Role of an interface crack for the blistering mode of a stiff film on a compliant substrate View Full Text


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Article Info

DATE

2021-11-16

AUTHORS

Peixia Gu, Xuejun Chen

ABSTRACT

A stiff thin film deposited over an underlying compliant substrate is susceptible to blistering when it is subjected to excessive in-plane compressive stresses. Two kinds of blistering modes (wrinkling and buckling) have been revealed in experiments, depending on the properties of film/substrate pair as well as that of interface adhesion. The purpose of this work is to quantify the role of an interface crack for the selection of such blistering modes in compressed thin films. By a semi-analytical approach, the transitional size of an interface crack is identified at which both wrinkling mode and buckling mode may arise. The mode selection diagram is constructed and characterized with respect to the normalized interface crack size and compressive strain. The theoretical estimations are validated by a finite element method incorporating an interface cohesive zone model and are demonstrated to be in reasonable agreement with experimental observations in previous literature. The results in this work are expected to be helpful in the effective design and evaluation of thin-film devices. More... »

PAGES

661-669

References to SciGraph publications

  • 2017-09-14. Micromechanics of substrate-supported thin films in ACTA MECHANICA SINICA
  • 2000-07. Buckling and cracking of thin films on compliant substrates under compression in INTERNATIONAL JOURNAL OF FRACTURE
  • 2017-04-03. Controlled wrinkling analysis of thin films on gradient substrates in APPLIED MATHEMATICS AND MECHANICS
  • 2002-01. Influence of substrate compliance on buckling delamination of thin films in INTERNATIONAL JOURNAL OF FRACTURE
  • Identifiers

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    http://scigraph.springernature.com/pub.10.1007/s11998-021-00556-z

    DOI

    http://dx.doi.org/10.1007/s11998-021-00556-z

    DIMENSIONS

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