Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2009-07-31

AUTHORS

Guangchen Xu, Fu Guo, Zhidong Xia, Yongping Lei, Yaowu Shi, Xiaoyan Li

ABSTRACT

The trend of miniaturization of electronic products induced the shrinking dimension of interconnects in the chip. When those interconnects are subjected to high current density (usually 103 to 104 A/cm2), electromigration (EM) could affect the reliability of the chip which would ultimately break the circuit. In this study, eutectic SnPb solders with thickness of 280, 128, and 50 μm were investigated under high current density (104 A/cm2) and high ambient temperature (120 °C). The EM-induced surface undulations were more prominent at the shorter thickness, demonstrating that the diffusion of metal atoms/ions was controlled by the actual temperature in the bulk solder instead of the back stress. Bamboo groove features were observed on the surface of solder extrusion at the anode side for the three solder thickness, which indicated the metal atoms/ions that migrated parallel to the direction of flow of electrons. More... »

PAGES

616-622

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11665-009-9519-2

DOI

http://dx.doi.org/10.1007/s11665-009-9519-2

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1044133055


Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
Incoming Citations Browse incoming citations for this publication using opencitations.net

JSON-LD is the canonical representation for SciGraph data.

TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Xu", 
        "givenName": "Guangchen", 
        "id": "sg:person.016646463677.54", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016646463677.54"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Guo", 
        "givenName": "Fu", 
        "id": "sg:person.014627203474.59", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014627203474.59"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Xia", 
        "givenName": "Zhidong", 
        "id": "sg:person.016447555263.38", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016447555263.38"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Lei", 
        "givenName": "Yongping", 
        "id": "sg:person.012521025203.12", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Shi", 
        "givenName": "Yaowu", 
        "id": "sg:person.010147557037.66", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010147557037.66"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Li", 
        "givenName": "Xiaoyan", 
        "id": "sg:person.014361463331.82", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014361463331.82"
        ], 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1007/s10854-006-9024-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1000687827", 
          "https://doi.org/10.1007/s10854-006-9024-4"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-007-0232-3", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1025236902", 
          "https://doi.org/10.1007/s11664-007-0232-3"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-005-0207-1", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1001714776", 
          "https://doi.org/10.1007/s11664-005-0207-1"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10854-007-9263-z", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1007585514", 
          "https://doi.org/10.1007/s10854-007-9263-z"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-006-0157-2", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1027472130", 
          "https://doi.org/10.1007/s11664-006-0157-2"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-006-0325-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1016506950", 
          "https://doi.org/10.1007/s11664-006-0325-4"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1557/jmr.2007.0074", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1038185295", 
          "https://doi.org/10.1557/jmr.2007.0074"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2009-07-31", 
    "datePublishedReg": "2009-07-31", 
    "description": "The trend of miniaturization of electronic products induced the shrinking dimension of interconnects in the chip. When those interconnects are subjected to high current density (usually 103 to 104\u00a0A/cm2), electromigration (EM) could affect the reliability of the chip which would ultimately break the circuit. In this study, eutectic SnPb solders with thickness of 280, 128, and 50\u00a0\u03bcm were investigated under high current density (104\u00a0A/cm2) and high ambient temperature (120\u00a0\u00b0C). The EM-induced surface undulations were more prominent at the shorter thickness, demonstrating that the diffusion of metal atoms/ions was controlled by the actual temperature in the bulk solder instead of the back stress. Bamboo groove features were observed on the surface of solder extrusion at the anode side for the three solder thickness, which indicated the metal atoms/ions that migrated parallel to the direction of flow of electrons.", 
    "genre": "article", 
    "id": "sg:pub.10.1007/s11665-009-9519-2", 
    "inLanguage": "en", 
    "isAccessibleForFree": false, 
    "isPartOf": [
      {
        "id": "sg:journal.1042007", 
        "issn": [
          "1059-9495", 
          "1544-1024"
        ], 
        "name": "Journal of Materials Engineering and Performance", 
        "publisher": "Springer Nature", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "5", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "19"
      }
    ], 
    "keywords": [
      "high current density", 
      "solder thickness", 
      "current density", 
      "trend of miniaturization", 
      "dimensions of interconnects", 
      "eutectic SnPb solder", 
      "solder extrusion", 
      "bulk solder", 
      "SnPb solder", 
      "short thickness", 
      "back stress", 
      "direction of flow", 
      "anode side", 
      "surface undulations", 
      "electronic products", 
      "actual temperature", 
      "reaction couples", 
      "solder", 
      "groove features", 
      "electromigration behavior", 
      "thickness", 
      "ambient temperature", 
      "high ambient temperature", 
      "atoms/ions", 
      "interconnects", 
      "electromigration", 
      "chip", 
      "temperature", 
      "miniaturization", 
      "density", 
      "extrusion", 
      "flow", 
      "undulations", 
      "surface", 
      "diffusion", 
      "circuit", 
      "stress", 
      "reliability", 
      "behavior", 
      "direction", 
      "metal atoms/ions", 
      "ions", 
      "side", 
      "electrons", 
      "products", 
      "parallel", 
      "dimensions", 
      "effect", 
      "features", 
      "trends", 
      "couples", 
      "study", 
      "EM-induced surface undulations", 
      "Bamboo groove features", 
      "Eutectic SnPb Solder Reaction Couples", 
      "SnPb Solder Reaction Couples", 
      "Solder Reaction Couples"
    ], 
    "name": "Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples", 
    "pagination": "616-622", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1044133055"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/s11665-009-9519-2"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/s11665-009-9519-2", 
      "https://app.dimensions.ai/details/publication/pub.1044133055"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2021-12-01T19:21", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-springernature-scigraph/baseset/20211201/entities/gbq_results/article/article_489.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://doi.org/10.1007/s11665-009-9519-2"
  }
]
 

Download the RDF metadata as:  json-ld nt turtle xml License info

HOW TO GET THIS DATA PROGRAMMATICALLY:

JSON-LD is a popular format for linked data which is fully compatible with JSON.

curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s11665-009-9519-2'

N-Triples is a line-based linked data format ideal for batch operations.

curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s11665-009-9519-2'

Turtle is a human-readable linked data format.

curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s11665-009-9519-2'

RDF/XML is a standard XML format for linked data.

curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s11665-009-9519-2'


 

This table displays all metadata directly associated to this object as RDF triples.

178 TRIPLES      22 PREDICATES      89 URIs      74 LITERALS      6 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/s11665-009-9519-2 schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author Naba5e6fd2a924e2493ed586a6282fc59
4 schema:citation sg:pub.10.1007/s10854-006-9024-4
5 sg:pub.10.1007/s10854-007-9263-z
6 sg:pub.10.1007/s11664-005-0207-1
7 sg:pub.10.1007/s11664-006-0157-2
8 sg:pub.10.1007/s11664-006-0325-4
9 sg:pub.10.1007/s11664-007-0232-3
10 sg:pub.10.1557/jmr.2007.0074
11 schema:datePublished 2009-07-31
12 schema:datePublishedReg 2009-07-31
13 schema:description The trend of miniaturization of electronic products induced the shrinking dimension of interconnects in the chip. When those interconnects are subjected to high current density (usually 103 to 104 A/cm2), electromigration (EM) could affect the reliability of the chip which would ultimately break the circuit. In this study, eutectic SnPb solders with thickness of 280, 128, and 50 μm were investigated under high current density (104 A/cm2) and high ambient temperature (120 °C). The EM-induced surface undulations were more prominent at the shorter thickness, demonstrating that the diffusion of metal atoms/ions was controlled by the actual temperature in the bulk solder instead of the back stress. Bamboo groove features were observed on the surface of solder extrusion at the anode side for the three solder thickness, which indicated the metal atoms/ions that migrated parallel to the direction of flow of electrons.
14 schema:genre article
15 schema:inLanguage en
16 schema:isAccessibleForFree false
17 schema:isPartOf N48f493f94ca840a0976eafb07f64a936
18 Na83917a9022844ea81e4d4cd823daa69
19 sg:journal.1042007
20 schema:keywords Bamboo groove features
21 EM-induced surface undulations
22 Eutectic SnPb Solder Reaction Couples
23 SnPb Solder Reaction Couples
24 SnPb solder
25 Solder Reaction Couples
26 actual temperature
27 ambient temperature
28 anode side
29 atoms/ions
30 back stress
31 behavior
32 bulk solder
33 chip
34 circuit
35 couples
36 current density
37 density
38 diffusion
39 dimensions
40 dimensions of interconnects
41 direction
42 direction of flow
43 effect
44 electromigration
45 electromigration behavior
46 electronic products
47 electrons
48 eutectic SnPb solder
49 extrusion
50 features
51 flow
52 groove features
53 high ambient temperature
54 high current density
55 interconnects
56 ions
57 metal atoms/ions
58 miniaturization
59 parallel
60 products
61 reaction couples
62 reliability
63 short thickness
64 side
65 solder
66 solder extrusion
67 solder thickness
68 stress
69 study
70 surface
71 surface undulations
72 temperature
73 thickness
74 trend of miniaturization
75 trends
76 undulations
77 schema:name Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples
78 schema:pagination 616-622
79 schema:productId N1ae89e29d30a42c5ad1a3b60b0c4b8d5
80 N3ee53bdbf2474950ac832bbfadfa3dcf
81 schema:sameAs https://app.dimensions.ai/details/publication/pub.1044133055
82 https://doi.org/10.1007/s11665-009-9519-2
83 schema:sdDatePublished 2021-12-01T19:21
84 schema:sdLicense https://scigraph.springernature.com/explorer/license/
85 schema:sdPublisher Na9097a9e390349d289515121c37de023
86 schema:url https://doi.org/10.1007/s11665-009-9519-2
87 sgo:license sg:explorer/license/
88 sgo:sdDataset articles
89 rdf:type schema:ScholarlyArticle
90 N1ae89e29d30a42c5ad1a3b60b0c4b8d5 schema:name dimensions_id
91 schema:value pub.1044133055
92 rdf:type schema:PropertyValue
93 N3ee53bdbf2474950ac832bbfadfa3dcf schema:name doi
94 schema:value 10.1007/s11665-009-9519-2
95 rdf:type schema:PropertyValue
96 N48f493f94ca840a0976eafb07f64a936 schema:issueNumber 5
97 rdf:type schema:PublicationIssue
98 N4b83fff7402443ba9a4305691b990aa8 rdf:first sg:person.014627203474.59
99 rdf:rest N60cd8277ee7c4d73b774b6beb68b6b8d
100 N60cd8277ee7c4d73b774b6beb68b6b8d rdf:first sg:person.016447555263.38
101 rdf:rest Ne0ca7873647041809ed9c87ab27d5299
102 N8eaa0daa9f3847749bc1a50ee2eff281 rdf:first sg:person.010147557037.66
103 rdf:rest N92ffb47830ee4502b72c807f3d8f14d1
104 N92ffb47830ee4502b72c807f3d8f14d1 rdf:first sg:person.014361463331.82
105 rdf:rest rdf:nil
106 Na83917a9022844ea81e4d4cd823daa69 schema:volumeNumber 19
107 rdf:type schema:PublicationVolume
108 Na9097a9e390349d289515121c37de023 schema:name Springer Nature - SN SciGraph project
109 rdf:type schema:Organization
110 Naba5e6fd2a924e2493ed586a6282fc59 rdf:first sg:person.016646463677.54
111 rdf:rest N4b83fff7402443ba9a4305691b990aa8
112 Ne0ca7873647041809ed9c87ab27d5299 rdf:first sg:person.012521025203.12
113 rdf:rest N8eaa0daa9f3847749bc1a50ee2eff281
114 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
115 schema:name Engineering
116 rdf:type schema:DefinedTerm
117 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
118 schema:name Materials Engineering
119 rdf:type schema:DefinedTerm
120 sg:journal.1042007 schema:issn 1059-9495
121 1544-1024
122 schema:name Journal of Materials Engineering and Performance
123 schema:publisher Springer Nature
124 rdf:type schema:Periodical
125 sg:person.010147557037.66 schema:affiliation grid-institutes:grid.28703.3e
126 schema:familyName Shi
127 schema:givenName Yaowu
128 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010147557037.66
129 rdf:type schema:Person
130 sg:person.012521025203.12 schema:affiliation grid-institutes:grid.28703.3e
131 schema:familyName Lei
132 schema:givenName Yongping
133 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12
134 rdf:type schema:Person
135 sg:person.014361463331.82 schema:affiliation grid-institutes:grid.28703.3e
136 schema:familyName Li
137 schema:givenName Xiaoyan
138 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014361463331.82
139 rdf:type schema:Person
140 sg:person.014627203474.59 schema:affiliation grid-institutes:grid.28703.3e
141 schema:familyName Guo
142 schema:givenName Fu
143 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014627203474.59
144 rdf:type schema:Person
145 sg:person.016447555263.38 schema:affiliation grid-institutes:grid.28703.3e
146 schema:familyName Xia
147 schema:givenName Zhidong
148 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016447555263.38
149 rdf:type schema:Person
150 sg:person.016646463677.54 schema:affiliation grid-institutes:grid.28703.3e
151 schema:familyName Xu
152 schema:givenName Guangchen
153 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016646463677.54
154 rdf:type schema:Person
155 sg:pub.10.1007/s10854-006-9024-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1000687827
156 https://doi.org/10.1007/s10854-006-9024-4
157 rdf:type schema:CreativeWork
158 sg:pub.10.1007/s10854-007-9263-z schema:sameAs https://app.dimensions.ai/details/publication/pub.1007585514
159 https://doi.org/10.1007/s10854-007-9263-z
160 rdf:type schema:CreativeWork
161 sg:pub.10.1007/s11664-005-0207-1 schema:sameAs https://app.dimensions.ai/details/publication/pub.1001714776
162 https://doi.org/10.1007/s11664-005-0207-1
163 rdf:type schema:CreativeWork
164 sg:pub.10.1007/s11664-006-0157-2 schema:sameAs https://app.dimensions.ai/details/publication/pub.1027472130
165 https://doi.org/10.1007/s11664-006-0157-2
166 rdf:type schema:CreativeWork
167 sg:pub.10.1007/s11664-006-0325-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1016506950
168 https://doi.org/10.1007/s11664-006-0325-4
169 rdf:type schema:CreativeWork
170 sg:pub.10.1007/s11664-007-0232-3 schema:sameAs https://app.dimensions.ai/details/publication/pub.1025236902
171 https://doi.org/10.1007/s11664-007-0232-3
172 rdf:type schema:CreativeWork
173 sg:pub.10.1557/jmr.2007.0074 schema:sameAs https://app.dimensions.ai/details/publication/pub.1038185295
174 https://doi.org/10.1557/jmr.2007.0074
175 rdf:type schema:CreativeWork
176 grid-institutes:grid.28703.3e schema:alternateName College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China
177 schema:name College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, P.R. China
178 rdf:type schema:Organization
 




Preview window. Press ESC to close (or click here)


...