Interaction between copper and gallium View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2008-12

AUTHORS

A. I. Ancharov, T. F. Grigoryeva, A. P. Barinova, V. V. Boldyrev

ABSTRACT

The interaction between solid copper and liquid gallium is considered, which is the main process during the setting of diffusion-solidifying solders. The dependences of the process rate and the size characteristics on the phase composition of the initial mixture are found. The intermetallic compound CuGa2 is shown to be the product of the interaction in all cases. More... »

PAGES

475-479

Identifiers

URI

http://scigraph.springernature.com/pub.10.1134/s0036029508060049

DOI

http://dx.doi.org/10.1134/s0036029508060049

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1018519689


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