Room Temperature Impact Consolidation (RTIC) of Fine Ceramic Powder by Aerosol Deposition Method and Applications to Microdevices View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2008-06

AUTHORS

Jun Akedo

ABSTRACT

Ceramic integration technology requires downsizing and/or improvement of device performance in many applications, such as in the fabrication of microelectromechanical systems, display devises, fuel cells, optical devices, and RF components. For these applications, realization of high-speed deposition rate, low process temperature, and fine patterning in ceramic coating are very important. The aerosol deposition (AD) method has many advantages for above requirements in comparison with conventional thin-film method or thermal spray coating technology. In this article, advantages of the AD method are highlighted by realizing a comparison with conventional thin-film methods and thermal spray technology. Challenges associated with AD method are also highlighted. At the end, examples of integration of AD method in the fabrication of electronic components are also given to show the easiness in usage and in integration of this method in the device process flow. More... »

PAGES

181-198

References to SciGraph publications

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11666-008-9163-7

DOI

http://dx.doi.org/10.1007/s11666-008-9163-7

DIMENSIONS

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