Microstructural characterization and properties of Al/Cu/steel diffusion bonded joints View Full Text


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Article Info

DATE

2010-08-26

AUTHORS

Xiaole Cheng, Yimin Gao, Hanguang Fu, Jiandong Xing, Bingzhe Bai

ABSTRACT

We prepared Al/Cu/steel composite with a gradient structure using a vacuum hot-pressed diffusion method and investigated the Al/Cu/steel interface. The results show that a supersaturated solid solution with a thickness of about 2 um formed in the Cu/steel diffusion zone. Two kinds of intermetallic compounds, Cu9Al4 adjacent to the Cu side and CuAl2 adjacent to the Al side, formed at the interface of the Al/Cu. The thickness of the intermetallic compound layer appeared to greatly affect conductivity and tensile strength. The conductivity and the tensile strength decreased from 36.9 MS/m to 24.2 MS/m, and from 70.9MPa to 40.7MPa, respectively, while the thickness increased from 3.5 um to 23 um. The fractures occurred between a supersaturated solid solution (Al in Cu) and Cu9Al4, or between Cu9Al4 and CuAl2. More... »

PAGES

649-655

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s12540-010-0820-2

DOI

http://dx.doi.org/10.1007/s12540-010-0820-2

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1005786839


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