Positron-defect profiling in Cd1−xZnxTe wafers after saw cutting View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2003-06

AUTHORS

Sean P. Mcneil, Kelvin G. Lynn, Marc H. Weber, Csaba Szeles, Raji Soundararajan

ABSTRACT

Near-surface damage induced by saw cutting of ingots of Cd1−xZnxTe was investigated by positron-defect depth profiling. The damage extends to several micrometers depth and depends on the cutting apparatus. The samples were polished and etched repeatedly, followed each time by positron-depth profiling. New subsurface damage created during the polishing process is observed. No new damage is observed after etching. Positron-depth profiling is suggested as a diagnostic tool to monitor the quality of sample surfaces. More... »

PAGES

583-585

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-003-0145-8

DOI

http://dx.doi.org/10.1007/s11664-003-0145-8

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1006818152


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