A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging View Full Text


Ontology type: schema:ScholarlyArticle      Open Access: True


Article Info

DATE

2008-06

AUTHORS

D. C. Lin, R. Kovacevic, T. S. Srivatsan, G. X. Wang

ABSTRACT

This paper highlights the interfacial structure of tin-silver (Sn-3·5Ag) solder on nickel-coated copper pads during aging performance studies at a temperature of 150°C for up to 96 h. Experimental results revealed the as-solidified solder bump made from using the lead-free solder (Sn-3·5Ag) exhibited or showed a thin layer of the tin-nickel-copper intermetallic compound (IMC) at the solder/substrate interface. This includes a sub-layer having a planar structure immediately adjacent to the Ni-coating and a blocky structure on the inside of the solder. Aging performance studies revealed the thickness of both the IMC layer and the sub-layer, having a planar structure, to increase with an increase in aging time. The observed increase was essentially non-linear. Fine microscopic cracks were observed to occur at the interfaces of the planar sub-layer and the block sub-layer. More... »

PAGES

251-259

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s12046-008-0018-1

DOI

http://dx.doi.org/10.1007/s12046-008-0018-1

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1026305182


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