Study of Substrate Preheating on Flattening Behavior of Thermal-Sprayed Copper Particles View Full Text


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Article Info

DATE

2010-12

AUTHORS

K. Yang, M. Fukumoto, T. Yasui, M. Yamada

ABSTRACT

In this study, the effect of substrate preheating on flattening behavior of thermal-sprayed particles was systematically investigated. A part of mirror-polished AISI304 substrates were preheated to 573 and 773 K for 10 min, and then exposed to an air atmosphere for different durations of up to 48 h, respectively. Contact angle of water droplet was measured on the substrate under designated conditions. It was found that the contact angle increased gradually with the increase of substrate duration after preheating. Moreover, smaller contact angle was maintained on the substrate with higher preheating temperature. Commercially available Cu powders were thermally sprayed onto the substrates with the same thermal treatment history as contact angle measurement using atmospheric plasma-spray technique. The splat shape had a transitional changing tendency from a splash splat to a disk one on the substrate with a short duration after preheating, while reappearance of splash splat with the increase of duration was confirmed. In general, wetting of substrate surface by molten particles may dominate the flattening behavior of thermal-sprayed particles. The occurrence of desorption of adsorbed gas/condensation caused by substrate preheating likely provides good wetting. On the other hand, the poor wetting may be attributed to the re-adsorption of gas/condensation on the substrate surface with the increase of duration. In addition, the shear adhesion strength of coating fabricated on blasted AISI304 substrate was enhanced on the once-heated substrate, but weakened with the increase of duration. The changing tendency of the coating adhesion strength and the wetting of substrate by droplet corresponded quite well with each other. More... »

PAGES

1195-1205

References to SciGraph publications

  • 1999-03. Flattening of droplets and formation of splats in thermal spraying: A review of recent work—Part 1 in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2010-01. The Role of Substrate Surface Chemistry on Splat Formation During Plasma Spray Deposition by Experiments and Simulations in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2009-06. Formation of Solid Splats During Thermal Spray Deposition in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 1995-03. Effects of vacuum plasma spray processing parameters on splat morphology in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2009-12. Effect of Ambient Pressure on Flattening Behavior of Thermal Sprayed Particles in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 1995-03. Influence of substrate preparation on the flattening and cooling of plasma-sprayed particles in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2004-09. Knowledge concerning splat formation: An invited review in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 1995-03. Comparison of plasma-sprayed alumina coatings by RF and DC plasma spraying in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 1995-03. Influence of particle parameters at impact on splat formation and solidification in plasma spraying processes in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2007-06. Effect of Droplet Characteristics and Substrate Surface Topography on the Final Morphology of Plasma-Sprayed Zirconia Single Splats in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2006-12. Influence of surface character change of substrate due to heating on flattening behavior of thermal sprayed particles in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2010-01. Deposition Behavior of Copper Fine Particles onto Flat Substrate Surface in Cold Spraying in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2003-09. Effect of substrate temperature on adhesion strength of plasma-sprayed nickel coatings in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2007-12. Splash Splat to Disk Splat Transition Behavior in Plasma-Sprayed Metallic Materials in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2008-12. On the Role of Bubbles in Metallic Splat Nanopores and Adhesion in JOURNAL OF THERMAL SPRAY TECHNOLOGY
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    http://scigraph.springernature.com/pub.10.1007/s11666-010-9515-y

    DOI

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