Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects View Full Text


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Article Info

DATE

2011-12

AUTHORS

X. P. Li, J. M. Xia, M. B. Zhou, X. Ma, X. P. Zhang

ABSTRACT

The standoff height of ball grid array (BGA) structure solder joints has a significant influence on the formation and growth of interfacial intermetallic compounds (IMC). The results show that the thickness of the IMC layer at the solder/Cu interface of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints increases with decreasing standoff height after reflowing. The growth behavior of the total IMC layer is controlled by a diffusion process with the growth rate increasing with standoff height. Both the standoff height and isothermal aging time greatly influence the shear behavior of joints, the shear strength of which shows a parabolic trend with increasing standoff height, while the nominal shear strain decreases monotonically with increasing standoff height. The fracture location of BGA structure joints changed from the middle of the solder matrix to near the interface when the standoff height was increased. After undergoing isothermal aging at 125°C, the fracture mechanism of solder joints changed from ductile fracture to the mixed mode of brittle and ductile fracture with increasing standoff height. More... »

PAGES

2425

References to SciGraph publications

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  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11664-011-1760-4

    DOI

    http://dx.doi.org/10.1007/s11664-011-1760-4

    DIMENSIONS

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