Microstructure of Interfacial Region Between Cold-Sprayed Copper Coating and AlN Substrate Coated with Sputtered Titanium and Copper View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2011-03

AUTHORS

Hiromi Nakano, Motohiro Yamada, Masahiro Fukumoto, Eiji Yamaguchi

ABSTRACT

Cold spraying has been developed as a high-quality coating technique. In this article, copper is deposited on an AlN substrate coated by the sputtering of titanium and copper at a low pressure of less than 1.0 MPa, making this approach suitable for a wide range of engineering applications. In order to understand the adhesion mechanism at the atomic scale, the interfacial regions are carefully observed in thin foil samples from the cross sections of the specimens with a HREM. We find a unique wavy boundary between the sputtered titanium and the sputtered copper. It is assumed that the shear-instability phenomenon occurs due to the cold-spraying process and influences the adhesive strength. Furthermore, the cold-sprayed copper particles are connected directly without any oxidation layer due to the appearance of new metallic surfaces during the impact process. The TEM data clearly reveal the phenomena and mechanisms related to the impact of powder sprayed on the substrate. More... »

PAGES

407-411

References to SciGraph publications

  • 2008-12. Characterization of Low-Pressure Cold-Sprayed Aluminum Coatings in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 1999-12. Impact of high velocity cold spray particles in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • Journal

    TITLE

    Journal of Thermal Spray Technology

    ISSUE

    3

    VOLUME

    20

    Related Patents

    Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11666-010-9522-z

    DOI

    http://dx.doi.org/10.1007/s11666-010-9522-z

    DIMENSIONS

    https://app.dimensions.ai/details/publication/pub.1029368335


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