Resolution enhancement using plasmonic metamask for wafer-scale photolithography in the far field View Full Text


Ontology type: schema:ScholarlyArticle      Open Access: True


Article Info

DATE

2016-09

AUTHORS

Seunghwa Baek, Gumin Kang, Min Kang, Chang-Won Lee, Kyoungsik Kim

ABSTRACT

Resolution enhancement in far-field photolithography is demonstrated using a plasmonic metamask in the proximity regime, in which Fresnel diffraction is dominant. The transverse magnetic component of the diffracted wave from the photomask, which reduces the pattern visibility and lowers the resolution, was successfully controlled by coupling with the anti-symmetric mode of the excited surface plasmon. We obtained a consistently finely-patterned photoresist surface at a distance of up to 15 μm from the mask surface for 3-μm-pitch slits because of conserved field visibility when propagating from the near-field to the proximity regime. We confirmed that sharp edge patterning is indeed possible when using a wafer-scale photomask in the proximity photolithography regime. Our plasmonic metamask method produces cost savings for ultra-large-scale high-density display fabrication by maintaining longer photomask lifetimes and by allowing sufficient tolerance for the distance between the photomask and the photoresist. More... »

PAGES

30476

References to SciGraph publications

Identifiers

URI

http://scigraph.springernature.com/pub.10.1038/srep30476

DOI

http://dx.doi.org/10.1038/srep30476

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1002861558

PUBMED

https://www.ncbi.nlm.nih.gov/pubmed/27457127


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