Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2009-05-22

AUTHORS

Wenxing Dong, Yaowu Shi, Yongping Lei, Zhidong Xia, Fu Guo

ABSTRACT

In the present work, solidification cracks in Sn-Ag-Cu solder joints were investigated. Experimental results indicate that solidification cracks existed in significant numbers in the miniature Sn-Ag-Cu solder joints. In order to create solidification cracks in the miniature solder joints during solidification and evaluate the susceptibility of Sn-Ag-Cu alloys to solidification cracking, a copper self-restraint specimen was designed, which can simulate the process of solidification crack formation. The solidification crack susceptibility of the Sn-Ag-Cu solder alloy was evaluated using the total crack length of the solder joint. In addition, the effect of trace amounts of elemental additions on solidification cracking of Sn-Ag-Cu solder joints was studied. It was found that adding trace amounts of Ni or Ce could depress the solidification cracks in Sn-3.0Ag-0.5Cu solder joints. However, P additions aggravated the formation of solidification cracks. More... »

PAGES

1906-1912

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-009-0839-7

DOI

http://dx.doi.org/10.1007/s11664-009-0839-7

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1000591107


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[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Dong", 
        "givenName": "Wenxing", 
        "id": "sg:person.016607177754.47", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016607177754.47"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Shi", 
        "givenName": "Yaowu", 
        "id": "sg:person.010147557037.66", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010147557037.66"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Lei", 
        "givenName": "Yongping", 
        "id": "sg:person.012521025203.12", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Xia", 
        "givenName": "Zhidong", 
        "id": "sg:person.016447555263.38", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016447555263.38"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.28703.3e", 
          "name": [
            "School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Guo", 
        "givenName": "Fu", 
        "id": "sg:person.014627203474.59", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014627203474.59"
        ], 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1007/s11661-007-9132-7", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1031793175", 
          "https://doi.org/10.1007/s11661-007-9132-7"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1023/a:1012482419952", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1009042430", 
          "https://doi.org/10.1023/a:1012482419952"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-005-0207-1", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1001714776", 
          "https://doi.org/10.1007/s11664-005-0207-1"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11661-997-0050-5", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1025379111", 
          "https://doi.org/10.1007/s11661-997-0050-5"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-008-0458-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1026262220", 
          "https://doi.org/10.1007/s11664-008-0458-8"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1023/a:1010597317523", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1002225173", 
          "https://doi.org/10.1023/a:1010597317523"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10854-006-9022-6", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1036179418", 
          "https://doi.org/10.1007/s10854-006-9022-6"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-006-0317-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1035478920", 
          "https://doi.org/10.1007/s11664-006-0317-4"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-006-0322-7", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1033971965", 
          "https://doi.org/10.1007/s11664-006-0322-7"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2009-05-22", 
    "datePublishedReg": "2009-05-22", 
    "description": "In the present work, solidification cracks in Sn-Ag-Cu solder joints were investigated. Experimental results indicate that solidification cracks existed in significant numbers in the miniature Sn-Ag-Cu solder joints. In order to create solidification cracks in the miniature solder joints during solidification and evaluate the susceptibility of Sn-Ag-Cu alloys to solidification cracking, a copper self-restraint specimen was designed, which can simulate the process of solidification crack formation. The solidification crack susceptibility of the Sn-Ag-Cu solder alloy was evaluated using the total crack length of the solder joint. In addition, the effect of trace amounts of elemental additions on solidification cracking of Sn-Ag-Cu solder joints was studied. It was found that adding trace amounts of Ni or Ce could depress the solidification cracks in \tSn-3.0Ag-0.5Cu solder joints. However, P additions aggravated the formation of solidification cracks.", 
    "genre": "article", 
    "id": "sg:pub.10.1007/s11664-009-0839-7", 
    "inLanguage": "en", 
    "isAccessibleForFree": false, 
    "isPartOf": [
      {
        "id": "sg:journal.1136213", 
        "issn": [
          "0361-5235", 
          "1543-186X"
        ], 
        "name": "Journal of Electronic Materials", 
        "publisher": "Springer Nature", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "9", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "38"
      }
    ], 
    "keywords": [
      "Sn-Ag", 
      "Cu solder joints", 
      "solidification cracks", 
      "solder joints", 
      "solidification cracking", 
      "Cu lead-free solder joints", 
      "lead-free solder joints", 
      "miniature solder joints", 
      "solidification crack formation", 
      "total crack length", 
      "Cu solder alloy", 
      "solder alloy", 
      "crack formation", 
      "crack length", 
      "elemental additions", 
      "cracks", 
      "cracking", 
      "solidification", 
      "joints", 
      "experimental results", 
      "present work", 
      "alloy", 
      "trace amounts", 
      "Ni", 
      "specimen", 
      "amount", 
      "formation", 
      "Cu", 
      "addition", 
      "process", 
      "work", 
      "order", 
      "results", 
      "Ce", 
      "length", 
      "effect", 
      "number", 
      "study", 
      "susceptibility", 
      "significant number", 
      "miniature Sn-Ag", 
      "copper self-restraint specimen", 
      "self-restraint specimen"
    ], 
    "name": "Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints", 
    "pagination": "1906-1912", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1000591107"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/s11664-009-0839-7"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/s11664-009-0839-7", 
      "https://app.dimensions.ai/details/publication/pub.1000591107"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2021-11-01T18:14", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-springernature-scigraph/baseset/20211101/entities/gbq_results/article/article_501.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://doi.org/10.1007/s11664-009-0839-7"
  }
]
 

Download the RDF metadata as:  json-ld nt turtle xml License info

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This table displays all metadata directly associated to this object as RDF triples.

165 TRIPLES      22 PREDICATES      77 URIs      60 LITERALS      6 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/s11664-009-0839-7 schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author N0a34aaae0c6d428eaf058067c30cbabe
4 schema:citation sg:pub.10.1007/s10854-006-9022-6
5 sg:pub.10.1007/s11661-007-9132-7
6 sg:pub.10.1007/s11661-997-0050-5
7 sg:pub.10.1007/s11664-005-0207-1
8 sg:pub.10.1007/s11664-006-0317-4
9 sg:pub.10.1007/s11664-006-0322-7
10 sg:pub.10.1007/s11664-008-0458-8
11 sg:pub.10.1023/a:1010597317523
12 sg:pub.10.1023/a:1012482419952
13 schema:datePublished 2009-05-22
14 schema:datePublishedReg 2009-05-22
15 schema:description In the present work, solidification cracks in Sn-Ag-Cu solder joints were investigated. Experimental results indicate that solidification cracks existed in significant numbers in the miniature Sn-Ag-Cu solder joints. In order to create solidification cracks in the miniature solder joints during solidification and evaluate the susceptibility of Sn-Ag-Cu alloys to solidification cracking, a copper self-restraint specimen was designed, which can simulate the process of solidification crack formation. The solidification crack susceptibility of the Sn-Ag-Cu solder alloy was evaluated using the total crack length of the solder joint. In addition, the effect of trace amounts of elemental additions on solidification cracking of Sn-Ag-Cu solder joints was studied. It was found that adding trace amounts of Ni or Ce could depress the solidification cracks in Sn-3.0Ag-0.5Cu solder joints. However, P additions aggravated the formation of solidification cracks.
16 schema:genre article
17 schema:inLanguage en
18 schema:isAccessibleForFree false
19 schema:isPartOf N3fac870439ac464195f00e9b23465c84
20 Nfbaf94f661744e5c84edfe5e6e7c9069
21 sg:journal.1136213
22 schema:keywords Ce
23 Cu
24 Cu lead-free solder joints
25 Cu solder alloy
26 Cu solder joints
27 Ni
28 Sn-Ag
29 addition
30 alloy
31 amount
32 copper self-restraint specimen
33 crack formation
34 crack length
35 cracking
36 cracks
37 effect
38 elemental additions
39 experimental results
40 formation
41 joints
42 lead-free solder joints
43 length
44 miniature Sn-Ag
45 miniature solder joints
46 number
47 order
48 present work
49 process
50 results
51 self-restraint specimen
52 significant number
53 solder alloy
54 solder joints
55 solidification
56 solidification crack formation
57 solidification cracking
58 solidification cracks
59 specimen
60 study
61 susceptibility
62 total crack length
63 trace amounts
64 work
65 schema:name Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints
66 schema:pagination 1906-1912
67 schema:productId N9458519c9b9d477ba3d2942e460b1e0a
68 Nc44fe4edce414969a37dcd9c62e4e771
69 schema:sameAs https://app.dimensions.ai/details/publication/pub.1000591107
70 https://doi.org/10.1007/s11664-009-0839-7
71 schema:sdDatePublished 2021-11-01T18:14
72 schema:sdLicense https://scigraph.springernature.com/explorer/license/
73 schema:sdPublisher N0203a5ddd63840659b41fcfa328c951a
74 schema:url https://doi.org/10.1007/s11664-009-0839-7
75 sgo:license sg:explorer/license/
76 sgo:sdDataset articles
77 rdf:type schema:ScholarlyArticle
78 N0203a5ddd63840659b41fcfa328c951a schema:name Springer Nature - SN SciGraph project
79 rdf:type schema:Organization
80 N0a34aaae0c6d428eaf058067c30cbabe rdf:first sg:person.016607177754.47
81 rdf:rest N0bce793acae8474ca2a49315b67f58e7
82 N0bce793acae8474ca2a49315b67f58e7 rdf:first sg:person.010147557037.66
83 rdf:rest N2446335d6f95440c847979cf0a10707f
84 N2446335d6f95440c847979cf0a10707f rdf:first sg:person.012521025203.12
85 rdf:rest N8076d54bb71148e099d9b1ca371539cf
86 N3fac870439ac464195f00e9b23465c84 schema:volumeNumber 38
87 rdf:type schema:PublicationVolume
88 N8076d54bb71148e099d9b1ca371539cf rdf:first sg:person.016447555263.38
89 rdf:rest N97989e44acbe47d8b9166155e93e29f8
90 N9458519c9b9d477ba3d2942e460b1e0a schema:name doi
91 schema:value 10.1007/s11664-009-0839-7
92 rdf:type schema:PropertyValue
93 N97989e44acbe47d8b9166155e93e29f8 rdf:first sg:person.014627203474.59
94 rdf:rest rdf:nil
95 Nc44fe4edce414969a37dcd9c62e4e771 schema:name dimensions_id
96 schema:value pub.1000591107
97 rdf:type schema:PropertyValue
98 Nfbaf94f661744e5c84edfe5e6e7c9069 schema:issueNumber 9
99 rdf:type schema:PublicationIssue
100 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
101 schema:name Engineering
102 rdf:type schema:DefinedTerm
103 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
104 schema:name Materials Engineering
105 rdf:type schema:DefinedTerm
106 sg:journal.1136213 schema:issn 0361-5235
107 1543-186X
108 schema:name Journal of Electronic Materials
109 schema:publisher Springer Nature
110 rdf:type schema:Periodical
111 sg:person.010147557037.66 schema:affiliation grid-institutes:grid.28703.3e
112 schema:familyName Shi
113 schema:givenName Yaowu
114 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010147557037.66
115 rdf:type schema:Person
116 sg:person.012521025203.12 schema:affiliation grid-institutes:grid.28703.3e
117 schema:familyName Lei
118 schema:givenName Yongping
119 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12
120 rdf:type schema:Person
121 sg:person.014627203474.59 schema:affiliation grid-institutes:grid.28703.3e
122 schema:familyName Guo
123 schema:givenName Fu
124 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014627203474.59
125 rdf:type schema:Person
126 sg:person.016447555263.38 schema:affiliation grid-institutes:grid.28703.3e
127 schema:familyName Xia
128 schema:givenName Zhidong
129 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016447555263.38
130 rdf:type schema:Person
131 sg:person.016607177754.47 schema:affiliation grid-institutes:grid.28703.3e
132 schema:familyName Dong
133 schema:givenName Wenxing
134 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016607177754.47
135 rdf:type schema:Person
136 sg:pub.10.1007/s10854-006-9022-6 schema:sameAs https://app.dimensions.ai/details/publication/pub.1036179418
137 https://doi.org/10.1007/s10854-006-9022-6
138 rdf:type schema:CreativeWork
139 sg:pub.10.1007/s11661-007-9132-7 schema:sameAs https://app.dimensions.ai/details/publication/pub.1031793175
140 https://doi.org/10.1007/s11661-007-9132-7
141 rdf:type schema:CreativeWork
142 sg:pub.10.1007/s11661-997-0050-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1025379111
143 https://doi.org/10.1007/s11661-997-0050-5
144 rdf:type schema:CreativeWork
145 sg:pub.10.1007/s11664-005-0207-1 schema:sameAs https://app.dimensions.ai/details/publication/pub.1001714776
146 https://doi.org/10.1007/s11664-005-0207-1
147 rdf:type schema:CreativeWork
148 sg:pub.10.1007/s11664-006-0317-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1035478920
149 https://doi.org/10.1007/s11664-006-0317-4
150 rdf:type schema:CreativeWork
151 sg:pub.10.1007/s11664-006-0322-7 schema:sameAs https://app.dimensions.ai/details/publication/pub.1033971965
152 https://doi.org/10.1007/s11664-006-0322-7
153 rdf:type schema:CreativeWork
154 sg:pub.10.1007/s11664-008-0458-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1026262220
155 https://doi.org/10.1007/s11664-008-0458-8
156 rdf:type schema:CreativeWork
157 sg:pub.10.1023/a:1010597317523 schema:sameAs https://app.dimensions.ai/details/publication/pub.1002225173
158 https://doi.org/10.1023/a:1010597317523
159 rdf:type schema:CreativeWork
160 sg:pub.10.1023/a:1012482419952 schema:sameAs https://app.dimensions.ai/details/publication/pub.1009042430
161 https://doi.org/10.1023/a:1012482419952
162 rdf:type schema:CreativeWork
163 grid-institutes:grid.28703.3e schema:alternateName School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People’s Republic of China
164 schema:name School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People’s Republic of China
165 rdf:type schema:Organization
 




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