Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2012-07

AUTHORS

Yukiko Mizuguchi, Yosuke Murakami, Shigetaka Tomiya, Tadashi Asai, Tomoya Kiga, Katsuaki Suganuma

ABSTRACT

Mechanically induced Sn whiskers formed on Sn-2%Cu plated on Cu with Ni underplating were examined by scanning electron microscopy and electron backscatter diffraction. The results revealed that Sn grains became larger under mechanical stress due to recrystallization and/or grain growth. The notable feature was formation of many twin interfaces. Most twin boundaries were {301}, and there were approximately 20 times more {301} twin boundaries compared with the as-deposited plating. The analysis clearly revealed that many whiskers nucleated from newly formed {301} twinned grains, which formed on columnar grains. Thus, twin formation plays a critical role in mechanically induced formation of whiskers. More... »

PAGES

1859-1867

References to SciGraph publications

  • 2007-03. Deformation behavior of tin and some tin alloys in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2007-12. Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers in JOURNAL OF ELECTRONIC MATERIALS
  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11664-012-1962-4

    DOI

    http://dx.doi.org/10.1007/s11664-012-1962-4

    DIMENSIONS

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