Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and ... View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2019-05

AUTHORS

Izhan Abdullah, Muhammad Nubli Zulkifli, Azman Jalar, Roslina Ismail, Mohd Arrifin Ambak

ABSTRACT

A characterization of mechanical and micromechanical properties of SAC305 solder wire under varied strain rates and temperatures was performed using tensile and nanoindentation tests. The evolution of SAC305 lead-free solder wire grains was compared in samples that were subjected to various strain rates and temperatures using tensile tests based on ASTM E12 standards. Different behaviours of mechanical properties, micromechanical properties, and microstructure evolution of SAC305 solder wire were observed when either temperature or strain rate was held constant and the other varied. Both tensile and nanoindentation tests produced qualitative results, such as dynamic recovery and occurrence of pop-in events, that reflected changes of microstructure. It was observed that some of the mechanical properties of SAC305 solder wire, namely yield strength (YS), ultimate tensile strength (UTS) and Young’s modulus, showed the same trends, but with lower values, compared to micromechanical properties obtained from nanoindentation tests based upon hardness and reduced modulus. Microstructure examination further confirms that the YS, UTS and hardness values increase with more solder wire grain refinement. SAC305 solder wire also maintained an equiaxed structure under various strain rates and temperatures. More... »

PAGES

1-14

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-019-06985-2

DOI

http://dx.doi.org/10.1007/s11664-019-06985-2

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1112023241


Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
Incoming Citations Browse incoming citations for this publication using opencitations.net

JSON-LD is the canonical representation for SciGraph data.

TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "National University of Malaysia", 
          "id": "https://www.grid.ac/institutes/grid.412113.4", 
          "name": [
            "Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, UKM, 43600, Selangor, Malaysia"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Abdullah", 
        "givenName": "Izhan", 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "University of Kuala Lumpur", 
          "id": "https://www.grid.ac/institutes/grid.440439.e", 
          "name": [
            "Universiti Kuala Lumpur (UniKL), British Malaysia Institute (BMI), Electrical Engineering Section, Jalan Sungai Pusu, 53100, Gombak, Selangor, Malaysia"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Zulkifli", 
        "givenName": "Muhammad Nubli", 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "National University of Malaysia", 
          "id": "https://www.grid.ac/institutes/grid.412113.4", 
          "name": [
            "Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, UKM, 43600, Selangor, Malaysia"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Jalar", 
        "givenName": "Azman", 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "University of Malaya", 
          "id": "https://www.grid.ac/institutes/grid.10347.31", 
          "name": [
            "Visual Arts Program, Cultural Centre, University of Malaya, 50603, Kuala Lumpur, Malaysia"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Ismail", 
        "givenName": "Roslina", 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "name": [
            "RedRing Solder (Malaysia) Sdn. Bhd. (RSM), Lot 17486, Jalan Dua, Taman Selayang Baru, 68100, Batu Caves, Selangor, Malaysia"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Ambak", 
        "givenName": "Mohd Arrifin", 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "https://doi.org/10.1088/0022-3727/38/22/018", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1001012568"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1088/0022-3727/38/22/018", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1001012568"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10853-009-3521-9", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1001502506", 
          "https://doi.org/10.1007/s10853-009-3521-9"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s0167-6636(02)00131-x", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1002643672"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s0042-207x(00)00377-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1002998179"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.msea.2011.09.103", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1003240238"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.jallcom.2010.07.160", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1003925274"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10853-008-3125-9", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1010357683", 
          "https://doi.org/10.1007/s10853-008-3125-9"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.jallcom.2007.03.028", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1013286673"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10854-007-9374-6", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1014124275", 
          "https://doi.org/10.1007/s10854-007-9374-6"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.jallcom.2006.08.009", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1014336140"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s0026-2714(99)00061-x", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1017338918"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.matchar.2006.05.013", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1018303048"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-003-0139-6", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1018725238", 
          "https://doi.org/10.1007/s11664-003-0139-6"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-003-0139-6", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1018725238", 
          "https://doi.org/10.1007/s11664-003-0139-6"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1557/jmr.2009.0396", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1018776804"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.msea.2012.10.081", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1020470816"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.msea.2011.01.115", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1021290754"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.actamat.2013.01.019", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1023078253"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11837-009-0036-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1025195205", 
          "https://doi.org/10.1007/s11837-009-0036-4"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11837-009-0036-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1025195205", 
          "https://doi.org/10.1007/s11837-009-0036-4"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.actamat.2009.11.002", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1025273512"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.surfcoat.2005.03.018", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1025478290"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1557/jmr.2009.0085", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1028447469"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s1359-6454(00)00009-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1029489670"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11837-003-0141-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1035800170", 
          "https://doi.org/10.1007/s11837-003-0141-8"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-003-0185-0", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1037854389", 
          "https://doi.org/10.1007/s11664-003-0185-0"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.msea.2016.05.015", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1038194332"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.actamat.2005.08.042", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1040117374"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1557/jmr.2004.19.1.3", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1041295830"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s1359-6462(01)01138-1", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1041574414"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1557/jmr.1992.1564", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1043643805"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-003-0104-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1053216559", 
          "https://doi.org/10.1007/s11664-003-0104-4"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-003-0104-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1053216559", 
          "https://doi.org/10.1007/s11664-003-0104-4"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1115/1.2792681", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1062082039"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1108/ssmt-08-2016-0017", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1084605014"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2019-05", 
    "datePublishedReg": "2019-05-01", 
    "description": "A characterization of mechanical and micromechanical properties of SAC305 solder wire under varied strain rates and temperatures was performed using tensile and nanoindentation tests. The evolution of SAC305 lead-free solder wire grains was compared in samples that were subjected to various strain rates and temperatures using tensile tests based on ASTM E12 standards. Different behaviours of mechanical properties, micromechanical properties, and microstructure evolution of SAC305 solder wire were observed when either temperature or strain rate was held constant and the other varied. Both tensile and nanoindentation tests produced qualitative results, such as dynamic recovery and occurrence of pop-in events, that reflected changes of microstructure. It was observed that some of the mechanical properties of SAC305 solder wire, namely yield strength (YS), ultimate tensile strength (UTS) and Young\u2019s modulus, showed the same trends, but with lower values, compared to micromechanical properties obtained from nanoindentation tests based upon hardness and reduced modulus. Microstructure examination further confirms that the YS, UTS and hardness values increase with more solder wire grain refinement. SAC305 solder wire also maintained an equiaxed structure under various strain rates and temperatures.", 
    "genre": "research_article", 
    "id": "sg:pub.10.1007/s11664-019-06985-2", 
    "inLanguage": [
      "en"
    ], 
    "isAccessibleForFree": false, 
    "isPartOf": [
      {
        "id": "sg:journal.1136213", 
        "issn": [
          "0361-5235", 
          "1543-186X"
        ], 
        "name": "Journal of Electronic Materials", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "5", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "48"
      }
    ], 
    "name": "Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures", 
    "pagination": "1-14", 
    "productId": [
      {
        "name": "readcube_id", 
        "type": "PropertyValue", 
        "value": [
          "8b620005541222545d9760be86ed74b872a45f286291d13f3fdf2ccc1f5068f9"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/s11664-019-06985-2"
        ]
      }, 
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1112023241"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/s11664-019-06985-2", 
      "https://app.dimensions.ai/details/publication/pub.1112023241"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2019-04-11T14:16", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-uberresearch-data-dimensions-target-20181106-alternative/cleanup/v134/2549eaecd7973599484d7c17b260dba0a4ecb94b/merge/v9/a6c9fde33151104705d4d7ff012ea9563521a3ce/jats-lookup/v90/0000000372_0000000372/records_117087_00000003.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://link.springer.com/10.1007%2Fs11664-019-06985-2"
  }
]
 

Download the RDF metadata as:  json-ld nt turtle xml License info

HOW TO GET THIS DATA PROGRAMMATICALLY:

JSON-LD is a popular format for linked data which is fully compatible with JSON.

curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s11664-019-06985-2'

N-Triples is a line-based linked data format ideal for batch operations.

curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s11664-019-06985-2'

Turtle is a human-readable linked data format.

curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s11664-019-06985-2'

RDF/XML is a standard XML format for linked data.

curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s11664-019-06985-2'


 

This table displays all metadata directly associated to this object as RDF triples.

196 TRIPLES      21 PREDICATES      59 URIs      19 LITERALS      7 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/s11664-019-06985-2 schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author Ndac2b953ce654a31a7862d703010465a
4 schema:citation sg:pub.10.1007/s10853-008-3125-9
5 sg:pub.10.1007/s10853-009-3521-9
6 sg:pub.10.1007/s10854-007-9374-6
7 sg:pub.10.1007/s11664-003-0104-4
8 sg:pub.10.1007/s11664-003-0139-6
9 sg:pub.10.1007/s11664-003-0185-0
10 sg:pub.10.1007/s11837-003-0141-8
11 sg:pub.10.1007/s11837-009-0036-4
12 https://doi.org/10.1016/j.actamat.2005.08.042
13 https://doi.org/10.1016/j.actamat.2009.11.002
14 https://doi.org/10.1016/j.actamat.2013.01.019
15 https://doi.org/10.1016/j.jallcom.2006.08.009
16 https://doi.org/10.1016/j.jallcom.2007.03.028
17 https://doi.org/10.1016/j.jallcom.2010.07.160
18 https://doi.org/10.1016/j.matchar.2006.05.013
19 https://doi.org/10.1016/j.msea.2011.01.115
20 https://doi.org/10.1016/j.msea.2011.09.103
21 https://doi.org/10.1016/j.msea.2012.10.081
22 https://doi.org/10.1016/j.msea.2016.05.015
23 https://doi.org/10.1016/j.surfcoat.2005.03.018
24 https://doi.org/10.1016/s0026-2714(99)00061-x
25 https://doi.org/10.1016/s0042-207x(00)00377-8
26 https://doi.org/10.1016/s0167-6636(02)00131-x
27 https://doi.org/10.1016/s1359-6454(00)00009-4
28 https://doi.org/10.1016/s1359-6462(01)01138-1
29 https://doi.org/10.1088/0022-3727/38/22/018
30 https://doi.org/10.1108/ssmt-08-2016-0017
31 https://doi.org/10.1115/1.2792681
32 https://doi.org/10.1557/jmr.1992.1564
33 https://doi.org/10.1557/jmr.2004.19.1.3
34 https://doi.org/10.1557/jmr.2009.0085
35 https://doi.org/10.1557/jmr.2009.0396
36 schema:datePublished 2019-05
37 schema:datePublishedReg 2019-05-01
38 schema:description A characterization of mechanical and micromechanical properties of SAC305 solder wire under varied strain rates and temperatures was performed using tensile and nanoindentation tests. The evolution of SAC305 lead-free solder wire grains was compared in samples that were subjected to various strain rates and temperatures using tensile tests based on ASTM E12 standards. Different behaviours of mechanical properties, micromechanical properties, and microstructure evolution of SAC305 solder wire were observed when either temperature or strain rate was held constant and the other varied. Both tensile and nanoindentation tests produced qualitative results, such as dynamic recovery and occurrence of pop-in events, that reflected changes of microstructure. It was observed that some of the mechanical properties of SAC305 solder wire, namely yield strength (YS), ultimate tensile strength (UTS) and Young’s modulus, showed the same trends, but with lower values, compared to micromechanical properties obtained from nanoindentation tests based upon hardness and reduced modulus. Microstructure examination further confirms that the YS, UTS and hardness values increase with more solder wire grain refinement. SAC305 solder wire also maintained an equiaxed structure under various strain rates and temperatures.
39 schema:genre research_article
40 schema:inLanguage en
41 schema:isAccessibleForFree false
42 schema:isPartOf Nc82859bef90c416386a2b5d82123d51a
43 Ndc1403a3408a43a0b60ab2648aaf5c0b
44 sg:journal.1136213
45 schema:name Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures
46 schema:pagination 1-14
47 schema:productId N1d0c0d8ea5494a82a78b5a85acf29c21
48 N4d7114a26aae4c3398bc0c772cc7aeb2
49 Nb5adae1b970540208c52a056f1a95776
50 schema:sameAs https://app.dimensions.ai/details/publication/pub.1112023241
51 https://doi.org/10.1007/s11664-019-06985-2
52 schema:sdDatePublished 2019-04-11T14:16
53 schema:sdLicense https://scigraph.springernature.com/explorer/license/
54 schema:sdPublisher Nf71133b73bd14c3f979584fc7900c4cc
55 schema:url https://link.springer.com/10.1007%2Fs11664-019-06985-2
56 sgo:license sg:explorer/license/
57 sgo:sdDataset articles
58 rdf:type schema:ScholarlyArticle
59 N042a3c0225ac4f53beecf074eb86c36b schema:name RedRing Solder (Malaysia) Sdn. Bhd. (RSM), Lot 17486, Jalan Dua, Taman Selayang Baru, 68100, Batu Caves, Selangor, Malaysia
60 rdf:type schema:Organization
61 N1d0c0d8ea5494a82a78b5a85acf29c21 schema:name readcube_id
62 schema:value 8b620005541222545d9760be86ed74b872a45f286291d13f3fdf2ccc1f5068f9
63 rdf:type schema:PropertyValue
64 N2eee7515a5dd4258aea7eed04116fc7f schema:affiliation N042a3c0225ac4f53beecf074eb86c36b
65 schema:familyName Ambak
66 schema:givenName Mohd Arrifin
67 rdf:type schema:Person
68 N4d7114a26aae4c3398bc0c772cc7aeb2 schema:name doi
69 schema:value 10.1007/s11664-019-06985-2
70 rdf:type schema:PropertyValue
71 N4e3dbccb7bdb4082a457086a3ebb3aae schema:affiliation https://www.grid.ac/institutes/grid.412113.4
72 schema:familyName Jalar
73 schema:givenName Azman
74 rdf:type schema:Person
75 N529363f27b494993bd0615f0a6f4abdc schema:affiliation https://www.grid.ac/institutes/grid.10347.31
76 schema:familyName Ismail
77 schema:givenName Roslina
78 rdf:type schema:Person
79 N77a4acf806a44e7d8e25b6d1047e400c schema:affiliation https://www.grid.ac/institutes/grid.440439.e
80 schema:familyName Zulkifli
81 schema:givenName Muhammad Nubli
82 rdf:type schema:Person
83 N93c32d996eda4a26bc5ee404fb719361 rdf:first N4e3dbccb7bdb4082a457086a3ebb3aae
84 rdf:rest Ne6183a3bca014eee938932d220c58402
85 Nb5adae1b970540208c52a056f1a95776 schema:name dimensions_id
86 schema:value pub.1112023241
87 rdf:type schema:PropertyValue
88 Nbcd0192520aa422d8f574f3b9bdf690f rdf:first N2eee7515a5dd4258aea7eed04116fc7f
89 rdf:rest rdf:nil
90 Nbf97fdb4c965423c9e094d32be26231f rdf:first N77a4acf806a44e7d8e25b6d1047e400c
91 rdf:rest N93c32d996eda4a26bc5ee404fb719361
92 Nc518211ff1bb4b6884333facf3e2dcfa schema:affiliation https://www.grid.ac/institutes/grid.412113.4
93 schema:familyName Abdullah
94 schema:givenName Izhan
95 rdf:type schema:Person
96 Nc82859bef90c416386a2b5d82123d51a schema:issueNumber 5
97 rdf:type schema:PublicationIssue
98 Ndac2b953ce654a31a7862d703010465a rdf:first Nc518211ff1bb4b6884333facf3e2dcfa
99 rdf:rest Nbf97fdb4c965423c9e094d32be26231f
100 Ndc1403a3408a43a0b60ab2648aaf5c0b schema:volumeNumber 48
101 rdf:type schema:PublicationVolume
102 Ne6183a3bca014eee938932d220c58402 rdf:first N529363f27b494993bd0615f0a6f4abdc
103 rdf:rest Nbcd0192520aa422d8f574f3b9bdf690f
104 Nf71133b73bd14c3f979584fc7900c4cc schema:name Springer Nature - SN SciGraph project
105 rdf:type schema:Organization
106 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
107 schema:name Engineering
108 rdf:type schema:DefinedTerm
109 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
110 schema:name Materials Engineering
111 rdf:type schema:DefinedTerm
112 sg:journal.1136213 schema:issn 0361-5235
113 1543-186X
114 schema:name Journal of Electronic Materials
115 rdf:type schema:Periodical
116 sg:pub.10.1007/s10853-008-3125-9 schema:sameAs https://app.dimensions.ai/details/publication/pub.1010357683
117 https://doi.org/10.1007/s10853-008-3125-9
118 rdf:type schema:CreativeWork
119 sg:pub.10.1007/s10853-009-3521-9 schema:sameAs https://app.dimensions.ai/details/publication/pub.1001502506
120 https://doi.org/10.1007/s10853-009-3521-9
121 rdf:type schema:CreativeWork
122 sg:pub.10.1007/s10854-007-9374-6 schema:sameAs https://app.dimensions.ai/details/publication/pub.1014124275
123 https://doi.org/10.1007/s10854-007-9374-6
124 rdf:type schema:CreativeWork
125 sg:pub.10.1007/s11664-003-0104-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1053216559
126 https://doi.org/10.1007/s11664-003-0104-4
127 rdf:type schema:CreativeWork
128 sg:pub.10.1007/s11664-003-0139-6 schema:sameAs https://app.dimensions.ai/details/publication/pub.1018725238
129 https://doi.org/10.1007/s11664-003-0139-6
130 rdf:type schema:CreativeWork
131 sg:pub.10.1007/s11664-003-0185-0 schema:sameAs https://app.dimensions.ai/details/publication/pub.1037854389
132 https://doi.org/10.1007/s11664-003-0185-0
133 rdf:type schema:CreativeWork
134 sg:pub.10.1007/s11837-003-0141-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1035800170
135 https://doi.org/10.1007/s11837-003-0141-8
136 rdf:type schema:CreativeWork
137 sg:pub.10.1007/s11837-009-0036-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1025195205
138 https://doi.org/10.1007/s11837-009-0036-4
139 rdf:type schema:CreativeWork
140 https://doi.org/10.1016/j.actamat.2005.08.042 schema:sameAs https://app.dimensions.ai/details/publication/pub.1040117374
141 rdf:type schema:CreativeWork
142 https://doi.org/10.1016/j.actamat.2009.11.002 schema:sameAs https://app.dimensions.ai/details/publication/pub.1025273512
143 rdf:type schema:CreativeWork
144 https://doi.org/10.1016/j.actamat.2013.01.019 schema:sameAs https://app.dimensions.ai/details/publication/pub.1023078253
145 rdf:type schema:CreativeWork
146 https://doi.org/10.1016/j.jallcom.2006.08.009 schema:sameAs https://app.dimensions.ai/details/publication/pub.1014336140
147 rdf:type schema:CreativeWork
148 https://doi.org/10.1016/j.jallcom.2007.03.028 schema:sameAs https://app.dimensions.ai/details/publication/pub.1013286673
149 rdf:type schema:CreativeWork
150 https://doi.org/10.1016/j.jallcom.2010.07.160 schema:sameAs https://app.dimensions.ai/details/publication/pub.1003925274
151 rdf:type schema:CreativeWork
152 https://doi.org/10.1016/j.matchar.2006.05.013 schema:sameAs https://app.dimensions.ai/details/publication/pub.1018303048
153 rdf:type schema:CreativeWork
154 https://doi.org/10.1016/j.msea.2011.01.115 schema:sameAs https://app.dimensions.ai/details/publication/pub.1021290754
155 rdf:type schema:CreativeWork
156 https://doi.org/10.1016/j.msea.2011.09.103 schema:sameAs https://app.dimensions.ai/details/publication/pub.1003240238
157 rdf:type schema:CreativeWork
158 https://doi.org/10.1016/j.msea.2012.10.081 schema:sameAs https://app.dimensions.ai/details/publication/pub.1020470816
159 rdf:type schema:CreativeWork
160 https://doi.org/10.1016/j.msea.2016.05.015 schema:sameAs https://app.dimensions.ai/details/publication/pub.1038194332
161 rdf:type schema:CreativeWork
162 https://doi.org/10.1016/j.surfcoat.2005.03.018 schema:sameAs https://app.dimensions.ai/details/publication/pub.1025478290
163 rdf:type schema:CreativeWork
164 https://doi.org/10.1016/s0026-2714(99)00061-x schema:sameAs https://app.dimensions.ai/details/publication/pub.1017338918
165 rdf:type schema:CreativeWork
166 https://doi.org/10.1016/s0042-207x(00)00377-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1002998179
167 rdf:type schema:CreativeWork
168 https://doi.org/10.1016/s0167-6636(02)00131-x schema:sameAs https://app.dimensions.ai/details/publication/pub.1002643672
169 rdf:type schema:CreativeWork
170 https://doi.org/10.1016/s1359-6454(00)00009-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1029489670
171 rdf:type schema:CreativeWork
172 https://doi.org/10.1016/s1359-6462(01)01138-1 schema:sameAs https://app.dimensions.ai/details/publication/pub.1041574414
173 rdf:type schema:CreativeWork
174 https://doi.org/10.1088/0022-3727/38/22/018 schema:sameAs https://app.dimensions.ai/details/publication/pub.1001012568
175 rdf:type schema:CreativeWork
176 https://doi.org/10.1108/ssmt-08-2016-0017 schema:sameAs https://app.dimensions.ai/details/publication/pub.1084605014
177 rdf:type schema:CreativeWork
178 https://doi.org/10.1115/1.2792681 schema:sameAs https://app.dimensions.ai/details/publication/pub.1062082039
179 rdf:type schema:CreativeWork
180 https://doi.org/10.1557/jmr.1992.1564 schema:sameAs https://app.dimensions.ai/details/publication/pub.1043643805
181 rdf:type schema:CreativeWork
182 https://doi.org/10.1557/jmr.2004.19.1.3 schema:sameAs https://app.dimensions.ai/details/publication/pub.1041295830
183 rdf:type schema:CreativeWork
184 https://doi.org/10.1557/jmr.2009.0085 schema:sameAs https://app.dimensions.ai/details/publication/pub.1028447469
185 rdf:type schema:CreativeWork
186 https://doi.org/10.1557/jmr.2009.0396 schema:sameAs https://app.dimensions.ai/details/publication/pub.1018776804
187 rdf:type schema:CreativeWork
188 https://www.grid.ac/institutes/grid.10347.31 schema:alternateName University of Malaya
189 schema:name Visual Arts Program, Cultural Centre, University of Malaya, 50603, Kuala Lumpur, Malaysia
190 rdf:type schema:Organization
191 https://www.grid.ac/institutes/grid.412113.4 schema:alternateName National University of Malaysia
192 schema:name Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, UKM, 43600, Selangor, Malaysia
193 rdf:type schema:Organization
194 https://www.grid.ac/institutes/grid.440439.e schema:alternateName University of Kuala Lumpur
195 schema:name Universiti Kuala Lumpur (UniKL), British Malaysia Institute (BMI), Electrical Engineering Section, Jalan Sungai Pusu, 53100, Gombak, Selangor, Malaysia
196 rdf:type schema:Organization
 




Preview window. Press ESC to close (or click here)


...