Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2011-02

AUTHORS

M. B. Zhou, X. Ma, X. P. Zhang

ABSTRACT

The early interfacial reaction in the Sn-3.5Ag/Cu soldering system and the system’s premelting behavior were found and characterized by differential scanning calorimetry incorporated into the reflow process. The results show that the early interfacial reaction occurs by way of melting and wetting of the solder layer adjacent to the Cu substrate at a temperature nearly 4°C below the actual melting point of Sn-3.5Ag solder due to solid-state diffusion of Cu atoms into the Sn-3.5Ag binary solder. Consequently, the early interfacial reaction brings about formation of Cu-Sn intermetallic compounds (IMCs) at a temperature below the melting point of Sn-3.5Ag, and a prolonged early interfacial reaction can lead to change of the Cu-Sn IMC morphology from planar-like to scallop-like and promote excessive growth of IMCs at the interface. More... »

PAGES

189-194

References to SciGraph publications

  • 2000-04. Tin-silver-copper eutectic temperature and composition in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2000-10. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys in JOURNAL OF ELECTRONIC MATERIALS
  • Journal

    TITLE

    Journal of Electronic Materials

    ISSUE

    2

    VOLUME

    40

    Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11664-010-1433-8

    DOI

    http://dx.doi.org/10.1007/s11664-010-1433-8

    DIMENSIONS

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