Erratum to: The 2016 Thermal Spray Roadmap View Full Text


Ontology type: schema:ScholarlyArticle     


Journal

TITLE

Journal of Thermal Spray Technology

ISSUE

5

VOLUME

26

Author Affiliations

  • University of Limoges, Limoges, France
  • Concordia University, Montreal, QC, Canada
  • National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Japan
  • University of Alberta, Edmonton, AB, Canada
  • Swinburne University of Technology, Hawthorn, VIC, Australia
  • Soleras Advanced Coatings, Deinze, Belgium
  • University of Sherbrooke, Sherbrooke, Canada
  • Mesoscribe Technologies, Inc., St. James, NY, USA
  • Columbia University, New York, NY, USA
  • Oerlikon Metco, Inc., Westbury, NY, USA
  • The Pennsylvania State University, State College, PA, USA
  • Alberta Innovates - Technology Futures, Edmonton, AB, Canada
  • Helmut Schmidt University, Hamburg, Germany
  • Oerlikon Metco AG, Wohlen, Switzerland
  • German Aerospace Center (DLR), Stuttgart, Germany
  • University of Auckland, Auckland, New Zealand
  • National Research Council of Canada, Boucherville, QC, Canada
  • Department of Mechanical Engineering, University of Ottawa, Ottawa, ON, Canada
  • University of Connecticut, Storrs, CT, USA
  • Nanyang Technological University, Singapore, Singapore
  • Universität Stuttgart, Stuttgart, Germany
  • GE Power, Niskayuna, NY, USA
  • Xi’an Jiaotong University, Xi’an, Shaanxi, China
  • Praxair Surface Technologies, Inc., Indianapolis, IN, USA
  • Stony Brook University, Stony Brook, NY, USA
  • University West, Trollhättan, Sweden
  • Fraunhofer UMSICHT, Sulzbach-Rosenberg, Germany
  • Institute of Plasma Physics, Prague, Czech Republic
  • Forschungszentrum Jülich Institute of Energy and Climate Research, Jülich, Germany
  • University of Toronto, Toronto, ON, Canada
  • Sandia National Laboratories, Albuquerque, NM, USA
  • Fraunhofer Institute for Material and Beam Technology IWS, Dresden, Germany
  • University of Massachusetts Lowell, Lowell, MA, USA
  • Tampere University of Technology, Tampere, Finland
  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11666-017-0560-7

    DOI

    http://dx.doi.org/10.1007/s11666-017-0560-7

    DIMENSIONS

    https://app.dimensions.ai/details/publication/pub.1085399075


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