Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2011-10

AUTHORS

M. J. Bozack, J. C. Suhling, Y. Zhang, Z. Cai, P. Lall

ABSTRACT

Wetting of Sn-Ag-Cu (SAC) series solder alloys to solid substrates is strongly influenced by surface segregation of low-level bulk impurities in the alloys. We report in situ and real-time Auger electron spectroscopy measurements of SAC alloy surface compositions as a function of temperature as the alloys are taken through the melting point. A dramatic increase in the amount of surface C (and frequently O) is observed with temperature, and in some cases the alloy surface is nearly 80 at.% C at the melting point. The C originates from low-level impurities incorporated during alloy synthesis and inhibits wetting because C acts as a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. More... »

PAGES

2093

References to SciGraph publications

Journal

TITLE

Journal of Electronic Materials

ISSUE

10

VOLUME

40

Author Affiliations

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-011-1725-7

DOI

http://dx.doi.org/10.1007/s11664-011-1725-7

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1000994332


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