Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders View Full Text


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Article Info

DATE

2016-02-17

AUTHORS

Qin Li, Ninshu Ma, YongPing Lei, Jian Lin, HanGuang Fu, Jian Gu

ABSTRACT

Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints. More... »

PAGES

5800-5810

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-016-4366-z

DOI

http://dx.doi.org/10.1007/s11664-016-4366-z

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1004861447


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[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Li", 
        "givenName": "Qin", 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, lbaraki, 567-0047, Osaka, Japan", 
          "id": "http://www.grid.ac/institutes/grid.136593.b", 
          "name": [
            "Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, lbaraki, 567-0047, Osaka, Japan"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Ma", 
        "givenName": "Ninshu", 
        "id": "sg:person.016176107717.52", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016176107717.52"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Lei", 
        "givenName": "YongPing", 
        "id": "sg:person.012521025203.12", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Lin", 
        "givenName": "Jian", 
        "id": "sg:person.012212050143.54", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012212050143.54"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Fu", 
        "givenName": "HanGuang", 
        "id": "sg:person.016117416053.11", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016117416053.11"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Gu", 
        "givenName": "Jian", 
        "id": "sg:person.015001661507.97", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015001661507.97"
        ], 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1007/s11664-008-0458-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1026262220", 
          "https://doi.org/10.1007/s11664-008-0458-8"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-014-3537-z", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1009790331", 
          "https://doi.org/10.1007/s11664-014-3537-z"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-014-3460-3", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1012437195", 
          "https://doi.org/10.1007/s11664-014-3460-3"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-010-1385-z", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1045146139", 
          "https://doi.org/10.1007/s11664-010-1385-z"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-014-3359-z", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1002548385", 
          "https://doi.org/10.1007/s11664-014-3359-z"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10853-008-3118-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1028569487", 
          "https://doi.org/10.1007/s10853-008-3118-8"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-009-0888-y", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1051014417", 
          "https://doi.org/10.1007/s11664-009-0888-y"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11661-999-0087-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1035015516", 
          "https://doi.org/10.1007/s11661-999-0087-8"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/bf00555382", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1014965172", 
          "https://doi.org/10.1007/bf00555382"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2016-02-17", 
    "datePublishedReg": "2016-02-17", 
    "description": "Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of \u03b2-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100\u00b0C to 104\u00b0C. However, when the Sn content exceeded 50\u00a0wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.", 
    "genre": "article", 
    "id": "sg:pub.10.1007/s11664-016-4366-z", 
    "inLanguage": "en", 
    "isAccessibleForFree": false, 
    "isFundedItemOf": [
      {
        "id": "sg:grant.7191105", 
        "type": "MonetaryGrant"
      }
    ], 
    "isPartOf": [
      {
        "id": "sg:journal.1136213", 
        "issn": [
          "0361-5235", 
          "1543-186X"
        ], 
        "name": "Journal of Electronic Materials", 
        "publisher": "Springer Nature", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "11", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "45"
      }
    ], 
    "keywords": [
      "lead-free solders", 
      "solder joints", 
      "Sn-Bi", 
      "solder alloy", 
      "low melting temperature", 
      "Bi content", 
      "reliability of joints", 
      "intermetallic compound layer", 
      "Low-Melting", 
      "fracture mode", 
      "fracture mechanism", 
      "fracture surfaces", 
      "brittle fracture", 
      "higher Bi content", 
      "compound layer", 
      "mechanical properties", 
      "tensile strength", 
      "solder", 
      "melting temperature", 
      "coarse grains", 
      "fracture structure", 
      "thermal properties", 
      "Sn content", 
      "microstructure", 
      "alloy", 
      "wettability", 
      "melting range", 
      "joints", 
      "different ratios", 
      "present work", 
      "temperature", 
      "substitution of Pb", 
      "Sn", 
      "properties", 
      "Cu6Sn5", 
      "layer", 
      "thickness", 
      "Bi", 
      "strength", 
      "surface", 
      "grains", 
      "content", 
      "wt", 
      "InBi", 
      "elongation", 
      "fractures", 
      "reliability", 
      "Cu", 
      "mode", 
      "structure", 
      "characterization", 
      "ratio", 
      "work", 
      "range", 
      "human health", 
      "step", 
      "results", 
      "environment", 
      "direct risk", 
      "addition", 
      "cleavage step", 
      "Pb", 
      "mechanism", 
      "development", 
      "substitution", 
      "risk", 
      "health", 
      "Point Sn"
    ], 
    "name": "Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders", 
    "pagination": "5800-5810", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1004861447"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/s11664-016-4366-z"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/s11664-016-4366-z", 
      "https://app.dimensions.ai/details/publication/pub.1004861447"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2021-12-01T19:37", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-springernature-scigraph/baseset/20211201/entities/gbq_results/article/article_704.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://doi.org/10.1007/s11664-016-4366-z"
  }
]
 

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This table displays all metadata directly associated to this object as RDF triples.

201 TRIPLES      22 PREDICATES      102 URIs      85 LITERALS      6 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/s11664-016-4366-z schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author N09e3cec21727465cb13e5812cdb6786a
4 schema:citation sg:pub.10.1007/bf00555382
5 sg:pub.10.1007/s10853-008-3118-8
6 sg:pub.10.1007/s11661-999-0087-8
7 sg:pub.10.1007/s11664-008-0458-8
8 sg:pub.10.1007/s11664-009-0888-y
9 sg:pub.10.1007/s11664-010-1385-z
10 sg:pub.10.1007/s11664-014-3359-z
11 sg:pub.10.1007/s11664-014-3460-3
12 sg:pub.10.1007/s11664-014-3537-z
13 schema:datePublished 2016-02-17
14 schema:datePublishedReg 2016-02-17
15 schema:description Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.
16 schema:genre article
17 schema:inLanguage en
18 schema:isAccessibleForFree false
19 schema:isPartOf N0bb492eb7af34d49a81afddd5e59368f
20 N7ce973f7ffbc46c7bc0ac62ae039d6bd
21 sg:journal.1136213
22 schema:keywords Bi
23 Bi content
24 Cu
25 Cu6Sn5
26 InBi
27 Low-Melting
28 Pb
29 Point Sn
30 Sn
31 Sn content
32 Sn-Bi
33 addition
34 alloy
35 brittle fracture
36 characterization
37 cleavage step
38 coarse grains
39 compound layer
40 content
41 development
42 different ratios
43 direct risk
44 elongation
45 environment
46 fracture mechanism
47 fracture mode
48 fracture structure
49 fracture surfaces
50 fractures
51 grains
52 health
53 higher Bi content
54 human health
55 intermetallic compound layer
56 joints
57 layer
58 lead-free solders
59 low melting temperature
60 mechanical properties
61 mechanism
62 melting range
63 melting temperature
64 microstructure
65 mode
66 present work
67 properties
68 range
69 ratio
70 reliability
71 reliability of joints
72 results
73 risk
74 solder
75 solder alloy
76 solder joints
77 step
78 strength
79 structure
80 substitution
81 substitution of Pb
82 surface
83 temperature
84 tensile strength
85 thermal properties
86 thickness
87 wettability
88 work
89 wt
90 schema:name Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders
91 schema:pagination 5800-5810
92 schema:productId N647ee7a910a34e0ca3f9f908d67a9c81
93 N6baf20d69c4d4321b77ee8052c241629
94 schema:sameAs https://app.dimensions.ai/details/publication/pub.1004861447
95 https://doi.org/10.1007/s11664-016-4366-z
96 schema:sdDatePublished 2021-12-01T19:37
97 schema:sdLicense https://scigraph.springernature.com/explorer/license/
98 schema:sdPublisher Nb32a26b9fbea4103bc711f889cef5538
99 schema:url https://doi.org/10.1007/s11664-016-4366-z
100 sgo:license sg:explorer/license/
101 sgo:sdDataset articles
102 rdf:type schema:ScholarlyArticle
103 N04e0fb0267744d15b4496bfc80728473 rdf:first sg:person.016117416053.11
104 rdf:rest N2ccb65d865fe4c9a843b7911c41e4c6e
105 N09e3cec21727465cb13e5812cdb6786a rdf:first N5f0e6b8416c247ddbf567274ebfccf6d
106 rdf:rest N328691398a6d4bb8ac023c742c6e7ea1
107 N0bb492eb7af34d49a81afddd5e59368f schema:volumeNumber 45
108 rdf:type schema:PublicationVolume
109 N2ccb65d865fe4c9a843b7911c41e4c6e rdf:first sg:person.015001661507.97
110 rdf:rest rdf:nil
111 N328691398a6d4bb8ac023c742c6e7ea1 rdf:first sg:person.016176107717.52
112 rdf:rest N8bab40c8fb4a4323b514990803974f57
113 N506dc61dd9104a7d8d7cdfe6af61aa71 rdf:first sg:person.012212050143.54
114 rdf:rest N04e0fb0267744d15b4496bfc80728473
115 N5f0e6b8416c247ddbf567274ebfccf6d schema:affiliation grid-institutes:grid.28703.3e
116 schema:familyName Li
117 schema:givenName Qin
118 rdf:type schema:Person
119 N647ee7a910a34e0ca3f9f908d67a9c81 schema:name doi
120 schema:value 10.1007/s11664-016-4366-z
121 rdf:type schema:PropertyValue
122 N6baf20d69c4d4321b77ee8052c241629 schema:name dimensions_id
123 schema:value pub.1004861447
124 rdf:type schema:PropertyValue
125 N7ce973f7ffbc46c7bc0ac62ae039d6bd schema:issueNumber 11
126 rdf:type schema:PublicationIssue
127 N8bab40c8fb4a4323b514990803974f57 rdf:first sg:person.012521025203.12
128 rdf:rest N506dc61dd9104a7d8d7cdfe6af61aa71
129 Nb32a26b9fbea4103bc711f889cef5538 schema:name Springer Nature - SN SciGraph project
130 rdf:type schema:Organization
131 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
132 schema:name Engineering
133 rdf:type schema:DefinedTerm
134 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
135 schema:name Materials Engineering
136 rdf:type schema:DefinedTerm
137 sg:grant.7191105 http://pending.schema.org/fundedItem sg:pub.10.1007/s11664-016-4366-z
138 rdf:type schema:MonetaryGrant
139 sg:journal.1136213 schema:issn 0361-5235
140 1543-186X
141 schema:name Journal of Electronic Materials
142 schema:publisher Springer Nature
143 rdf:type schema:Periodical
144 sg:person.012212050143.54 schema:affiliation grid-institutes:grid.28703.3e
145 schema:familyName Lin
146 schema:givenName Jian
147 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012212050143.54
148 rdf:type schema:Person
149 sg:person.012521025203.12 schema:affiliation grid-institutes:grid.28703.3e
150 schema:familyName Lei
151 schema:givenName YongPing
152 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12
153 rdf:type schema:Person
154 sg:person.015001661507.97 schema:affiliation grid-institutes:grid.28703.3e
155 schema:familyName Gu
156 schema:givenName Jian
157 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015001661507.97
158 rdf:type schema:Person
159 sg:person.016117416053.11 schema:affiliation grid-institutes:grid.28703.3e
160 schema:familyName Fu
161 schema:givenName HanGuang
162 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016117416053.11
163 rdf:type schema:Person
164 sg:person.016176107717.52 schema:affiliation grid-institutes:grid.136593.b
165 schema:familyName Ma
166 schema:givenName Ninshu
167 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016176107717.52
168 rdf:type schema:Person
169 sg:pub.10.1007/bf00555382 schema:sameAs https://app.dimensions.ai/details/publication/pub.1014965172
170 https://doi.org/10.1007/bf00555382
171 rdf:type schema:CreativeWork
172 sg:pub.10.1007/s10853-008-3118-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1028569487
173 https://doi.org/10.1007/s10853-008-3118-8
174 rdf:type schema:CreativeWork
175 sg:pub.10.1007/s11661-999-0087-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1035015516
176 https://doi.org/10.1007/s11661-999-0087-8
177 rdf:type schema:CreativeWork
178 sg:pub.10.1007/s11664-008-0458-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1026262220
179 https://doi.org/10.1007/s11664-008-0458-8
180 rdf:type schema:CreativeWork
181 sg:pub.10.1007/s11664-009-0888-y schema:sameAs https://app.dimensions.ai/details/publication/pub.1051014417
182 https://doi.org/10.1007/s11664-009-0888-y
183 rdf:type schema:CreativeWork
184 sg:pub.10.1007/s11664-010-1385-z schema:sameAs https://app.dimensions.ai/details/publication/pub.1045146139
185 https://doi.org/10.1007/s11664-010-1385-z
186 rdf:type schema:CreativeWork
187 sg:pub.10.1007/s11664-014-3359-z schema:sameAs https://app.dimensions.ai/details/publication/pub.1002548385
188 https://doi.org/10.1007/s11664-014-3359-z
189 rdf:type schema:CreativeWork
190 sg:pub.10.1007/s11664-014-3460-3 schema:sameAs https://app.dimensions.ai/details/publication/pub.1012437195
191 https://doi.org/10.1007/s11664-014-3460-3
192 rdf:type schema:CreativeWork
193 sg:pub.10.1007/s11664-014-3537-z schema:sameAs https://app.dimensions.ai/details/publication/pub.1009790331
194 https://doi.org/10.1007/s11664-014-3537-z
195 rdf:type schema:CreativeWork
196 grid-institutes:grid.136593.b schema:alternateName Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, lbaraki, 567-0047, Osaka, Japan
197 schema:name Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, lbaraki, 567-0047, Osaka, Japan
198 rdf:type schema:Organization
199 grid-institutes:grid.28703.3e schema:alternateName College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China
200 schema:name College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, 100124, Beijing, China
201 rdf:type schema:Organization
 




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