Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2005-03

AUTHORS

Bo Li, Yaowu Shi, Yongping Lei, Fu Guo, Zhidong Xia, Bin Zong

ABSTRACT

The effects of minimal rare earth (RE) element additions on the microstructure of Sn-Ag-Cu solder joint, especially the intermetallic compounds (IMCs), were investigated. The range of RE content in Sn-Ag-Cu alloys varied from 0 wt.% to 0.25 wt.%. Experimental results showed that IMCs could be dramatically repressed with the appropriate addition of RE, resulting in a fine microstructure. However, there existed an effective range for the RE addition. The best RE content was found to be 0.1 wt.% in the current study. In addition to the typical morphology of Ag3Sn and Cu6Sn5 IMCs, other types of IMCs that have irregular morphology and uncertain constituents were also observed. The IMCs with large plate shape mainly contained Ag and Sn, but the content of Ag was much lower than that of Ag3Sn. The cross sections of Cu6Sn5 IMCs whiskers showed various morphologies. Furthermore, some eutectic-like structures, including lamellar-, rod-, and needle-like phases, were observed. The morphology of eutectic-like structure was related to the RE content in solder alloys. When the content of RE is 0.1 wt.%, the needle-like phase was dominant, while the lamellar structure prevailed when the RE content was 0.05 wt.% or 0.25 wt.%. It is suggested that the morphology change of the eutectic-like structure directly affects the creep properties of the solder joint. More... »

PAGES

217-224

References to SciGraph publications

  • 1987-05. The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solder in JOURNAL OF ELECTRONIC MATERIALS
  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11664-005-0207-1

    DOI

    http://dx.doi.org/10.1007/s11664-005-0207-1

    DIMENSIONS

    https://app.dimensions.ai/details/publication/pub.1001714776


    Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
    Incoming Citations Browse incoming citations for this publication using opencitations.net

    JSON-LD is the canonical representation for SciGraph data.

    TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

    [
      {
        "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
        "about": [
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Engineering", 
            "type": "DefinedTerm"
          }, 
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Materials Engineering", 
            "type": "DefinedTerm"
          }
        ], 
        "author": [
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Li", 
            "givenName": "Bo", 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Shi", 
            "givenName": "Yaowu", 
            "id": "sg:person.010147557037.66", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010147557037.66"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Lei", 
            "givenName": "Yongping", 
            "id": "sg:person.012521025203.12", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Guo", 
            "givenName": "Fu", 
            "id": "sg:person.014627203474.59", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014627203474.59"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Xia", 
            "givenName": "Zhidong", 
            "id": "sg:person.016447555263.38", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016447555263.38"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People\u2019s Republic of China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Zong", 
            "givenName": "Bin", 
            "id": "sg:person.012327160305.32", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012327160305.32"
            ], 
            "type": "Person"
          }
        ], 
        "citation": [
          {
            "id": "sg:pub.10.1007/bf02655484", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1018340688", 
              "https://doi.org/10.1007/bf02655484"
            ], 
            "type": "CreativeWork"
          }
        ], 
        "datePublished": "2005-03", 
        "datePublishedReg": "2005-03-01", 
        "description": "The effects of minimal rare earth (RE) element additions on the microstructure of Sn-Ag-Cu solder joint, especially the intermetallic compounds (IMCs), were investigated. The range of RE content in Sn-Ag-Cu alloys varied from 0 wt.% to 0.25 wt.%. Experimental results showed that IMCs could be dramatically repressed with the appropriate addition of RE, resulting in a fine microstructure. However, there existed an effective range for the RE addition. The best RE content was found to be 0.1 wt.% in the current study. In addition to the typical morphology of Ag3Sn and Cu6Sn5 IMCs, other types of IMCs that have irregular morphology and uncertain constituents were also observed. The IMCs with large plate shape mainly contained Ag and Sn, but the content of Ag was much lower than that of Ag3Sn. The cross sections of Cu6Sn5 IMCs whiskers showed various morphologies. Furthermore, some eutectic-like structures, including lamellar-, rod-, and needle-like phases, were observed. The morphology of eutectic-like structure was related to the RE content in solder alloys. When the content of RE is 0.1 wt.%, the needle-like phase was dominant, while the lamellar structure prevailed when the RE content was 0.05 wt.% or 0.25 wt.%. It is suggested that the morphology change of the eutectic-like structure directly affects the creep properties of the solder joint.", 
        "genre": "article", 
        "id": "sg:pub.10.1007/s11664-005-0207-1", 
        "inLanguage": "en", 
        "isAccessibleForFree": false, 
        "isPartOf": [
          {
            "id": "sg:journal.1136213", 
            "issn": [
              "0361-5235", 
              "1543-186X"
            ], 
            "name": "Journal of Electronic Materials", 
            "publisher": "Springer Nature", 
            "type": "Periodical"
          }, 
          {
            "issueNumber": "3", 
            "type": "PublicationIssue"
          }, 
          {
            "type": "PublicationVolume", 
            "volumeNumber": "34"
          }
        ], 
        "keywords": [
          "eutectic-like structure", 
          "needle-like phase", 
          "Sn-Ag", 
          "rare earth element additions", 
          "Cu solder joints", 
          "solder joints", 
          "intermetallic compounds", 
          "element additions", 
          "RE content", 
          "types of IMCs", 
          "Cu6Sn5 intermetallic compounds", 
          "fine microstructure", 
          "creep properties", 
          "content of Ag", 
          "RE addition", 
          "content of RE", 
          "microstructure", 
          "appropriate addition", 
          "Ag3Sn", 
          "plate shape", 
          "lamellar structure", 
          "experimental results", 
          "irregular morphology", 
          "morphology changes", 
          "joints", 
          "morphology", 
          "solder", 
          "wt", 
          "Re", 
          "whiskers", 
          "effective range", 
          "structure", 
          "Ag", 
          "phase", 
          "typical morphology", 
          "content", 
          "properties", 
          "range", 
          "Sn", 
          "rods", 
          "cross sections", 
          "shape", 
          "addition", 
          "Cu", 
          "effect", 
          "results", 
          "constituents", 
          "sections", 
          "types", 
          "study", 
          "changes", 
          "compounds", 
          "current study", 
          "minimal rare earth (RE) element additions", 
          "earth (RE) element additions", 
          "best RE content", 
          "uncertain constituents", 
          "large plate shape", 
          "Cu6Sn5 IMCs whiskers", 
          "IMCs whiskers"
        ], 
        "name": "Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint", 
        "pagination": "217-224", 
        "productId": [
          {
            "name": "dimensions_id", 
            "type": "PropertyValue", 
            "value": [
              "pub.1001714776"
            ]
          }, 
          {
            "name": "doi", 
            "type": "PropertyValue", 
            "value": [
              "10.1007/s11664-005-0207-1"
            ]
          }
        ], 
        "sameAs": [
          "https://doi.org/10.1007/s11664-005-0207-1", 
          "https://app.dimensions.ai/details/publication/pub.1001714776"
        ], 
        "sdDataset": "articles", 
        "sdDatePublished": "2021-11-01T18:08", 
        "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
        "sdPublisher": {
          "name": "Springer Nature - SN SciGraph project", 
          "type": "Organization"
        }, 
        "sdSource": "s3://com-springernature-scigraph/baseset/20211101/entities/gbq_results/article/article_407.jsonl", 
        "type": "ScholarlyArticle", 
        "url": "https://doi.org/10.1007/s11664-005-0207-1"
      }
    ]
     

    Download the RDF metadata as:  json-ld nt turtle xml License info

    HOW TO GET THIS DATA PROGRAMMATICALLY:

    JSON-LD is a popular format for linked data which is fully compatible with JSON.

    curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s11664-005-0207-1'

    N-Triples is a line-based linked data format ideal for batch operations.

    curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s11664-005-0207-1'

    Turtle is a human-readable linked data format.

    curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s11664-005-0207-1'

    RDF/XML is a standard XML format for linked data.

    curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s11664-005-0207-1'


     

    This table displays all metadata directly associated to this object as RDF triples.

    156 TRIPLES      22 PREDICATES      87 URIs      78 LITERALS      6 BLANK NODES

    Subject Predicate Object
    1 sg:pub.10.1007/s11664-005-0207-1 schema:about anzsrc-for:09
    2 anzsrc-for:0912
    3 schema:author N99463a9d2475484aa05aaec7cce67065
    4 schema:citation sg:pub.10.1007/bf02655484
    5 schema:datePublished 2005-03
    6 schema:datePublishedReg 2005-03-01
    7 schema:description The effects of minimal rare earth (RE) element additions on the microstructure of Sn-Ag-Cu solder joint, especially the intermetallic compounds (IMCs), were investigated. The range of RE content in Sn-Ag-Cu alloys varied from 0 wt.% to 0.25 wt.%. Experimental results showed that IMCs could be dramatically repressed with the appropriate addition of RE, resulting in a fine microstructure. However, there existed an effective range for the RE addition. The best RE content was found to be 0.1 wt.% in the current study. In addition to the typical morphology of Ag3Sn and Cu6Sn5 IMCs, other types of IMCs that have irregular morphology and uncertain constituents were also observed. The IMCs with large plate shape mainly contained Ag and Sn, but the content of Ag was much lower than that of Ag3Sn. The cross sections of Cu6Sn5 IMCs whiskers showed various morphologies. Furthermore, some eutectic-like structures, including lamellar-, rod-, and needle-like phases, were observed. The morphology of eutectic-like structure was related to the RE content in solder alloys. When the content of RE is 0.1 wt.%, the needle-like phase was dominant, while the lamellar structure prevailed when the RE content was 0.05 wt.% or 0.25 wt.%. It is suggested that the morphology change of the eutectic-like structure directly affects the creep properties of the solder joint.
    8 schema:genre article
    9 schema:inLanguage en
    10 schema:isAccessibleForFree false
    11 schema:isPartOf N0ac1fff94ae64f9c9d01da0ef71390d7
    12 N5513d6881b0040e6978480a56cfe4490
    13 sg:journal.1136213
    14 schema:keywords Ag
    15 Ag3Sn
    16 Cu
    17 Cu solder joints
    18 Cu6Sn5 IMCs whiskers
    19 Cu6Sn5 intermetallic compounds
    20 IMCs whiskers
    21 RE addition
    22 RE content
    23 Re
    24 Sn
    25 Sn-Ag
    26 addition
    27 appropriate addition
    28 best RE content
    29 changes
    30 compounds
    31 constituents
    32 content
    33 content of Ag
    34 content of RE
    35 creep properties
    36 cross sections
    37 current study
    38 earth (RE) element additions
    39 effect
    40 effective range
    41 element additions
    42 eutectic-like structure
    43 experimental results
    44 fine microstructure
    45 intermetallic compounds
    46 irregular morphology
    47 joints
    48 lamellar structure
    49 large plate shape
    50 microstructure
    51 minimal rare earth (RE) element additions
    52 morphology
    53 morphology changes
    54 needle-like phase
    55 phase
    56 plate shape
    57 properties
    58 range
    59 rare earth element additions
    60 results
    61 rods
    62 sections
    63 shape
    64 solder
    65 solder joints
    66 structure
    67 study
    68 types
    69 types of IMCs
    70 typical morphology
    71 uncertain constituents
    72 whiskers
    73 wt
    74 schema:name Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint
    75 schema:pagination 217-224
    76 schema:productId N205c5a005283494283c6ceb1eebbcdd5
    77 N73e804cffcc54d7a93ce44a8c6b3d825
    78 schema:sameAs https://app.dimensions.ai/details/publication/pub.1001714776
    79 https://doi.org/10.1007/s11664-005-0207-1
    80 schema:sdDatePublished 2021-11-01T18:08
    81 schema:sdLicense https://scigraph.springernature.com/explorer/license/
    82 schema:sdPublisher Ncc3eae1480104768aad9addf6aac6438
    83 schema:url https://doi.org/10.1007/s11664-005-0207-1
    84 sgo:license sg:explorer/license/
    85 sgo:sdDataset articles
    86 rdf:type schema:ScholarlyArticle
    87 N0ac1fff94ae64f9c9d01da0ef71390d7 schema:issueNumber 3
    88 rdf:type schema:PublicationIssue
    89 N205c5a005283494283c6ceb1eebbcdd5 schema:name doi
    90 schema:value 10.1007/s11664-005-0207-1
    91 rdf:type schema:PropertyValue
    92 N2ccb806950d0460194791c35b591cd86 rdf:first sg:person.014627203474.59
    93 rdf:rest N76b73b7ea6cd45bba0e72fed39e51547
    94 N32e4ec53543846ed80f14cf32125b40e rdf:first sg:person.010147557037.66
    95 rdf:rest Ne2ae15a4f9aa4e3a8cb55e14c0d3414c
    96 N381d17ad67c64f238e01204c82df5699 schema:affiliation grid-institutes:grid.28703.3e
    97 schema:familyName Li
    98 schema:givenName Bo
    99 rdf:type schema:Person
    100 N5513d6881b0040e6978480a56cfe4490 schema:volumeNumber 34
    101 rdf:type schema:PublicationVolume
    102 N73e804cffcc54d7a93ce44a8c6b3d825 schema:name dimensions_id
    103 schema:value pub.1001714776
    104 rdf:type schema:PropertyValue
    105 N76b73b7ea6cd45bba0e72fed39e51547 rdf:first sg:person.016447555263.38
    106 rdf:rest Nb9531f80745443b89de0c5626afa3858
    107 N99463a9d2475484aa05aaec7cce67065 rdf:first N381d17ad67c64f238e01204c82df5699
    108 rdf:rest N32e4ec53543846ed80f14cf32125b40e
    109 Nb9531f80745443b89de0c5626afa3858 rdf:first sg:person.012327160305.32
    110 rdf:rest rdf:nil
    111 Ncc3eae1480104768aad9addf6aac6438 schema:name Springer Nature - SN SciGraph project
    112 rdf:type schema:Organization
    113 Ne2ae15a4f9aa4e3a8cb55e14c0d3414c rdf:first sg:person.012521025203.12
    114 rdf:rest N2ccb806950d0460194791c35b591cd86
    115 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
    116 schema:name Engineering
    117 rdf:type schema:DefinedTerm
    118 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
    119 schema:name Materials Engineering
    120 rdf:type schema:DefinedTerm
    121 sg:journal.1136213 schema:issn 0361-5235
    122 1543-186X
    123 schema:name Journal of Electronic Materials
    124 schema:publisher Springer Nature
    125 rdf:type schema:Periodical
    126 sg:person.010147557037.66 schema:affiliation grid-institutes:grid.28703.3e
    127 schema:familyName Shi
    128 schema:givenName Yaowu
    129 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010147557037.66
    130 rdf:type schema:Person
    131 sg:person.012327160305.32 schema:affiliation grid-institutes:grid.28703.3e
    132 schema:familyName Zong
    133 schema:givenName Bin
    134 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012327160305.32
    135 rdf:type schema:Person
    136 sg:person.012521025203.12 schema:affiliation grid-institutes:grid.28703.3e
    137 schema:familyName Lei
    138 schema:givenName Yongping
    139 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12
    140 rdf:type schema:Person
    141 sg:person.014627203474.59 schema:affiliation grid-institutes:grid.28703.3e
    142 schema:familyName Guo
    143 schema:givenName Fu
    144 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014627203474.59
    145 rdf:type schema:Person
    146 sg:person.016447555263.38 schema:affiliation grid-institutes:grid.28703.3e
    147 schema:familyName Xia
    148 schema:givenName Zhidong
    149 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016447555263.38
    150 rdf:type schema:Person
    151 sg:pub.10.1007/bf02655484 schema:sameAs https://app.dimensions.ai/details/publication/pub.1018340688
    152 https://doi.org/10.1007/bf02655484
    153 rdf:type schema:CreativeWork
    154 grid-institutes:grid.28703.3e schema:alternateName College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People’s Republic of China
    155 schema:name College of Materials Science and Engineering, Beijing University of Technology, Chaoyang District, 100022, Beijing, People’s Republic of China
    156 rdf:type schema:Organization
     




    Preview window. Press ESC to close (or click here)


    ...