Lead-free solders with rare earth additions View Full Text


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Article Info

DATE

2009-06-10

AUTHORS

Fu Guo, Mengke Zhao, Zhidong Xia, Yongping Lei, Xiaoyan Li, Yaowu Shi

ABSTRACT

AbstactThere have been significant research efforts to improve the properties of globally recognized lead-free solders, such as Sn-Ag-Cu, Sn-Cu, Sn-Bi, etc. Rare earth (RE) elements have been selected in the current research to be added into lead-free solders as alloying elements in an effort to improve the comprehensive properties, such as wettability, microstructural stability, creep resistance, and mechanical strength and integrity of the solders. This article overviews the background and rationale for the alloy development, the fabrication techniques for RE-containing solders, the roles of RE elements, as well as current status of RE-containing solder research. Examples of several representative RE-containing solders are introduced. The effects of RE element addition on the wetting behavior, microstructure, and mechanical properties of certain lead-free solder alloys are presented and analyzed. More... »

PAGES

39-44

References to SciGraph publications

  • 2004-09. Constitutive relations on creep for SnAgCuRE lead-free solder joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-02-26. Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple in JOURNAL OF MATERIALS SCIENCE
  • 2003-12. Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-05. Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-10. Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-12. Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-01. Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-09. The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements in JOURNAL OF ELECTRONIC MATERIALS
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  • 2007-10-02. Foreword in JOURNAL OF ELECTRONIC MATERIALS
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  • 2007-06-19. Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions in JOURNAL OF ELECTRONIC MATERIALS
  • 2003-04. Properties of lead-free solder SnAgCu containing minute amounts of rare earth in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-12-04. Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2008-09-27. Size Effect of Rare-Earth Intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce Solders on the Growth of Tin Whiskers in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2005-03. Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-09-12. Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-04-21. Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2008-06-28. Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-09. Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-09-16. Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-06. Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-04-18. Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-06. Novel rare-earth-containing lead-free solders with enhanced ductility in JOM
  • 2008-04-23. Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls in JOURNAL OF ELECTRONIC MATERIALS
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    URI

    http://scigraph.springernature.com/pub.10.1007/s11837-009-0086-7

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    http://dx.doi.org/10.1007/s11837-009-0086-7

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    31 schema:description AbstactThere have been significant research efforts to improve the properties of globally recognized lead-free solders, such as Sn-Ag-Cu, Sn-Cu, Sn-Bi, etc. Rare earth (RE) elements have been selected in the current research to be added into lead-free solders as alloying elements in an effort to improve the comprehensive properties, such as wettability, microstructural stability, creep resistance, and mechanical strength and integrity of the solders. This article overviews the background and rationale for the alloy development, the fabrication techniques for RE-containing solders, the roles of RE elements, as well as current status of RE-containing solder research. Examples of several representative RE-containing solders are introduced. The effects of RE element addition on the wetting behavior, microstructure, and mechanical properties of certain lead-free solder alloys are presented and analyzed.
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    70 mechanical properties
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    72 microstructural stability
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