Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2007-10-20

AUTHORS

Dong-Xia Xu, Yong-Ping Lei, Zhi-Dong Xia, Fu Guo, Yao-Wu Shi

ABSTRACT

The selection of soldering flux plays a critical role in promoting wetting and product reliability of printed circuit board assemblies. In this study, the effects of fluxes on the wetting characteristics of the Sn-3.0Ag-0.5Cu solder alloy on Cu substrates was researched by using various flux systems at different soldering temperatures. Because of the distinct characteristic of the lead-free solder—poor wettability—three kinds of fluxes [no-clean flux with high solid content (NCF), rosin mildly activated flux (RMA) and water-soluble flux (WSF)] were chosen for the wetting experiments. The wetting time and force were the evaluating indicators. The experimental observations indicated that the wettability clearly depended on the soldering temperature and flux system when using the same solder. Furthermore, the corrosion potential of flux residues was measured by surface insulation resistance (SIR) testing. Scanning electron microscope (SEM) and energy-dispersive X-ray spectroscopy (EDS) were used to determine the contents of the flux residues and corrosion products. More... »

PAGES

125-133

References to SciGraph publications

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-007-0304-4

DOI

http://dx.doi.org/10.1007/s11664-007-0304-4

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1005728933


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