A Novel Conditional Probability Density Distribution Surface for the Analysis of the Drop Life of Solder Joints Under Board Level ... View Full Text


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Article Info

DATE

2015-10-16

AUTHORS

Jian Gu, YongPing Lei, Jian Lin, HanGuang Fu, Zhongwei Wu

ABSTRACT

The scattering of fatigue life data is a common problem and usually described using the normal distribution or Weibull distribution. For solder joints under drop impact, due to the complicated stress distribution, the relationship between the stress and the drop life is so far unknown. Furthermore, it is important to establish a function describing the change in standard deviation for solder joints under different drop impact levels. Therefore, in this study, a novel conditional probability density distribution surface (CPDDS) was established for the analysis of the drop life of solder joints. The relationship between the drop impact acceleration and the drop life is proposed, which comprehensively considers the stress distribution. A novel exponential model was adopted for describing the change of the standard deviation with the impact acceleration (0 → +∞). To validate the model, the drop life of Sn-3.0Ag-0.5Cu solder joints was analyzed. The probability density curve of the logarithm of the fatigue life distribution can be easily obtained for a certain acceleration level fixed on the acceleration level axis of the CPDDS. The P–A–N curve was also obtained using the functions μ(A) and σ(A), which can reflect the regularity of the life data for an overall reliability P. More... »

PAGES

145-153

References to SciGraph publications

  • 2011-12-29. Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique in JOURNAL OF ELECTRONIC MATERIALS
  • 2011-05-12. Experiment and Simulation in Design of the Board‐Level Drop Testing Tower Apparatus in EXPERIMENTAL TECHNIQUES
  • 2012-08-01. The Combined Effect of Shock Impacts and Operational Power Cycles on the Reliability of Handheld Device Component Board Interconnections in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-08-14. Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-03. Failure Morphology after the Drop Impact Test of the Ball Grid Array Package with Lead-Free Sn-3.8Ag-0.7Cu on Cu and Ni Under-Bump Metallurgies in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-04-24. A facile approach for fabrication of underwater superoleophobic alloy in APPLIED PHYSICS A
  • 2010-09-17. Study of the Impact Performance of Solder Joints by High-Velocity Impact Tests in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-01-25. Evolution of Microstructure Across Eutectic Sn-Bi Solder Joints Under Simultaneous Thermal Cycling and Current Stressing in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-04-09. High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-05-08. The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-01-14. 3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-09-04. Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-11-25. Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages in JOURNAL OF ELECTRONIC MATERIALS
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