Ontology type: schema:ScholarlyArticle
2015-05
AUTHORSSun-Ah Park, Seon-Hong Kim, Yun-Ha Yoo, Jung-Gu Kim
ABSTRACTThe influence of the addition of HCl on the corrosion behavior of low-alloy steel containing copper and antimony was investigated using electrochemical (potentiodynamic and potentiostatic polarization tests, and electrochemical impedance spectroscopy) and weight loss tests in a 1.6M H2SO4 solution with different concentrations of hydrochloric acid (0.00, 0.08, 0.15 and 0.20 M HCl) at 60 °C. The result showed that the corrosion rate decreased with increasing HCl by the formation of protective layers. SEM, EDS and XPS examinations of the corroded surfaces after the immersion test indicated that the corrosion production layer formed in the solution containing HCl was highly comprised of metallic Cu, Cu chloride and metallic (Fe, Cu, Sb) compounds. The corrosion resistance was improved by the Cu-enriched layer, in which chloride ions are an accelerator for cupric ion reduction during copper deposition. Furthermore, cuprous and antimonious chloride species are complex salts for cuprous ions adsorbed on the surface during copper deposition. More... »
PAGES470-478
http://scigraph.springernature.com/pub.10.1007/s12540-015-4421-y
DOIhttp://dx.doi.org/10.1007/s12540-015-4421-y
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