Structural Strength and Temperature Condition of Multi-Chip Modules View Full Text


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Article Info

DATE

2018-11

AUTHORS

A. I. Pogalov, G. A. Blinov, E. Yu. Chugunov

ABSTRACT

The general principles of designing three-dimensional multichip modules are presented. The multichip modules are simulated and the effect of the design variables on the strength and temperature condition of the products is studied. The values of thermomechanical stresses, heat resistance, and overheating temperatures of the materials are determined, and the heat removal efficiency in various structural variations of three-dimensional modules is also found. Methods for providing an intensive heat transfer in the structures of the modules and increasing the strength consistency of the products are developed. Recommendations on the design of multichip modules are given. More... »

PAGES

460-464

Identifiers

URI

http://scigraph.springernature.com/pub.10.1134/s1063739718070090

DOI

http://dx.doi.org/10.1134/s1063739718070090

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1112738181


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