Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2019-03-14

AUTHORS

Seok-Bon Koo, Chang-Myeon Lee, Sang-Jun Kwon, Jun-Mi Jeon, Jin-young Hur, Hong-Kee Lee

ABSTRACT

Unfortunately, the acknowledgements were missing in the original version of this article. The information is given below:

PAGES

1-1

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s12540-019-00240-3

DOI

http://dx.doi.org/10.1007/s12540-019-00240-3

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1112766696


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