Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2002-10

AUTHORS

Z. G. Chen, Y. W. Shi, Z. D. Xia, Y. F. Yan

ABSTRACT

This paper focused on the microstructure of SnAgCu-rare earth (RE) solder alloy and its small single-lap joints, focusing on phases present and the distribution of RE in the SnAgCu solder. Energy dispersive x-ray (EDX) analysis was used to observed the RE-rich phase. The RE atoms also tended to aggregate at boundaries of primary dendrites in the joints and form as a weblike structure, which surrounded the dendrites and restrained the dendrites from sliding or moving. It is assumed that this would strengthen the boundaries and increase the resistance to creep deformation of the solder matrix. The creep-rupture life of joints can be remarkably increased, at least seven times more than that of SnAgCu at room temperature. The aggregation mechanism of RE at dendrite boundaries in SnAgCu solder joints was presented. The drive for RE atoms to aggregate at the boundary is the difference of the lattice-aberration energy between the interior and the boundaries of the dendrites, which is caused by a solution of RE atoms. More... »

PAGES

1122-1128

References to SciGraph publications

  • 2000-10. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys in JOURNAL OF ELECTRONIC MATERIALS
  • 2001-02. Trends and issues in Pb-free soldering for electronic packaging in E & I ELEKTROTECHNIK UND INFORMATIONSTECHNIK
  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11664-002-0052-4

    DOI

    http://dx.doi.org/10.1007/s11664-002-0052-4

    DIMENSIONS

    https://app.dimensions.ai/details/publication/pub.1011569755


    Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
    Incoming Citations Browse incoming citations for this publication using opencitations.net

    JSON-LD is the canonical representation for SciGraph data.

    TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

    [
      {
        "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
        "about": [
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Engineering", 
            "type": "DefinedTerm"
          }, 
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Materials Engineering", 
            "type": "DefinedTerm"
          }
        ], 
        "author": [
          {
            "affiliation": {
              "alternateName": "The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing Polytechnic University, 100022, Beijing, Republic of China", 
              "id": "http://www.grid.ac/institutes/grid.454828.7", 
              "name": [
                "The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing Polytechnic University, 100022, Beijing, Republic of China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Chen", 
            "givenName": "Z. G.", 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing Polytechnic University, 100022, Beijing, Republic of China", 
              "id": "http://www.grid.ac/institutes/grid.454828.7", 
              "name": [
                "The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing Polytechnic University, 100022, Beijing, Republic of China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Shi", 
            "givenName": "Y. W.", 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing Polytechnic University, 100022, Beijing, Republic of China", 
              "id": "http://www.grid.ac/institutes/grid.454828.7", 
              "name": [
                "The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing Polytechnic University, 100022, Beijing, Republic of China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Xia", 
            "givenName": "Z. D.", 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing Polytechnic University, 100022, Beijing, Republic of China", 
              "id": "http://www.grid.ac/institutes/grid.454828.7", 
              "name": [
                "The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing Polytechnic University, 100022, Beijing, Republic of China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Yan", 
            "givenName": "Y. F.", 
            "type": "Person"
          }
        ], 
        "citation": [
          {
            "id": "sg:pub.10.1007/s11664-000-0003-x", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1005303947", 
              "https://doi.org/10.1007/s11664-000-0003-x"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/bf03157756", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1022974539", 
              "https://doi.org/10.1007/bf03157756"
            ], 
            "type": "CreativeWork"
          }
        ], 
        "datePublished": "2002-10", 
        "datePublishedReg": "2002-10-01", 
        "description": "This paper focused on the microstructure of SnAgCu-rare earth (RE) solder alloy and its small single-lap joints, focusing on phases present and the distribution of RE in the SnAgCu solder. Energy dispersive x-ray (EDX) analysis was used to observed the RE-rich phase. The RE atoms also tended to aggregate at boundaries of primary dendrites in the joints and form as a weblike structure, which surrounded the dendrites and restrained the dendrites from sliding or moving. It is assumed that this would strengthen the boundaries and increase the resistance to creep deformation of the solder matrix. The creep-rupture life of joints can be remarkably increased, at least seven times more than that of SnAgCu at room temperature. The aggregation mechanism of RE at dendrite boundaries in SnAgCu solder joints was presented. The drive for RE atoms to aggregate at the boundary is the difference of the lattice-aberration energy between the interior and the boundaries of the dendrites, which is caused by a solution of RE atoms.", 
        "genre": "article", 
        "id": "sg:pub.10.1007/s11664-002-0052-4", 
        "inLanguage": "en", 
        "isAccessibleForFree": false, 
        "isPartOf": [
          {
            "id": "sg:journal.1136213", 
            "issn": [
              "0361-5235", 
              "1543-186X"
            ], 
            "name": "Journal of Electronic Materials", 
            "publisher": "Springer Nature", 
            "type": "Periodical"
          }, 
          {
            "issueNumber": "10", 
            "type": "PublicationIssue"
          }, 
          {
            "type": "PublicationVolume", 
            "volumeNumber": "31"
          }
        ], 
        "keywords": [
          "single-lap joints", 
          "creep-rupture life", 
          "SnAgCu solder joints", 
          "RE-rich phase", 
          "dendrite boundaries", 
          "solder alloy", 
          "soldered joints", 
          "solder joints", 
          "SnAgCu solder", 
          "solder matrix", 
          "energy dispersive X", 
          "dispersive X", 
          "microstructure", 
          "joints", 
          "room temperature", 
          "boundaries", 
          "SnAgCu", 
          "solder", 
          "alloy", 
          "deformation", 
          "distribution of Re", 
          "weblike structure", 
          "ray analysis", 
          "Re", 
          "primary dendrites", 
          "RE atoms", 
          "phase", 
          "temperature", 
          "energy", 
          "matrix", 
          "drive", 
          "resistance", 
          "solution", 
          "dendrites", 
          "structure", 
          "interior", 
          "distribution", 
          "aggregation mechanism", 
          "time", 
          "atoms", 
          "analysis", 
          "mechanism", 
          "form", 
          "life", 
          "differences", 
          "paper", 
          "SnAgCu-rare earth (RE) solder alloy", 
          "earth (RE) solder alloy", 
          "small single-lap joints", 
          "lattice-aberration energy", 
          "novel lead-free solder alloy SnAgCu-RE", 
          "lead-free solder alloy SnAgCu-RE", 
          "solder alloy SnAgCu-RE", 
          "alloy SnAgCu-RE", 
          "SnAgCu-RE"
        ], 
        "name": "Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints", 
        "pagination": "1122-1128", 
        "productId": [
          {
            "name": "dimensions_id", 
            "type": "PropertyValue", 
            "value": [
              "pub.1011569755"
            ]
          }, 
          {
            "name": "doi", 
            "type": "PropertyValue", 
            "value": [
              "10.1007/s11664-002-0052-4"
            ]
          }
        ], 
        "sameAs": [
          "https://doi.org/10.1007/s11664-002-0052-4", 
          "https://app.dimensions.ai/details/publication/pub.1011569755"
        ], 
        "sdDataset": "articles", 
        "sdDatePublished": "2022-01-01T18:12", 
        "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
        "sdPublisher": {
          "name": "Springer Nature - SN SciGraph project", 
          "type": "Organization"
        }, 
        "sdSource": "s3://com-springernature-scigraph/baseset/20220101/entities/gbq_results/article/article_359.jsonl", 
        "type": "ScholarlyArticle", 
        "url": "https://doi.org/10.1007/s11664-002-0052-4"
      }
    ]
     

    Download the RDF metadata as:  json-ld nt turtle xml License info

    HOW TO GET THIS DATA PROGRAMMATICALLY:

    JSON-LD is a popular format for linked data which is fully compatible with JSON.

    curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s11664-002-0052-4'

    N-Triples is a line-based linked data format ideal for batch operations.

    curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s11664-002-0052-4'

    Turtle is a human-readable linked data format.

    curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s11664-002-0052-4'

    RDF/XML is a standard XML format for linked data.

    curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s11664-002-0052-4'


     

    This table displays all metadata directly associated to this object as RDF triples.

    138 TRIPLES      22 PREDICATES      83 URIs      73 LITERALS      6 BLANK NODES

    Subject Predicate Object
    1 sg:pub.10.1007/s11664-002-0052-4 schema:about anzsrc-for:09
    2 anzsrc-for:0912
    3 schema:author N16806abdba3048b9aa1f1d89dac3e1e0
    4 schema:citation sg:pub.10.1007/bf03157756
    5 sg:pub.10.1007/s11664-000-0003-x
    6 schema:datePublished 2002-10
    7 schema:datePublishedReg 2002-10-01
    8 schema:description This paper focused on the microstructure of SnAgCu-rare earth (RE) solder alloy and its small single-lap joints, focusing on phases present and the distribution of RE in the SnAgCu solder. Energy dispersive x-ray (EDX) analysis was used to observed the RE-rich phase. The RE atoms also tended to aggregate at boundaries of primary dendrites in the joints and form as a weblike structure, which surrounded the dendrites and restrained the dendrites from sliding or moving. It is assumed that this would strengthen the boundaries and increase the resistance to creep deformation of the solder matrix. The creep-rupture life of joints can be remarkably increased, at least seven times more than that of SnAgCu at room temperature. The aggregation mechanism of RE at dendrite boundaries in SnAgCu solder joints was presented. The drive for RE atoms to aggregate at the boundary is the difference of the lattice-aberration energy between the interior and the boundaries of the dendrites, which is caused by a solution of RE atoms.
    9 schema:genre article
    10 schema:inLanguage en
    11 schema:isAccessibleForFree false
    12 schema:isPartOf N1d92a1df453c4fbb88bd7dd9e8192044
    13 N7ec9cfe955204f42a386fd2bd69cca64
    14 sg:journal.1136213
    15 schema:keywords RE atoms
    16 RE-rich phase
    17 Re
    18 SnAgCu
    19 SnAgCu solder
    20 SnAgCu solder joints
    21 SnAgCu-RE
    22 SnAgCu-rare earth (RE) solder alloy
    23 aggregation mechanism
    24 alloy
    25 alloy SnAgCu-RE
    26 analysis
    27 atoms
    28 boundaries
    29 creep-rupture life
    30 deformation
    31 dendrite boundaries
    32 dendrites
    33 differences
    34 dispersive X
    35 distribution
    36 distribution of Re
    37 drive
    38 earth (RE) solder alloy
    39 energy
    40 energy dispersive X
    41 form
    42 interior
    43 joints
    44 lattice-aberration energy
    45 lead-free solder alloy SnAgCu-RE
    46 life
    47 matrix
    48 mechanism
    49 microstructure
    50 novel lead-free solder alloy SnAgCu-RE
    51 paper
    52 phase
    53 primary dendrites
    54 ray analysis
    55 resistance
    56 room temperature
    57 single-lap joints
    58 small single-lap joints
    59 solder
    60 solder alloy
    61 solder alloy SnAgCu-RE
    62 solder joints
    63 solder matrix
    64 soldered joints
    65 solution
    66 structure
    67 temperature
    68 time
    69 weblike structure
    70 schema:name Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints
    71 schema:pagination 1122-1128
    72 schema:productId N8bf5a867b63a4bc7a03d6d1d545747cb
    73 Ncae1b5650658417398a52c8dc14f2e65
    74 schema:sameAs https://app.dimensions.ai/details/publication/pub.1011569755
    75 https://doi.org/10.1007/s11664-002-0052-4
    76 schema:sdDatePublished 2022-01-01T18:12
    77 schema:sdLicense https://scigraph.springernature.com/explorer/license/
    78 schema:sdPublisher N8f2788b7cce945988783896b431dddc5
    79 schema:url https://doi.org/10.1007/s11664-002-0052-4
    80 sgo:license sg:explorer/license/
    81 sgo:sdDataset articles
    82 rdf:type schema:ScholarlyArticle
    83 N165543568770488d97c917b0d2c0d8d6 rdf:first Ne9614288e17743d996f80da2473392dd
    84 rdf:rest rdf:nil
    85 N16806abdba3048b9aa1f1d89dac3e1e0 rdf:first N85d8d29c199a47ae86fa69d88bfb9353
    86 rdf:rest Nd824f19c43f24f4c806ed4cf362c79d0
    87 N1d92a1df453c4fbb88bd7dd9e8192044 schema:issueNumber 10
    88 rdf:type schema:PublicationIssue
    89 N5f717e7b591f40b89aef38aa5282bedb rdf:first Nfd941203f127461e99c8c53fc4998813
    90 rdf:rest N165543568770488d97c917b0d2c0d8d6
    91 N7ec9cfe955204f42a386fd2bd69cca64 schema:volumeNumber 31
    92 rdf:type schema:PublicationVolume
    93 N85d8d29c199a47ae86fa69d88bfb9353 schema:affiliation grid-institutes:grid.454828.7
    94 schema:familyName Chen
    95 schema:givenName Z. G.
    96 rdf:type schema:Person
    97 N8bf5a867b63a4bc7a03d6d1d545747cb schema:name doi
    98 schema:value 10.1007/s11664-002-0052-4
    99 rdf:type schema:PropertyValue
    100 N8f2788b7cce945988783896b431dddc5 schema:name Springer Nature - SN SciGraph project
    101 rdf:type schema:Organization
    102 Ncae1b5650658417398a52c8dc14f2e65 schema:name dimensions_id
    103 schema:value pub.1011569755
    104 rdf:type schema:PropertyValue
    105 Nd824f19c43f24f4c806ed4cf362c79d0 rdf:first Ne75db19f9a1d4e1fb86997c6ee908748
    106 rdf:rest N5f717e7b591f40b89aef38aa5282bedb
    107 Ne75db19f9a1d4e1fb86997c6ee908748 schema:affiliation grid-institutes:grid.454828.7
    108 schema:familyName Shi
    109 schema:givenName Y. W.
    110 rdf:type schema:Person
    111 Ne9614288e17743d996f80da2473392dd schema:affiliation grid-institutes:grid.454828.7
    112 schema:familyName Yan
    113 schema:givenName Y. F.
    114 rdf:type schema:Person
    115 Nfd941203f127461e99c8c53fc4998813 schema:affiliation grid-institutes:grid.454828.7
    116 schema:familyName Xia
    117 schema:givenName Z. D.
    118 rdf:type schema:Person
    119 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
    120 schema:name Engineering
    121 rdf:type schema:DefinedTerm
    122 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
    123 schema:name Materials Engineering
    124 rdf:type schema:DefinedTerm
    125 sg:journal.1136213 schema:issn 0361-5235
    126 1543-186X
    127 schema:name Journal of Electronic Materials
    128 schema:publisher Springer Nature
    129 rdf:type schema:Periodical
    130 sg:pub.10.1007/bf03157756 schema:sameAs https://app.dimensions.ai/details/publication/pub.1022974539
    131 https://doi.org/10.1007/bf03157756
    132 rdf:type schema:CreativeWork
    133 sg:pub.10.1007/s11664-000-0003-x schema:sameAs https://app.dimensions.ai/details/publication/pub.1005303947
    134 https://doi.org/10.1007/s11664-000-0003-x
    135 rdf:type schema:CreativeWork
    136 grid-institutes:grid.454828.7 schema:alternateName The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing Polytechnic University, 100022, Beijing, Republic of China
    137 schema:name The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing Polytechnic University, 100022, Beijing, Republic of China
    138 rdf:type schema:Organization
     




    Preview window. Press ESC to close (or click here)


    ...