Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints View Full Text


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Article Info

DATE

2017-12-19

AUTHORS

Jian Lin, Yongping Lei, Hanguang Fu, Fu Guo

ABSTRACT

In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead–tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer. More... »

PAGES

2073-2081

References to SciGraph publications

  • 2016-04-12. Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-09-09. Mechanical Properties of Lead-Free Solder Joints Under High-Speed Shear Impact Loading in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-11-23. Frequency-Dependent Low Cycle Fatigue of Sn1Ag0.1Cu(In/Ni) Solder Joints Subjected to High-Frequency Loading in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-05-08. The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests in JOURNAL OF ELECTRONIC MATERIALS
  • 2012-04-10. Modeling Fracture of Sn-Rich (Pb-Free) Solder Joints Under Mechanical Shock Conditions in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-01-10. Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests in JOURNAL OF ELECTRONIC MATERIALS
  • 2004-08. Experimental verification of drop/impact simulation for a cellular phone in EXPERIMENTAL MECHANICS
  • 2016-11-23. The Failure Models of Lead Free Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Low-G and High-G Drop Impact in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-06-28. Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test in JOURNAL OF ELECTRONIC MATERIALS
  • 2015-10-16. A Novel Conditional Probability Density Distribution Surface for the Analysis of the Drop Life of Solder Joints Under Board Level Drop Impact in JOURNAL OF ELECTRONIC MATERIALS
  • 2016-05-20. Board level drop test: exact solution to the problem of the nonlinear dynamic response of a PCB to the drop impact in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-10-29. Effects of temperature and strain rate on mechanical behavior of low-silver lead-free solder under drop impact in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11664-017-6014-7

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    http://dx.doi.org/10.1007/s11664-017-6014-7

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