The Failure Models of Lead Free Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Low-G and High-G Drop Impact View Full Text


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Article Info

DATE

2016-11-23

AUTHORS

Jian Gu, YongPing Lei, Jian Lin, HanGuang Fu, Zhongwei Wu

ABSTRACT

The reliability of Sn-3.0Ag-0.5Cu (SAC 305) solder joint under a broad level of drop impacts was studied. The failure performance of solder joint, failure probability and failure position were analyzed under two shock test conditions, i.e., 1000 g for 1 ms and 300 g for 2 ms. The stress distribution on the solder joint was calculated by ABAQUS. The results revealed that the dominant reason was the tension due to the difference in stiffness between the print circuit board and ball grid array, and the maximum tension of 121.1 MPa and 31.1 MPa, respectively, under both 1000 g or 300 g drop impact, was focused on the corner of the solder joint which was located in the outmost corner of the solder ball row. The failure modes were summarized into the following four modes: initiation and propagation through the (1) intermetallic compound layer, (2) Ni layer, (3) Cu pad, or (4) Sn-matrix. The outmost corner of the solder ball row had a high failure probability under both 1000 g and 300 g drop impact. The number of failures of solder ball under the 300 g drop impact was higher than that under the 1000 g drop impact. The characteristic drop values for failure were 41 and 15,199, respectively, following the statistics. More... »

PAGES

1396-1404

References to SciGraph publications

  • 2011-12-29. Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-09-04. Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-08-14. Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-11-23. Frequency-Dependent Low Cycle Fatigue of Sn1Ag0.1Cu(In/Ni) Solder Joints Subjected to High-Frequency Loading in JOURNAL OF ELECTRONIC MATERIALS
  • 2015-06-02. Effect of Electromigration on the Type of Drop Failure of Sn–3.0Ag–0.5Cu Solder Joints in PBGA Packages in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-07-11. Failure Analysis of Board-Level Sn-Ag-Cu Solder Interconnections Under JEDEC Standard Drop Test in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-04-09. High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-05-08. The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-01-14. 3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters in JOURNAL OF ELECTRONIC MATERIALS
  • 2015-07-21. Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-06. Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni in JOURNAL OF ELECTRONIC MATERIALS
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    [
      {
        "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
        "about": [
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Engineering", 
            "type": "DefinedTerm"
          }, 
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Materials Engineering", 
            "type": "DefinedTerm"
          }
        ], 
        "author": [
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Gu", 
            "givenName": "Jian", 
            "id": "sg:person.015001661507.97", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015001661507.97"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Lei", 
            "givenName": "YongPing", 
            "id": "sg:person.012521025203.12", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Lin", 
            "givenName": "Jian", 
            "id": "sg:person.012212050143.54", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012212050143.54"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Fu", 
            "givenName": "HanGuang", 
            "id": "sg:person.016117416053.11", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016117416053.11"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Wu", 
            "givenName": "Zhongwei", 
            "id": "sg:person.014637001220.55", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014637001220.55"
            ], 
            "type": "Person"
          }
        ], 
        "citation": [
          {
            "id": "sg:pub.10.1007/s11664-002-0129-0", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1053566207", 
              "https://doi.org/10.1007/s11664-002-0129-0"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-014-3176-4", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1023871916", 
              "https://doi.org/10.1007/s11664-014-3176-4"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-015-3931-1", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1000019072", 
              "https://doi.org/10.1007/s11664-015-3931-1"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-013-2889-0", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1047632975", 
              "https://doi.org/10.1007/s11664-013-2889-0"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-013-2661-5", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1051080280", 
              "https://doi.org/10.1007/s11664-013-2661-5"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-014-3345-5", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1034529552", 
              "https://doi.org/10.1007/s11664-014-3345-5"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-011-1837-0", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1029416966", 
              "https://doi.org/10.1007/s11664-011-1837-0"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-015-3856-8", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1028109650", 
              "https://doi.org/10.1007/s11664-015-3856-8"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-008-0610-5", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1019558178", 
              "https://doi.org/10.1007/s11664-008-0610-5"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-013-2964-6", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1047924084", 
              "https://doi.org/10.1007/s11664-013-2964-6"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-013-2736-3", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1008386614", 
              "https://doi.org/10.1007/s11664-013-2736-3"
            ], 
            "type": "CreativeWork"
          }
        ], 
        "datePublished": "2016-11-23", 
        "datePublishedReg": "2016-11-23", 
        "description": "The reliability of Sn-3.0Ag-0.5Cu (SAC 305) solder joint under a broad level of drop impacts was studied. The failure performance of solder joint, failure probability and failure position were analyzed under two shock test conditions, i.e., 1000\u00a0g for 1\u00a0ms and 300\u00a0g for 2\u00a0ms. The stress distribution on the solder joint was calculated by ABAQUS. The results revealed that the dominant reason was the tension due to the difference in stiffness between the print circuit board and ball grid array, and the maximum tension of 121.1\u00a0MPa and 31.1\u00a0MPa, respectively, under both 1000\u00a0g or 300\u00a0g drop impact, was focused on the corner of the solder joint which was located in the outmost corner of the solder ball row. The failure modes were summarized into the following four modes: initiation and propagation through the (1) intermetallic compound layer, (2) Ni layer, (3) Cu pad, or (4) Sn-matrix. The outmost corner of the solder ball row had a high failure probability under both 1000\u00a0g and 300\u00a0g drop impact. The number of failures of solder ball under the 300\u00a0g drop impact was higher than that under the 1000\u00a0g drop impact. The characteristic drop values for failure were 41 and 15,199, respectively, following the statistics.", 
        "genre": "article", 
        "id": "sg:pub.10.1007/s11664-016-5027-y", 
        "inLanguage": "en", 
        "isAccessibleForFree": false, 
        "isFundedItemOf": [
          {
            "id": "sg:grant.7191105", 
            "type": "MonetaryGrant"
          }
        ], 
        "isPartOf": [
          {
            "id": "sg:journal.1136213", 
            "issn": [
              "0361-5235", 
              "1543-186X"
            ], 
            "name": "Journal of Electronic Materials", 
            "publisher": "Springer Nature", 
            "type": "Periodical"
          }, 
          {
            "issueNumber": "2", 
            "type": "PublicationIssue"
          }, 
          {
            "type": "PublicationVolume", 
            "volumeNumber": "46"
          }
        ], 
        "keywords": [
          "drop impact", 
          "solder joints", 
          "outmost corner", 
          "solder joint reliability", 
          "intermetallic compound layer", 
          "Sn-matrix", 
          "ball grid array", 
          "print circuit board", 
          "failure probability", 
          "compound layer", 
          "joint reliability", 
          "failure position", 
          "solder balls", 
          "stress distribution", 
          "grid array", 
          "failure modes", 
          "Cu pad", 
          "Ni layer", 
          "failure performance", 
          "circuit board", 
          "drop values", 
          "test conditions", 
          "failure model", 
          "MPa", 
          "higher failure probability", 
          "joints", 
          "layer", 
          "ABAQUS", 
          "dominant reason", 
          "number of failures", 
          "corner", 
          "stiffness", 
          "tension", 
          "reliability", 
          "mode", 
          "maximum tension", 
          "ball", 
          "propagation", 
          "pads", 
          "performance", 
          "array", 
          "failure", 
          "rows", 
          "conditions", 
          "board", 
          "impact", 
          "distribution", 
          "model", 
          "High", 
          "results", 
          "low", 
          "values", 
          "position", 
          "initiation", 
          "ms", 
          "reasons", 
          "number", 
          "probability", 
          "statistics", 
          "differences", 
          "levels", 
          "MS", 
          "broader level", 
          "shock test conditions", 
          "solder ball row", 
          "ball row", 
          "characteristic drop values"
        ], 
        "name": "The Failure Models of Lead Free Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Low-G and High-G Drop Impact", 
        "pagination": "1396-1404", 
        "productId": [
          {
            "name": "dimensions_id", 
            "type": "PropertyValue", 
            "value": [
              "pub.1031840383"
            ]
          }, 
          {
            "name": "doi", 
            "type": "PropertyValue", 
            "value": [
              "10.1007/s11664-016-5027-y"
            ]
          }
        ], 
        "sameAs": [
          "https://doi.org/10.1007/s11664-016-5027-y", 
          "https://app.dimensions.ai/details/publication/pub.1031840383"
        ], 
        "sdDataset": "articles", 
        "sdDatePublished": "2021-12-01T19:36", 
        "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
        "sdPublisher": {
          "name": "Springer Nature - SN SciGraph project", 
          "type": "Organization"
        }, 
        "sdSource": "s3://com-springernature-scigraph/baseset/20211201/entities/gbq_results/article/article_693.jsonl", 
        "type": "ScholarlyArticle", 
        "url": "https://doi.org/10.1007/s11664-016-5027-y"
      }
    ]
     

    Download the RDF metadata as:  json-ld nt turtle xml License info

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    This table displays all metadata directly associated to this object as RDF triples.

    199 TRIPLES      22 PREDICATES      103 URIs      84 LITERALS      6 BLANK NODES

    Subject Predicate Object
    1 sg:pub.10.1007/s11664-016-5027-y schema:about anzsrc-for:09
    2 anzsrc-for:0912
    3 schema:author Nf33dc4ea78b24e3f99f86ee8164aef39
    4 schema:citation sg:pub.10.1007/s11664-002-0129-0
    5 sg:pub.10.1007/s11664-008-0610-5
    6 sg:pub.10.1007/s11664-011-1837-0
    7 sg:pub.10.1007/s11664-013-2661-5
    8 sg:pub.10.1007/s11664-013-2736-3
    9 sg:pub.10.1007/s11664-013-2889-0
    10 sg:pub.10.1007/s11664-013-2964-6
    11 sg:pub.10.1007/s11664-014-3176-4
    12 sg:pub.10.1007/s11664-014-3345-5
    13 sg:pub.10.1007/s11664-015-3856-8
    14 sg:pub.10.1007/s11664-015-3931-1
    15 schema:datePublished 2016-11-23
    16 schema:datePublishedReg 2016-11-23
    17 schema:description The reliability of Sn-3.0Ag-0.5Cu (SAC 305) solder joint under a broad level of drop impacts was studied. The failure performance of solder joint, failure probability and failure position were analyzed under two shock test conditions, i.e., 1000 g for 1 ms and 300 g for 2 ms. The stress distribution on the solder joint was calculated by ABAQUS. The results revealed that the dominant reason was the tension due to the difference in stiffness between the print circuit board and ball grid array, and the maximum tension of 121.1 MPa and 31.1 MPa, respectively, under both 1000 g or 300 g drop impact, was focused on the corner of the solder joint which was located in the outmost corner of the solder ball row. The failure modes were summarized into the following four modes: initiation and propagation through the (1) intermetallic compound layer, (2) Ni layer, (3) Cu pad, or (4) Sn-matrix. The outmost corner of the solder ball row had a high failure probability under both 1000 g and 300 g drop impact. The number of failures of solder ball under the 300 g drop impact was higher than that under the 1000 g drop impact. The characteristic drop values for failure were 41 and 15,199, respectively, following the statistics.
    18 schema:genre article
    19 schema:inLanguage en
    20 schema:isAccessibleForFree false
    21 schema:isPartOf N855a65ef5b0946f387eb08bb52b39044
    22 N9f317e6bfa464bb58b0f235138a45f8c
    23 sg:journal.1136213
    24 schema:keywords ABAQUS
    25 Cu pad
    26 High
    27 MPa
    28 MS
    29 Ni layer
    30 Sn-matrix
    31 array
    32 ball
    33 ball grid array
    34 ball row
    35 board
    36 broader level
    37 characteristic drop values
    38 circuit board
    39 compound layer
    40 conditions
    41 corner
    42 differences
    43 distribution
    44 dominant reason
    45 drop impact
    46 drop values
    47 failure
    48 failure model
    49 failure modes
    50 failure performance
    51 failure position
    52 failure probability
    53 grid array
    54 higher failure probability
    55 impact
    56 initiation
    57 intermetallic compound layer
    58 joint reliability
    59 joints
    60 layer
    61 levels
    62 low
    63 maximum tension
    64 mode
    65 model
    66 ms
    67 number
    68 number of failures
    69 outmost corner
    70 pads
    71 performance
    72 position
    73 print circuit board
    74 probability
    75 propagation
    76 reasons
    77 reliability
    78 results
    79 rows
    80 shock test conditions
    81 solder ball row
    82 solder balls
    83 solder joint reliability
    84 solder joints
    85 statistics
    86 stiffness
    87 stress distribution
    88 tension
    89 test conditions
    90 values
    91 schema:name The Failure Models of Lead Free Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Low-G and High-G Drop Impact
    92 schema:pagination 1396-1404
    93 schema:productId N53fec7ed95e24ee8866ba39358487822
    94 N604c2f8f636a4c4c8d2c6e28c953ff43
    95 schema:sameAs https://app.dimensions.ai/details/publication/pub.1031840383
    96 https://doi.org/10.1007/s11664-016-5027-y
    97 schema:sdDatePublished 2021-12-01T19:36
    98 schema:sdLicense https://scigraph.springernature.com/explorer/license/
    99 schema:sdPublisher Na324573f83564e1ebde575b2cece88bb
    100 schema:url https://doi.org/10.1007/s11664-016-5027-y
    101 sgo:license sg:explorer/license/
    102 sgo:sdDataset articles
    103 rdf:type schema:ScholarlyArticle
    104 N04c5c2f658ed4f98a5e484747b6e06ae rdf:first sg:person.014637001220.55
    105 rdf:rest rdf:nil
    106 N53fec7ed95e24ee8866ba39358487822 schema:name dimensions_id
    107 schema:value pub.1031840383
    108 rdf:type schema:PropertyValue
    109 N604c2f8f636a4c4c8d2c6e28c953ff43 schema:name doi
    110 schema:value 10.1007/s11664-016-5027-y
    111 rdf:type schema:PropertyValue
    112 N855a65ef5b0946f387eb08bb52b39044 schema:volumeNumber 46
    113 rdf:type schema:PublicationVolume
    114 N92e604073b874f159b21076908e84d03 rdf:first sg:person.016117416053.11
    115 rdf:rest N04c5c2f658ed4f98a5e484747b6e06ae
    116 N94242855739a435393b502a19c0327bd rdf:first sg:person.012521025203.12
    117 rdf:rest Nfaf07864d9a74994a70d2f80b6d82d11
    118 N9f317e6bfa464bb58b0f235138a45f8c schema:issueNumber 2
    119 rdf:type schema:PublicationIssue
    120 Na324573f83564e1ebde575b2cece88bb schema:name Springer Nature - SN SciGraph project
    121 rdf:type schema:Organization
    122 Nf33dc4ea78b24e3f99f86ee8164aef39 rdf:first sg:person.015001661507.97
    123 rdf:rest N94242855739a435393b502a19c0327bd
    124 Nfaf07864d9a74994a70d2f80b6d82d11 rdf:first sg:person.012212050143.54
    125 rdf:rest N92e604073b874f159b21076908e84d03
    126 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
    127 schema:name Engineering
    128 rdf:type schema:DefinedTerm
    129 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
    130 schema:name Materials Engineering
    131 rdf:type schema:DefinedTerm
    132 sg:grant.7191105 http://pending.schema.org/fundedItem sg:pub.10.1007/s11664-016-5027-y
    133 rdf:type schema:MonetaryGrant
    134 sg:journal.1136213 schema:issn 0361-5235
    135 1543-186X
    136 schema:name Journal of Electronic Materials
    137 schema:publisher Springer Nature
    138 rdf:type schema:Periodical
    139 sg:person.012212050143.54 schema:affiliation grid-institutes:grid.28703.3e
    140 schema:familyName Lin
    141 schema:givenName Jian
    142 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012212050143.54
    143 rdf:type schema:Person
    144 sg:person.012521025203.12 schema:affiliation grid-institutes:grid.28703.3e
    145 schema:familyName Lei
    146 schema:givenName YongPing
    147 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12
    148 rdf:type schema:Person
    149 sg:person.014637001220.55 schema:affiliation grid-institutes:grid.28703.3e
    150 schema:familyName Wu
    151 schema:givenName Zhongwei
    152 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014637001220.55
    153 rdf:type schema:Person
    154 sg:person.015001661507.97 schema:affiliation grid-institutes:grid.28703.3e
    155 schema:familyName Gu
    156 schema:givenName Jian
    157 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015001661507.97
    158 rdf:type schema:Person
    159 sg:person.016117416053.11 schema:affiliation grid-institutes:grid.28703.3e
    160 schema:familyName Fu
    161 schema:givenName HanGuang
    162 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016117416053.11
    163 rdf:type schema:Person
    164 sg:pub.10.1007/s11664-002-0129-0 schema:sameAs https://app.dimensions.ai/details/publication/pub.1053566207
    165 https://doi.org/10.1007/s11664-002-0129-0
    166 rdf:type schema:CreativeWork
    167 sg:pub.10.1007/s11664-008-0610-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1019558178
    168 https://doi.org/10.1007/s11664-008-0610-5
    169 rdf:type schema:CreativeWork
    170 sg:pub.10.1007/s11664-011-1837-0 schema:sameAs https://app.dimensions.ai/details/publication/pub.1029416966
    171 https://doi.org/10.1007/s11664-011-1837-0
    172 rdf:type schema:CreativeWork
    173 sg:pub.10.1007/s11664-013-2661-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1051080280
    174 https://doi.org/10.1007/s11664-013-2661-5
    175 rdf:type schema:CreativeWork
    176 sg:pub.10.1007/s11664-013-2736-3 schema:sameAs https://app.dimensions.ai/details/publication/pub.1008386614
    177 https://doi.org/10.1007/s11664-013-2736-3
    178 rdf:type schema:CreativeWork
    179 sg:pub.10.1007/s11664-013-2889-0 schema:sameAs https://app.dimensions.ai/details/publication/pub.1047632975
    180 https://doi.org/10.1007/s11664-013-2889-0
    181 rdf:type schema:CreativeWork
    182 sg:pub.10.1007/s11664-013-2964-6 schema:sameAs https://app.dimensions.ai/details/publication/pub.1047924084
    183 https://doi.org/10.1007/s11664-013-2964-6
    184 rdf:type schema:CreativeWork
    185 sg:pub.10.1007/s11664-014-3176-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1023871916
    186 https://doi.org/10.1007/s11664-014-3176-4
    187 rdf:type schema:CreativeWork
    188 sg:pub.10.1007/s11664-014-3345-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1034529552
    189 https://doi.org/10.1007/s11664-014-3345-5
    190 rdf:type schema:CreativeWork
    191 sg:pub.10.1007/s11664-015-3856-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1028109650
    192 https://doi.org/10.1007/s11664-015-3856-8
    193 rdf:type schema:CreativeWork
    194 sg:pub.10.1007/s11664-015-3931-1 schema:sameAs https://app.dimensions.ai/details/publication/pub.1000019072
    195 https://doi.org/10.1007/s11664-015-3931-1
    196 rdf:type schema:CreativeWork
    197 grid-institutes:grid.28703.3e schema:alternateName College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China
    198 schema:name College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China
    199 rdf:type schema:Organization
     




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