Corrosion Behavior of Ultra Fine Grain Copper Produced by Accumulative Roll Bonding Process View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2014-02

AUTHORS

A. Nikfahm, I. Danaee, A. Ashrafi, M. R. Toroghinejad

ABSTRACT

In this study the effect of microstructure changes on the corrosion behavior of pure tough pitch copper in 3.5 % NaCl solution with pH = 5.5 at ambient temperature was studied. Accumulative roll bonding process as severe plastic deformation was applied up to 8 cycles to produce the ultrafine grain copper. For corrosion resistance investigations, the polarization and electrochemical impedance spectroscopy was used. Corrosion morphologies analyzed by FE-SEM microscopy after polarization and immersion tests. Results show the minimum corrosion resistance for cycle 2 and maximum corrosion resistance for cycle 8. Corrosion rate of copper decreased after it was rolled for forth time. The corrosion degradation in cycle 8 was uniform and it was intergranular for sample of cycle 2 and unrolled counterpart. The higher corrosion rate in cycle 2 was attributed to unstable microstructure and the uniform corrosion of cycle 8 was due to ultra fine grain formation. More... »

PAGES

115-121

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Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s12666-013-0323-1

DOI

http://dx.doi.org/10.1007/s12666-013-0323-1

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https://app.dimensions.ai/details/publication/pub.1028958939


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