Electromigration-Induced Bi Segregation in Eutectic SnBi Solder Joint View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2007-01-11

AUTHORS

Chih-Ming Chen, Long-Tai Chen, Ya-Shiu Lin

ABSTRACT

Effects of current stressing of 6.5 × 103 A/cm2 on the eutectic SnBi solder joint at 70°C were investigated. The Bi segregation at the anode side was found, and the Bi segregation layer grew with the increasing stressing time. The Bi segregation may result in the strength reduction and the more serious Joule heating due to the brittleness and the higher resistivity of Bi, respectively. Effects of the solder microstructure and the current density on the Bi segregation were also investigated. By preannealing the solder joint at 120°C for 192 h to 360 h before current stressing, the growth rate of the Bi segregation layer was significantly reduced due to the reduction of the density of the interphase boundary. The layer growth rate was also greatly reduced by reducing the current density from 6.5 × 103 A/cm2 to 5 × 103 A/cm2. More... »

PAGES

168-172

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-006-0025-0

DOI

http://dx.doi.org/10.1007/s11664-006-0025-0

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1021249828


Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
Incoming Citations Browse incoming citations for this publication using opencitations.net

JSON-LD is the canonical representation for SciGraph data.

TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "Department of Chemical Engineering, National Chung-Hsing University, 402, Taichung, Taiwan, Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.260542.7", 
          "name": [
            "Department of Chemical Engineering, National Chung-Hsing University, 402, Taichung, Taiwan, Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Chen", 
        "givenName": "Chih-Ming", 
        "id": "sg:person.016602357507.80", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016602357507.80"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Department of Chemical Engineering, National Chung-Hsing University, 402, Taichung, Taiwan, Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.260542.7", 
          "name": [
            "Department of Chemical Engineering, National Chung-Hsing University, 402, Taichung, Taiwan, Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Chen", 
        "givenName": "Long-Tai", 
        "id": "sg:person.011161510455.14", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011161510455.14"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Department of Chemical Engineering, National Chung-Hsing University, 402, Taichung, Taiwan, Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.260542.7", 
          "name": [
            "Department of Chemical Engineering, National Chung-Hsing University, 402, Taichung, Taiwan, Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Lin", 
        "givenName": "Ya-Shiu", 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1007/s11664-005-0191-5", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1052517010", 
          "https://doi.org/10.1007/s11664-005-0191-5"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11837-003-0230-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1044784777", 
          "https://doi.org/10.1007/s11837-003-0230-8"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1557/jmr.2006.0113", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1049242745", 
          "https://doi.org/10.1557/jmr.2006.0113"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1557/jmr.2003.0355", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1024414110", 
          "https://doi.org/10.1557/jmr.2003.0355"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2007-01-11", 
    "datePublishedReg": "2007-01-11", 
    "description": "Effects of current stressing of 6.5\u00a0\u00d7\u00a0103\u00a0A/cm2 on the eutectic SnBi solder joint at 70\u00b0C were investigated. The Bi segregation at the anode side was found, and the Bi segregation layer grew with the increasing stressing time. The Bi segregation may result in the strength reduction and the more serious Joule heating due to the brittleness and the higher resistivity of Bi, respectively. Effects of the solder microstructure and the current density on the Bi segregation were also investigated. By preannealing the solder joint at 120\u00b0C for 192\u00a0h to 360\u00a0h before current stressing, the growth rate of the Bi segregation layer was significantly reduced due to the reduction of the density of the interphase boundary. The layer growth rate was also greatly reduced by reducing the current density from 6.5\u00a0\u00d7\u00a0103\u00a0A/cm2 to 5\u00a0\u00d7\u00a0103\u00a0A/cm2.", 
    "genre": "article", 
    "id": "sg:pub.10.1007/s11664-006-0025-0", 
    "inLanguage": "en", 
    "isAccessibleForFree": false, 
    "isPartOf": [
      {
        "id": "sg:journal.1136213", 
        "issn": [
          "0361-5235", 
          "1543-186X"
        ], 
        "name": "Journal of Electronic Materials", 
        "publisher": "Springer Nature", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "2", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "36"
      }
    ], 
    "keywords": [
      "eutectic SnBi solder joints", 
      "solder joints", 
      "Bi segregation", 
      "segregation layer", 
      "current stressing", 
      "current density", 
      "serious Joule heating", 
      "layer growth rate", 
      "solder microstructure", 
      "strength reduction", 
      "Joule heating", 
      "interphase boundaries", 
      "anode side", 
      "high resistivity", 
      "stressing", 
      "cm2", 
      "layer", 
      "joints", 
      "microstructure", 
      "brittleness", 
      "density", 
      "resistivity", 
      "heating", 
      "growth rate", 
      "segregation", 
      "boundaries", 
      "reduction", 
      "Bi", 
      "effect", 
      "rate", 
      "side", 
      "time", 
      "SnBi solder joint", 
      "Bi segregation layer", 
      "Electromigration-Induced Bi Segregation"
    ], 
    "name": "Electromigration-Induced Bi Segregation in Eutectic SnBi Solder Joint", 
    "pagination": "168-172", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1021249828"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/s11664-006-0025-0"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/s11664-006-0025-0", 
      "https://app.dimensions.ai/details/publication/pub.1021249828"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2022-01-01T18:17", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-springernature-scigraph/baseset/20220101/entities/gbq_results/article/article_450.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://doi.org/10.1007/s11664-006-0025-0"
  }
]
 

Download the RDF metadata as:  json-ld nt turtle xml License info

HOW TO GET THIS DATA PROGRAMMATICALLY:

JSON-LD is a popular format for linked data which is fully compatible with JSON.

curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s11664-006-0025-0'

N-Triples is a line-based linked data format ideal for batch operations.

curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s11664-006-0025-0'

Turtle is a human-readable linked data format.

curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s11664-006-0025-0'

RDF/XML is a standard XML format for linked data.

curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s11664-006-0025-0'


 

This table displays all metadata directly associated to this object as RDF triples.

122 TRIPLES      22 PREDICATES      64 URIs      52 LITERALS      6 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/s11664-006-0025-0 schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author Nee0c9552d31d4925ad13717644da6e9a
4 schema:citation sg:pub.10.1007/s11664-005-0191-5
5 sg:pub.10.1007/s11837-003-0230-8
6 sg:pub.10.1557/jmr.2003.0355
7 sg:pub.10.1557/jmr.2006.0113
8 schema:datePublished 2007-01-11
9 schema:datePublishedReg 2007-01-11
10 schema:description Effects of current stressing of 6.5 × 103 A/cm2 on the eutectic SnBi solder joint at 70°C were investigated. The Bi segregation at the anode side was found, and the Bi segregation layer grew with the increasing stressing time. The Bi segregation may result in the strength reduction and the more serious Joule heating due to the brittleness and the higher resistivity of Bi, respectively. Effects of the solder microstructure and the current density on the Bi segregation were also investigated. By preannealing the solder joint at 120°C for 192 h to 360 h before current stressing, the growth rate of the Bi segregation layer was significantly reduced due to the reduction of the density of the interphase boundary. The layer growth rate was also greatly reduced by reducing the current density from 6.5 × 103 A/cm2 to 5 × 103 A/cm2.
11 schema:genre article
12 schema:inLanguage en
13 schema:isAccessibleForFree false
14 schema:isPartOf N73c640add90244d6822b8934b7df32f2
15 Nba1dde8713cf4fc88a507caa42763ed2
16 sg:journal.1136213
17 schema:keywords Bi
18 Bi segregation
19 Bi segregation layer
20 Electromigration-Induced Bi Segregation
21 Joule heating
22 SnBi solder joint
23 anode side
24 boundaries
25 brittleness
26 cm2
27 current density
28 current stressing
29 density
30 effect
31 eutectic SnBi solder joints
32 growth rate
33 heating
34 high resistivity
35 interphase boundaries
36 joints
37 layer
38 layer growth rate
39 microstructure
40 rate
41 reduction
42 resistivity
43 segregation
44 segregation layer
45 serious Joule heating
46 side
47 solder joints
48 solder microstructure
49 strength reduction
50 stressing
51 time
52 schema:name Electromigration-Induced Bi Segregation in Eutectic SnBi Solder Joint
53 schema:pagination 168-172
54 schema:productId N44304ab7444e470f8f694542935af3d2
55 Ndb1d02c67b9649688b58fd8954405d81
56 schema:sameAs https://app.dimensions.ai/details/publication/pub.1021249828
57 https://doi.org/10.1007/s11664-006-0025-0
58 schema:sdDatePublished 2022-01-01T18:17
59 schema:sdLicense https://scigraph.springernature.com/explorer/license/
60 schema:sdPublisher Nf80ba1aba879470ba0b7975a31d131a6
61 schema:url https://doi.org/10.1007/s11664-006-0025-0
62 sgo:license sg:explorer/license/
63 sgo:sdDataset articles
64 rdf:type schema:ScholarlyArticle
65 N44304ab7444e470f8f694542935af3d2 schema:name dimensions_id
66 schema:value pub.1021249828
67 rdf:type schema:PropertyValue
68 N7379ba902d854a7c9c7e9f90c86b96c7 schema:affiliation grid-institutes:grid.260542.7
69 schema:familyName Lin
70 schema:givenName Ya-Shiu
71 rdf:type schema:Person
72 N73c640add90244d6822b8934b7df32f2 schema:issueNumber 2
73 rdf:type schema:PublicationIssue
74 Nba1dde8713cf4fc88a507caa42763ed2 schema:volumeNumber 36
75 rdf:type schema:PublicationVolume
76 Nc667984781ff4bb0a557fb9206f9533d rdf:first sg:person.011161510455.14
77 rdf:rest Nec83de3a183441af9aea46569caa457d
78 Ndb1d02c67b9649688b58fd8954405d81 schema:name doi
79 schema:value 10.1007/s11664-006-0025-0
80 rdf:type schema:PropertyValue
81 Nec83de3a183441af9aea46569caa457d rdf:first N7379ba902d854a7c9c7e9f90c86b96c7
82 rdf:rest rdf:nil
83 Nee0c9552d31d4925ad13717644da6e9a rdf:first sg:person.016602357507.80
84 rdf:rest Nc667984781ff4bb0a557fb9206f9533d
85 Nf80ba1aba879470ba0b7975a31d131a6 schema:name Springer Nature - SN SciGraph project
86 rdf:type schema:Organization
87 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
88 schema:name Engineering
89 rdf:type schema:DefinedTerm
90 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
91 schema:name Materials Engineering
92 rdf:type schema:DefinedTerm
93 sg:journal.1136213 schema:issn 0361-5235
94 1543-186X
95 schema:name Journal of Electronic Materials
96 schema:publisher Springer Nature
97 rdf:type schema:Periodical
98 sg:person.011161510455.14 schema:affiliation grid-institutes:grid.260542.7
99 schema:familyName Chen
100 schema:givenName Long-Tai
101 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011161510455.14
102 rdf:type schema:Person
103 sg:person.016602357507.80 schema:affiliation grid-institutes:grid.260542.7
104 schema:familyName Chen
105 schema:givenName Chih-Ming
106 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016602357507.80
107 rdf:type schema:Person
108 sg:pub.10.1007/s11664-005-0191-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1052517010
109 https://doi.org/10.1007/s11664-005-0191-5
110 rdf:type schema:CreativeWork
111 sg:pub.10.1007/s11837-003-0230-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1044784777
112 https://doi.org/10.1007/s11837-003-0230-8
113 rdf:type schema:CreativeWork
114 sg:pub.10.1557/jmr.2003.0355 schema:sameAs https://app.dimensions.ai/details/publication/pub.1024414110
115 https://doi.org/10.1557/jmr.2003.0355
116 rdf:type schema:CreativeWork
117 sg:pub.10.1557/jmr.2006.0113 schema:sameAs https://app.dimensions.ai/details/publication/pub.1049242745
118 https://doi.org/10.1557/jmr.2006.0113
119 rdf:type schema:CreativeWork
120 grid-institutes:grid.260542.7 schema:alternateName Department of Chemical Engineering, National Chung-Hsing University, 402, Taichung, Taiwan, Republic of China
121 schema:name Department of Chemical Engineering, National Chung-Hsing University, 402, Taichung, Taiwan, Republic of China
122 rdf:type schema:Organization
 




Preview window. Press ESC to close (or click here)


...