.7
71 schema:familyName Xiuwei Lv
72 rdf:type schema:Person
73 N31da00420e3a404eba53a51eace65d39 schema:volumeNumber 64
74 rdf:type schema:PublicationVolume
75 N369bc312beac428099e3f57d75530a97 rdf:first Na9554286fad74d52b38e0325fd6c8f32
76 rdf:rest Nef790b74bbca46968a5a65cf77b369a3
77 N3e1363f638b849059126584f03cc235c schema:affiliation grid-institutes:grid.412022.7
78 schema:familyName Huang
79 schema:givenName Pei
80 rdf:type schema:Person
81 N4e092795f4904a84b06556c447ef1acc schema:affiliation grid-institutes:grid.412022.7
82 schema:familyName Wang
83 schema:givenName Xiaodong
84 rdf:type schema:Person
85 N698b407d811f483f98ea8d52844f3a10 rdf:first N225d33605bca4dbbb21999681a846c02
86 rdf:rest N369bc312beac428099e3f57d75530a97
87 Na9554286fad74d52b38e0325fd6c8f32 schema:affiliation grid-institutes:grid.412022.7
88 schema:familyName Yv
89 schema:givenName Juan
90 rdf:type schema:Person
91 Nb18c70d3693a490193996bf004fac86f schema:name dimensions_id
92 schema:value pub.1145408376
93 rdf:type schema:PropertyValue
94 Nca0db9e4cc954f4e98c1436834f5e04e schema:name doi
95 schema:value 10.1134/s1560090422020063
96 rdf:type schema:PropertyValue
97 Nd2f01b1e34724847b9678b244952b248 schema:issueNumber 2
98 rdf:type schema:PublicationIssue
99 Nef790b74bbca46968a5a65cf77b369a3 rdf:first N4e092795f4904a84b06556c447ef1acc
100 rdf:rest N04cf2f242f13494b85998968513c48d7
101 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
102 schema:name Engineering
103 rdf:type schema:DefinedTerm
104 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
105 schema:name Materials Engineering
106 rdf:type schema:DefinedTerm
107 sg:journal.1400109 schema:issn 0965-545X
108 1023-3091
109 schema:name Polymer Science, Series B
110 schema:publisher Pleiades Publishing
111 rdf:type schema:Periodical
112 sg:pub.10.1007/s10118-021-2514-2 schema:sameAs https://app.dimensions.ai/details/publication/pub.1132620456
113 https://doi.org/10.1007/s10118-021-2514-2
114 rdf:type schema:CreativeWork
115 sg:pub.10.1007/s10854-019-01839-3 schema:sameAs https://app.dimensions.ai/details/publication/pub.1119866213
116 https://doi.org/10.1007/s10854-019-01839-3
117 rdf:type schema:CreativeWork
118 sg:pub.10.1007/s11249-011-9892-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1003831283
119 https://doi.org/10.1007/s11249-011-9892-5
120 rdf:type schema:CreativeWork
121 grid-institutes:grid.412022.7 schema:alternateName Nanjing Tech University, 211816, Nanjing, China
122 schema:name Nanjing Tech University, 211816, Nanjing, China
123 rdf:type schema:Organization
 




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