Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2009-09-16

AUTHORS

Fu Guo, Guangchen Xu, Jia Sun, Zhidong Xia, Yongping Lei, Yaowu Shi, Xiaoyan Li

ABSTRACT

The resistance of electronic interconnects made with Sn-based solders experiences significant deterioration during service in high-performance electronic products. During electromigration damage, metal atoms/ions can migrate in the direction of electron flow. Accordingly, accumulation of metal atoms/ions at the anode interface can induce surface bulging. On the other hand, depletion of metal atoms/ions at the cathode interface can induce surface dimpling. In addition, the different α-rich and β-rich phases in a binary eutectic system were found to separate in the bulk region of eutectic Sn-Bi solder joints. Such atomic movement leads to complex interactions between the resistance changes of electronic solder joints during the different stages of electromigration. In order to clarify such scenarios, a LabVIEW®-controlled system was employed to quantitatively measure the instantaneous resistance values after an electric current was applied. This study investigated the effects of a high current density (104 A/cm2) at two different ambient temperatures (25°C and 80°C) on the deterioration of resistance changes during the early stage of the electromigration process. More... »

PAGES

2756

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-009-0944-7

DOI

http://dx.doi.org/10.1007/s11664-009-0944-7

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1016183273


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