Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy View Full Text


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Article Info

DATE

2008-04-18

AUTHORS

Wenxing Dong, Yaowu Shi, Zhidong Xia, Yongping Lei, Fu Guo

ABSTRACT

The effect of trace amounts of rare earth additions on the microstructure and properties were studied for the Sn-58Bi and Sn-58Bi-Ag solder alloys. At the same time, the intermetallic compounds (IMCs) in the solder alloys and intermetallic layer (IML) thickness at the solder/Cu substrate interface were investigated, both as-reflowed and after high-temperature aging. The results indicate that adding trace amounts of rare earth (RE) elements has little influence on the melting temperature and microhardness of the solders investigated, but adding RE elements improves the wettability and shear strength of the Sn-58Bi and Sn-58Bi-Ag solder alloys. In addition, it was found that the addition of RE elements not only refines the microstructure and size of the IMC particles, but also decreases the IML thickness and shear strength of the Sn-58Bi solder joint after high-temperature aging. Adding trace amounts of RE elements is superior to adding trace amounts of Ag for improving the properties of the Sn-58Bi solder. The reason may be related to the modification of the microstructure of the solder alloys due to the addition of trace amounts of RE elements. More... »

PAGES

982-991

References to SciGraph publications

  • 2000-11. Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2002-11. Lead-free universal solders for optical and electronic devices in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-06. Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-06-19. Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions in JOURNAL OF ELECTRONIC MATERIALS
  • 1992-06. Characterization of eutectic Sn-Bi solder joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-01-11. Electromigration-Induced Bi Segregation in Eutectic SnBi Solder Joint in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-10. Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-09-12. Rare-earth additions to lead-free electronic solders in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2005-03. Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint in JOURNAL OF ELECTRONIC MATERIALS
  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11664-008-0458-8

    DOI

    http://dx.doi.org/10.1007/s11664-008-0458-8

    DIMENSIONS

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