Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2009-07-07

AUTHORS

Ning Zhang, Yaowu Shi, Yongping Lei, Zhidong Xia, Fu Guo, Xiaoyan Li

ABSTRACT

This study was concerned with the effect of thermal aging on the impact properties of solder joints. Three kinds of solders, conventional Sn-37Pb solder, Sn-3.8Ag-0.7Cu solder, and Sn-3.8Ag-0.7Cu doped with rare-earth (RE) elements, were selected to manufacture joint specimens for the Charpy impact test. U-notch specimens were adopted and isothermally aged at 150°C for 100 h and 1000 h, and then impacted by using a pendulum-type impact tester at room temperature. The Sn-37Pb solder joints exhibited higher performance in terms of impact absorbed energy in the as-soldered and 100 h thermally aged conditions. Interestingly, the Sn-3.8Ag-0.7Cu solder joints exhibited improved performance for the impact value after 1000 h of thermal aging. For the Sn-37Pb and Sn-3.8Ag-0.7Cu solder joints, the impact absorbed energies initially increased when the storage duration was limited to 100 h, and then gradually decreased with its further increase. For the Sn-3.8Ag-0.7Cu-RE specimens, impact performance decreased directly with increasing thermal aging. Furthermore, scanning electron microscopy (SEM) observation showed that the fracture paths were focused on the interface zone for the three kinds of joints in the aged conditions. For the Sn-37Pb joints, the fracture surfaces mainly presented a ductile fracture mode. For the Sn-3.8Ag-0.7Cu joints, with microstructure coarsening, crack propagation partly shifted towards the Sn/Cu6Sn5 interface. Compared with the 100 h aged joints, the area fraction of intergranular fracture of Sn grains on the Sn-3.8Ag-0.7Cu fracture surfaces was increased when the aging time was 1000 h. On the contrary, the fracture morphologies of Sn-3.8Ag-0.7Cu-RE were mainly brittle as thermal aging increased. Thus, an interrelationship between impact energy value and fracture morphology was observed. More... »

PAGES

2132-2147

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Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-009-0872-6

DOI

http://dx.doi.org/10.1007/s11664-009-0872-6

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[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Zhang", 
        "givenName": "Ning", 
        "id": "sg:person.014056156001.08", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014056156001.08"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Shi", 
        "givenName": "Yaowu", 
        "id": "sg:person.010147557037.66", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010147557037.66"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Lei", 
        "givenName": "Yongping", 
        "id": "sg:person.012521025203.12", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Xia", 
        "givenName": "Zhidong", 
        "id": "sg:person.016447555263.38", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016447555263.38"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Guo", 
        "givenName": "Fu", 
        "id": "sg:person.014627203474.59", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014627203474.59"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Li", 
        "givenName": "Xiaoyan", 
        "id": "sg:person.014361463331.82", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014361463331.82"
        ], 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1007/s10854-006-9011-9", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1011206069", 
          "https://doi.org/10.1007/s10854-006-9011-9"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/bf02675563", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1032508427", 
          "https://doi.org/10.1007/bf02675563"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-008-0400-0", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1031759789", 
          "https://doi.org/10.1007/s11664-008-0400-0"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-006-0062-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1017433268", 
          "https://doi.org/10.1007/s11664-006-0062-8"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-008-0506-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1015830933", 
          "https://doi.org/10.1007/s11664-008-0506-4"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-004-0026-9", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1019049442", 
          "https://doi.org/10.1007/s11664-004-0026-9"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10854-006-9022-6", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1036179418", 
          "https://doi.org/10.1007/s10854-006-9022-6"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1557/jmr.2004.0371", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1036801596", 
          "https://doi.org/10.1557/jmr.2004.0371"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-007-0260-z", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1040427975", 
          "https://doi.org/10.1007/s11664-007-0260-z"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-006-0008-1", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1032001994", 
          "https://doi.org/10.1007/s11664-006-0008-1"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2009-07-07", 
    "datePublishedReg": "2009-07-07", 
    "description": "This study was concerned with the effect of thermal aging on the impact properties of solder joints. Three kinds of solders, conventional Sn-37Pb solder, Sn-3.8Ag-0.7Cu solder, and Sn-3.8Ag-0.7Cu doped with rare-earth (RE) elements, were selected to manufacture joint specimens for the Charpy impact test. U-notch specimens were adopted and isothermally aged at 150\u00b0C for 100\u00a0h and 1000\u00a0h, and then impacted by using a pendulum-type impact tester at room temperature. The Sn-37Pb solder joints exhibited higher performance in terms of impact absorbed energy in the as-soldered and 100\u00a0h thermally aged conditions. Interestingly, the Sn-3.8Ag-0.7Cu solder joints exhibited improved performance for the impact value after 1000\u00a0h of thermal aging. For the Sn-37Pb and Sn-3.8Ag-0.7Cu solder joints, the impact absorbed energies initially increased when the storage duration was limited to 100\u00a0h, and then gradually decreased with its further increase. For the Sn-3.8Ag-0.7Cu-RE specimens, impact performance decreased directly with increasing thermal aging. Furthermore, scanning electron microscopy (SEM) observation showed that the fracture paths were focused on the interface zone for the three kinds of joints in the aged conditions. For the Sn-37Pb joints, the fracture surfaces mainly presented a ductile fracture mode. For the Sn-3.8Ag-0.7Cu joints, with microstructure coarsening, crack propagation partly shifted towards the \tSn/Cu6Sn5 interface. Compared with the 100\u00a0h aged joints, the area fraction of intergranular fracture of Sn grains on the Sn-3.8Ag-0.7Cu fracture surfaces was increased when the aging time was 1000\u00a0h. On the contrary, the fracture morphologies of Sn-3.8Ag-0.7Cu-RE were mainly brittle as thermal aging increased. Thus, an interrelationship between impact energy value and fracture morphology was observed.", 
    "genre": "article", 
    "id": "sg:pub.10.1007/s11664-009-0872-6", 
    "inLanguage": "en", 
    "isAccessibleForFree": false, 
    "isPartOf": [
      {
        "id": "sg:journal.1136213", 
        "issn": [
          "0361-5235", 
          "1543-186X"
        ], 
        "name": "Journal of Electronic Materials", 
        "publisher": "Springer Nature", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "10", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "38"
      }
    ], 
    "keywords": [
      "solder joints", 
      "thermal aging", 
      "fracture surfaces", 
      "fracture morphology", 
      "Sn-37Pb solder joints", 
      "ductile fracture mode", 
      "Charpy impact test", 
      "impact energy values", 
      "conventional Sn-37Pb solder", 
      "kinds of joints", 
      "strain-rate conditions", 
      "kinds of solders", 
      "pendulum-type impact tester", 
      "impact properties", 
      "intergranular fracture", 
      "notch specimens", 
      "fracture mode", 
      "Sn-37Pb joint", 
      "microstructure coarsening", 
      "fracture path", 
      "joint specimens", 
      "aged condition", 
      "impact tests", 
      "impact tester", 
      "electron microscopy observations", 
      "aged joints", 
      "Sn-37Pb solder", 
      "interface zone", 
      "solder", 
      "Absorbed Energy", 
      "impact value", 
      "area fraction", 
      "microscopy observations", 
      "high performance", 
      "improved performance", 
      "joints", 
      "room temperature", 
      "energy", 
      "surface", 
      "rare-earth elements", 
      "performance", 
      "Sn-37Pb", 
      "energy values", 
      "further increase", 
      "coarsening", 
      "morphology", 
      "specimens", 
      "tester", 
      "conditions", 
      "interface", 
      "propagation", 
      "temperature", 
      "properties", 
      "Sn", 
      "fractures", 
      "kind", 
      "zone", 
      "aging", 
      "terms of impact", 
      "mode", 
      "effect", 
      "values", 
      "test", 
      "path", 
      "storage duration", 
      "elements", 
      "fraction", 
      "impact", 
      "increase", 
      "terms", 
      "time", 
      "observations", 
      "contrary", 
      "study", 
      "duration", 
      "interrelationships", 
      "Sn/Cu6Sn5 interface", 
      "Cu6Sn5 interface", 
      "Impact Absorbed Energies"
    ], 
    "name": "Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions", 
    "pagination": "2132-2147", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1029341864"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/s11664-009-0872-6"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/s11664-009-0872-6", 
      "https://app.dimensions.ai/details/publication/pub.1029341864"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2021-11-01T18:13", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-springernature-scigraph/baseset/20211101/entities/gbq_results/article/article_481.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://doi.org/10.1007/s11664-009-0872-6"
  }
]
 

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This table displays all metadata directly associated to this object as RDF triples.

212 TRIPLES      22 PREDICATES      114 URIs      96 LITERALS      6 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/s11664-009-0872-6 schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author Nf403841b9df84dee993100c050aa8780
4 schema:citation sg:pub.10.1007/bf02675563
5 sg:pub.10.1007/s10854-006-9011-9
6 sg:pub.10.1007/s10854-006-9022-6
7 sg:pub.10.1007/s11664-004-0026-9
8 sg:pub.10.1007/s11664-006-0008-1
9 sg:pub.10.1007/s11664-006-0062-8
10 sg:pub.10.1007/s11664-007-0260-z
11 sg:pub.10.1007/s11664-008-0400-0
12 sg:pub.10.1007/s11664-008-0506-4
13 sg:pub.10.1557/jmr.2004.0371
14 schema:datePublished 2009-07-07
15 schema:datePublishedReg 2009-07-07
16 schema:description This study was concerned with the effect of thermal aging on the impact properties of solder joints. Three kinds of solders, conventional Sn-37Pb solder, Sn-3.8Ag-0.7Cu solder, and Sn-3.8Ag-0.7Cu doped with rare-earth (RE) elements, were selected to manufacture joint specimens for the Charpy impact test. U-notch specimens were adopted and isothermally aged at 150°C for 100 h and 1000 h, and then impacted by using a pendulum-type impact tester at room temperature. The Sn-37Pb solder joints exhibited higher performance in terms of impact absorbed energy in the as-soldered and 100 h thermally aged conditions. Interestingly, the Sn-3.8Ag-0.7Cu solder joints exhibited improved performance for the impact value after 1000 h of thermal aging. For the Sn-37Pb and Sn-3.8Ag-0.7Cu solder joints, the impact absorbed energies initially increased when the storage duration was limited to 100 h, and then gradually decreased with its further increase. For the Sn-3.8Ag-0.7Cu-RE specimens, impact performance decreased directly with increasing thermal aging. Furthermore, scanning electron microscopy (SEM) observation showed that the fracture paths were focused on the interface zone for the three kinds of joints in the aged conditions. For the Sn-37Pb joints, the fracture surfaces mainly presented a ductile fracture mode. For the Sn-3.8Ag-0.7Cu joints, with microstructure coarsening, crack propagation partly shifted towards the Sn/Cu6Sn5 interface. Compared with the 100 h aged joints, the area fraction of intergranular fracture of Sn grains on the Sn-3.8Ag-0.7Cu fracture surfaces was increased when the aging time was 1000 h. On the contrary, the fracture morphologies of Sn-3.8Ag-0.7Cu-RE were mainly brittle as thermal aging increased. Thus, an interrelationship between impact energy value and fracture morphology was observed.
17 schema:genre article
18 schema:inLanguage en
19 schema:isAccessibleForFree false
20 schema:isPartOf N4f769793578b4ba3a5ad669ee4dbd4cc
21 N8152134651c948f784332b1a498e61b4
22 sg:journal.1136213
23 schema:keywords Absorbed Energy
24 Charpy impact test
25 Cu6Sn5 interface
26 Impact Absorbed Energies
27 Sn
28 Sn-37Pb
29 Sn-37Pb joint
30 Sn-37Pb solder
31 Sn-37Pb solder joints
32 Sn/Cu6Sn5 interface
33 aged condition
34 aged joints
35 aging
36 area fraction
37 coarsening
38 conditions
39 contrary
40 conventional Sn-37Pb solder
41 ductile fracture mode
42 duration
43 effect
44 electron microscopy observations
45 elements
46 energy
47 energy values
48 fraction
49 fracture mode
50 fracture morphology
51 fracture path
52 fracture surfaces
53 fractures
54 further increase
55 high performance
56 impact
57 impact energy values
58 impact properties
59 impact tester
60 impact tests
61 impact value
62 improved performance
63 increase
64 interface
65 interface zone
66 intergranular fracture
67 interrelationships
68 joint specimens
69 joints
70 kind
71 kinds of joints
72 kinds of solders
73 microscopy observations
74 microstructure coarsening
75 mode
76 morphology
77 notch specimens
78 observations
79 path
80 pendulum-type impact tester
81 performance
82 propagation
83 properties
84 rare-earth elements
85 room temperature
86 solder
87 solder joints
88 specimens
89 storage duration
90 strain-rate conditions
91 study
92 surface
93 temperature
94 terms
95 terms of impact
96 test
97 tester
98 thermal aging
99 time
100 values
101 zone
102 schema:name Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions
103 schema:pagination 2132-2147
104 schema:productId N0873afcc008245d4a2a63cb90ddff895
105 N6a90812d7f1e46749c2a309081154808
106 schema:sameAs https://app.dimensions.ai/details/publication/pub.1029341864
107 https://doi.org/10.1007/s11664-009-0872-6
108 schema:sdDatePublished 2021-11-01T18:13
109 schema:sdLicense https://scigraph.springernature.com/explorer/license/
110 schema:sdPublisher Nd9d8ec6f9f1e40a586a26daa33366728
111 schema:url https://doi.org/10.1007/s11664-009-0872-6
112 sgo:license sg:explorer/license/
113 sgo:sdDataset articles
114 rdf:type schema:ScholarlyArticle
115 N0873afcc008245d4a2a63cb90ddff895 schema:name doi
116 schema:value 10.1007/s11664-009-0872-6
117 rdf:type schema:PropertyValue
118 N0f4560e5eb6d48ac8d6b8e844fd6d269 rdf:first sg:person.014361463331.82
119 rdf:rest rdf:nil
120 N10e149c6d9ca4861a9980a9417469b70 rdf:first sg:person.014627203474.59
121 rdf:rest N0f4560e5eb6d48ac8d6b8e844fd6d269
122 N4395d8a59ae343008cf140a4e17595fe rdf:first sg:person.012521025203.12
123 rdf:rest Nc4135cc974ab4d95ad7fba9734d3c98a
124 N4f769793578b4ba3a5ad669ee4dbd4cc schema:issueNumber 10
125 rdf:type schema:PublicationIssue
126 N5ee5e2492f6b428fb03e1ef478e2e868 rdf:first sg:person.010147557037.66
127 rdf:rest N4395d8a59ae343008cf140a4e17595fe
128 N6a90812d7f1e46749c2a309081154808 schema:name dimensions_id
129 schema:value pub.1029341864
130 rdf:type schema:PropertyValue
131 N8152134651c948f784332b1a498e61b4 schema:volumeNumber 38
132 rdf:type schema:PublicationVolume
133 Nc4135cc974ab4d95ad7fba9734d3c98a rdf:first sg:person.016447555263.38
134 rdf:rest N10e149c6d9ca4861a9980a9417469b70
135 Nd9d8ec6f9f1e40a586a26daa33366728 schema:name Springer Nature - SN SciGraph project
136 rdf:type schema:Organization
137 Nf403841b9df84dee993100c050aa8780 rdf:first sg:person.014056156001.08
138 rdf:rest N5ee5e2492f6b428fb03e1ef478e2e868
139 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
140 schema:name Engineering
141 rdf:type schema:DefinedTerm
142 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
143 schema:name Materials Engineering
144 rdf:type schema:DefinedTerm
145 sg:journal.1136213 schema:issn 0361-5235
146 1543-186X
147 schema:name Journal of Electronic Materials
148 schema:publisher Springer Nature
149 rdf:type schema:Periodical
150 sg:person.010147557037.66 schema:affiliation grid-institutes:grid.28703.3e
151 schema:familyName Shi
152 schema:givenName Yaowu
153 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010147557037.66
154 rdf:type schema:Person
155 sg:person.012521025203.12 schema:affiliation grid-institutes:grid.28703.3e
156 schema:familyName Lei
157 schema:givenName Yongping
158 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12
159 rdf:type schema:Person
160 sg:person.014056156001.08 schema:affiliation grid-institutes:grid.28703.3e
161 schema:familyName Zhang
162 schema:givenName Ning
163 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014056156001.08
164 rdf:type schema:Person
165 sg:person.014361463331.82 schema:affiliation grid-institutes:grid.28703.3e
166 schema:familyName Li
167 schema:givenName Xiaoyan
168 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014361463331.82
169 rdf:type schema:Person
170 sg:person.014627203474.59 schema:affiliation grid-institutes:grid.28703.3e
171 schema:familyName Guo
172 schema:givenName Fu
173 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014627203474.59
174 rdf:type schema:Person
175 sg:person.016447555263.38 schema:affiliation grid-institutes:grid.28703.3e
176 schema:familyName Xia
177 schema:givenName Zhidong
178 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016447555263.38
179 rdf:type schema:Person
180 sg:pub.10.1007/bf02675563 schema:sameAs https://app.dimensions.ai/details/publication/pub.1032508427
181 https://doi.org/10.1007/bf02675563
182 rdf:type schema:CreativeWork
183 sg:pub.10.1007/s10854-006-9011-9 schema:sameAs https://app.dimensions.ai/details/publication/pub.1011206069
184 https://doi.org/10.1007/s10854-006-9011-9
185 rdf:type schema:CreativeWork
186 sg:pub.10.1007/s10854-006-9022-6 schema:sameAs https://app.dimensions.ai/details/publication/pub.1036179418
187 https://doi.org/10.1007/s10854-006-9022-6
188 rdf:type schema:CreativeWork
189 sg:pub.10.1007/s11664-004-0026-9 schema:sameAs https://app.dimensions.ai/details/publication/pub.1019049442
190 https://doi.org/10.1007/s11664-004-0026-9
191 rdf:type schema:CreativeWork
192 sg:pub.10.1007/s11664-006-0008-1 schema:sameAs https://app.dimensions.ai/details/publication/pub.1032001994
193 https://doi.org/10.1007/s11664-006-0008-1
194 rdf:type schema:CreativeWork
195 sg:pub.10.1007/s11664-006-0062-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1017433268
196 https://doi.org/10.1007/s11664-006-0062-8
197 rdf:type schema:CreativeWork
198 sg:pub.10.1007/s11664-007-0260-z schema:sameAs https://app.dimensions.ai/details/publication/pub.1040427975
199 https://doi.org/10.1007/s11664-007-0260-z
200 rdf:type schema:CreativeWork
201 sg:pub.10.1007/s11664-008-0400-0 schema:sameAs https://app.dimensions.ai/details/publication/pub.1031759789
202 https://doi.org/10.1007/s11664-008-0400-0
203 rdf:type schema:CreativeWork
204 sg:pub.10.1007/s11664-008-0506-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1015830933
205 https://doi.org/10.1007/s11664-008-0506-4
206 rdf:type schema:CreativeWork
207 sg:pub.10.1557/jmr.2004.0371 schema:sameAs https://app.dimensions.ai/details/publication/pub.1036801596
208 https://doi.org/10.1557/jmr.2004.0371
209 rdf:type schema:CreativeWork
210 grid-institutes:grid.28703.3e schema:alternateName College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People’s Republic of China
211 schema:name College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, 100124, Beijing, People’s Republic of China
212 rdf:type schema:Organization
 




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