Cold Spray Deposition of Copper Electrodes on Silicon and Glass Substrates View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2013-10

AUTHORS

Do-Yeon Kim, Jung-Jae Park, Jong-Gun Lee, Donghwan Kim, Sung Ju Tark, Sejin Ahn, Jae Ho Yun, Jihye Gwak, Kyung Hoon Yoon, Sanjeev Chandra, Sam S. Yoon

ABSTRACT

Copper lines with widths varying from 150 to 1500 μm were deposited onto crystalline silicon wafers and soda-lime glass plates by cold spraying copper particles with 1 μm average diameter through a mask. This direct deposition method yielded high-aspect-ratio electrodes with minimum shadowing effects and maximum electrode-to-silicon contact area. The copper lines had triangular cross sections with aspect ratios (height/width) ranging from 0.1 to 1.1, depending on the number of spray gun passes. Copper particles were densely packed with increasing the width of the masking slit. This study presents the potential use of the cold spray technology in printing lines as front electrodes in solar cell applications. More... »

PAGES

1092-1102

References to SciGraph publications

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  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11666-013-9953-4

    DOI

    http://dx.doi.org/10.1007/s11666-013-9953-4

    DIMENSIONS

    https://app.dimensions.ai/details/publication/pub.1003680375


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