Physical Properties of Sn96.5Ag3.5-Based Solders with Additions of Bi, Ge, and In View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2009-09-24

AUTHORS

I. Kaban, K. Khalouk, M. Köhler, W. Hoyer, J.-G. Gasser

ABSTRACT

The melting temperature, electrical resistivity, surface tension, and density of the (Sn0.965Ag0.035)95.17Bi4.83, (Sn0.965Ag0.035)95.17Bi4.73Ge0.1, and (Sn0.965Ag0.035)94-Bi2In4 alloys have been studied in comparison with the Sn60Pb40 and Sn96.5Ag3.5 binary alloys (all wt.%). The electrical conductivity of the solid alloys based on Sn96.5Ag3.5 is comparable to that of the Sn60Pb40 alloy. The wetting behavior on Cu and Ni surfaces has been investigated in a wide temperature interval. It is established that the addition of Bi to Sn96.5Ag3.5 decreases the surface tension and improves the wetting properties of the alloy. The addition of a small quantity of Ge to the Sn-Ag-Bi alloy did not improve the wetting behavior on either Cu or Ni surfaces. The wetting ability of the (Sn0.965Ag0.035)94Bi2In4 alloy was slightly worse as compared with (Sn0.965Ag0.035)95.17Bi4.83. More... »

PAGES

70-76

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-009-0952-7

DOI

http://dx.doi.org/10.1007/s11664-009-0952-7

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1019594154


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