Processing, As-Cast Microstructure and Wear Characteristics of a Monotectic Al-Bi-Cu Alloy View Full Text


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Article Info

DATE

2019-02

AUTHORS

Rodrigo V. Reyes, Vitor E. Pinotti, Conrado R. M. Afonso, Luiz C. Casteletti, Amauri Garcia, José E. Spinelli

ABSTRACT

Ternary Al-based monotectic alloys have a good combination of wear resistance and mechanical strength. While self-lubricating soft elements guarantee an adequate wear resistance, the modification with third elements can increase the ability to support load. In the present investigation, a collection of microstructures is generated through transient directional solidification of the Al-3.2wt.%Bi-3.0wt.%Cu alloy. Samples with different Bi spacing have been subjected to micro-adhesive wear ball tests. A relationship linking the wear volume, V, the microstructural spacing and the test time is proposed for Bi spacing higher than 16 μm, according to which V decreases with the decrease in Bi spacing. It is observed that wider and deeper grooves emerged on the surface of the samples related to more refined Bi and Al2Cu phases, that is, associated with Bi spacing and Bi diameter lower than 16 and 2.4 μm, respectively. A reverse trend is noted for these finer microstructures, for which V increases with further decrease in Bi spacing. This can be caused by the detachment of the very fine and less cohesive Al2Cu lamellas as the Al2O3 oxide breaks up forming debris, with the presence of these lamellas as loose debris at the interface acting as third-body abrasives. More... »

PAGES

1-12

References to SciGraph publications

  • 2010-06. Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn–Cu hypereutectic alloy in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-07. Inter-relation of Microstructural Features and Dry Sliding Wear Behavior of Monotectic Al–Bi and Al–Pb Alloys in TRIBOLOGY LETTERS
  • 2018-07. Improvement of Microstructure and Wear Property of Al–Bi Alloys by Nd Addition in JOM
  • 2018-11. High-Efficiency Inhibition of Gravity Segregation in Al–Bi Immiscible Alloys by Adding Lanthanum in METALS AND MATERIALS INTERNATIONAL
  • 2009-01. Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-04. Dendritic Arm Spacing Affecting Mechanical Properties and Wear Behavior of Al-Sn and Al-Si Alloys Directionally Solidified under Unsteady-State Conditions in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2014-01. Corrosion Performance Based on the Microstructural Array of Al-Based Monotectic Alloys in a NaCl Solution in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 1984-06. The solidification of monotectic alloys—Microstructures and phase spacings in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2015-05. Three dimensional microstructures and wear resistance of Al-Bi immiscible alloys with different grain refiners in SCIENCE CHINA TECHNOLOGICAL SCIENCES
  • 2010-02. The correlation between dendritic microstructure and mechanical properties of directionally solidified hypoeutectic Al-Ni alloys in METALS AND MATERIALS INTERNATIONAL
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    http://scigraph.springernature.com/pub.10.1007/s11665-018-3851-3

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    http://dx.doi.org/10.1007/s11665-018-3851-3

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    39 schema:description Ternary Al-based monotectic alloys have a good combination of wear resistance and mechanical strength. While self-lubricating soft elements guarantee an adequate wear resistance, the modification with third elements can increase the ability to support load. In the present investigation, a collection of microstructures is generated through transient directional solidification of the Al-3.2wt.%Bi-3.0wt.%Cu alloy. Samples with different Bi spacing have been subjected to micro-adhesive wear ball tests. A relationship linking the wear volume, V, the microstructural spacing and the test time is proposed for Bi spacing higher than 16 μm, according to which V decreases with the decrease in Bi spacing. It is observed that wider and deeper grooves emerged on the surface of the samples related to more refined Bi and Al2Cu phases, that is, associated with Bi spacing and Bi diameter lower than 16 and 2.4 μm, respectively. A reverse trend is noted for these finer microstructures, for which V increases with further decrease in Bi spacing. This can be caused by the detachment of the very fine and less cohesive Al2Cu lamellas as the Al2O3 oxide breaks up forming debris, with the presence of these lamellas as loose debris at the interface acting as third-body abrasives.
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