Plastic deformation and interfacial sliding in Al and Cu thin film: Si substrate systems due to thermal cycling View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2001-12

AUTHORS

I. Dutta, M. W. Chen, K. Peterson, T. Shultz

ABSTRACT

As a result of the large difference in thermal expansion coefficients between metal and Si, high stresses can develop in thin metallic films attached to Si substrates in microelectronic devices during thermal excursions experienced in processing steps or during usage. These stresses may induce plastic deformation of the thin films accompanied by creep and interfacial sliding, and have a pronounced effect on the reliability of microelectronic devices and components. Even though various methods have been proposed to study thermal stress, methodologies for studying plastic deformation of thin films are not well established. Here, we report the results of a study of plastic deformation and interfacial sliding of thin Al and Cu films on Si substrates during thermal cycling. Cross-sectional profiles of pattern-grown Al and Cu films of nominally 250 nm thickness were measured before and after thermal cycling by employing an atomic force microscope. Through statistical analysis, the size changes of the thin films induced by thermal cycling were determined. Finite element (FE) analyses were conducted to compute the stress and strain states within the thin film and at the interface, and the results were utilized to interpret the atomic force microscopy (AFM) observations. Experiments revealed that, following thermal cycling, Al films expanded relative to the Si substrate, whereas Cu films shrank, resulting in an alteration of the film-footprint on the substrate in both cases. Based on the FE calculations, this was attributed to net inelastic deformation of the thin films via creep and yielding, with the deformation being accommodated at the interface by diffusion-controlled interfacial sliding. More... »

PAGES

1537-1548

References to SciGraph publications

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11664-001-0171-3

DOI

http://dx.doi.org/10.1007/s11664-001-0171-3

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1001271212


Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
Incoming Citations Browse incoming citations for this publication using opencitations.net

JSON-LD is the canonical representation for SciGraph data.

TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, 93943, Monterey, CA", 
          "id": "http://www.grid.ac/institutes/grid.1108.8", 
          "name": [
            "Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, 93943, Monterey, CA"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Dutta", 
        "givenName": "I.", 
        "id": "sg:person.01160237434.34", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.01160237434.34"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, 93943, Monterey, CA", 
          "id": "http://www.grid.ac/institutes/grid.1108.8", 
          "name": [
            "Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, 93943, Monterey, CA"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Chen", 
        "givenName": "M. W.", 
        "id": "sg:person.015125211260.19", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015125211260.19"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, 93943, Monterey, CA", 
          "id": "http://www.grid.ac/institutes/grid.1108.8", 
          "name": [
            "Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, 93943, Monterey, CA"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Peterson", 
        "givenName": "K.", 
        "id": "sg:person.011177024277.06", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011177024277.06"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, 93943, Monterey, CA", 
          "id": "http://www.grid.ac/institutes/grid.1108.8", 
          "name": [
            "Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, 93943, Monterey, CA"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Shultz", 
        "givenName": "T.", 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1557/jmr.1993.1845", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1033288255", 
          "https://doi.org/10.1557/jmr.1993.1845"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1557/proc-564-373", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1067945306", 
          "https://doi.org/10.1557/proc-564-373"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-997-0253-y", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1053518902", 
          "https://doi.org/10.1007/s11664-997-0253-y"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1557/jmr.1995.1200", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1013748989", 
          "https://doi.org/10.1557/jmr.1995.1200"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/bf02666659", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1028696296", 
          "https://doi.org/10.1007/bf02666659"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2001-12", 
    "datePublishedReg": "2001-12-01", 
    "description": "As a result of the large difference in thermal expansion coefficients between metal and Si, high stresses can develop in thin metallic films attached to Si substrates in microelectronic devices during thermal excursions experienced in processing steps or during usage. These stresses may induce plastic deformation of the thin films accompanied by creep and interfacial sliding, and have a pronounced effect on the reliability of microelectronic devices and components. Even though various methods have been proposed to study thermal stress, methodologies for studying plastic deformation of thin films are not well established. Here, we report the results of a study of plastic deformation and interfacial sliding of thin Al and Cu films on Si substrates during thermal cycling. Cross-sectional profiles of pattern-grown Al and Cu films of nominally 250 nm thickness were measured before and after thermal cycling by employing an atomic force microscope. Through statistical analysis, the size changes of the thin films induced by thermal cycling were determined. Finite element (FE) analyses were conducted to compute the stress and strain states within the thin film and at the interface, and the results were utilized to interpret the atomic force microscopy (AFM) observations. Experiments revealed that, following thermal cycling, Al films expanded relative to the Si substrate, whereas Cu films shrank, resulting in an alteration of the film-footprint on the substrate in both cases. Based on the FE calculations, this was attributed to net inelastic deformation of the thin films via creep and yielding, with the deformation being accommodated at the interface by diffusion-controlled interfacial sliding.", 
    "genre": "article", 
    "id": "sg:pub.10.1007/s11664-001-0171-3", 
    "isAccessibleForFree": false, 
    "isPartOf": [
      {
        "id": "sg:journal.1136213", 
        "issn": [
          "0361-5235", 
          "1543-186X"
        ], 
        "name": "Journal of Electronic Materials", 
        "publisher": "Springer Nature", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "12", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "30"
      }
    ], 
    "keywords": [
      "interfacial sliding", 
      "plastic deformation", 
      "thermal cycling", 
      "Si substrate", 
      "thin films", 
      "Cu films", 
      "microelectronic devices", 
      "Si substrate system", 
      "finite element analysis", 
      "Cu thin films", 
      "thermal expansion coefficient", 
      "thin metallic films", 
      "atomic force microscope", 
      "atomic force microscopy observations", 
      "inelastic deformation", 
      "FE calculations", 
      "element analysis", 
      "Al films", 
      "cross-sectional profile", 
      "thermal excursions", 
      "substrate system", 
      "thermal stress", 
      "metallic films", 
      "force microscope", 
      "thin Al", 
      "deformation", 
      "high stress", 
      "expansion coefficient", 
      "films", 
      "sliding", 
      "microscopy observations", 
      "creep", 
      "substrate", 
      "devices", 
      "interface", 
      "stress", 
      "cycling", 
      "Si", 
      "thickness", 
      "al", 
      "microscope", 
      "metals", 
      "results", 
      "coefficient", 
      "size changes", 
      "reliability", 
      "pronounced effect", 
      "large differences", 
      "calculations", 
      "methodology", 
      "system", 
      "experiments", 
      "method", 
      "analysis", 
      "components", 
      "step", 
      "usage", 
      "profile", 
      "effect", 
      "excursion", 
      "observations", 
      "state", 
      "statistical analysis", 
      "cases", 
      "changes", 
      "study", 
      "differences", 
      "alterations"
    ], 
    "name": "Plastic deformation and interfacial sliding in Al and Cu thin film: Si substrate systems due to thermal cycling", 
    "pagination": "1537-1548", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1001271212"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/s11664-001-0171-3"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/s11664-001-0171-3", 
      "https://app.dimensions.ai/details/publication/pub.1001271212"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2022-11-24T20:49", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-springernature-scigraph/baseset/20221124/entities/gbq_results/article/article_319.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://doi.org/10.1007/s11664-001-0171-3"
  }
]
 

Download the RDF metadata as:  json-ld nt turtle xml License info

HOW TO GET THIS DATA PROGRAMMATICALLY:

JSON-LD is a popular format for linked data which is fully compatible with JSON.

curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s11664-001-0171-3'

N-Triples is a line-based linked data format ideal for batch operations.

curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s11664-001-0171-3'

Turtle is a human-readable linked data format.

curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s11664-001-0171-3'

RDF/XML is a standard XML format for linked data.

curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s11664-001-0171-3'


 

This table displays all metadata directly associated to this object as RDF triples.

165 TRIPLES      21 PREDICATES      98 URIs      85 LITERALS      6 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/s11664-001-0171-3 schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author Nf33ab9a336ec40c3b823af22bc53476c
4 schema:citation sg:pub.10.1007/bf02666659
5 sg:pub.10.1007/s11664-997-0253-y
6 sg:pub.10.1557/jmr.1993.1845
7 sg:pub.10.1557/jmr.1995.1200
8 sg:pub.10.1557/proc-564-373
9 schema:datePublished 2001-12
10 schema:datePublishedReg 2001-12-01
11 schema:description As a result of the large difference in thermal expansion coefficients between metal and Si, high stresses can develop in thin metallic films attached to Si substrates in microelectronic devices during thermal excursions experienced in processing steps or during usage. These stresses may induce plastic deformation of the thin films accompanied by creep and interfacial sliding, and have a pronounced effect on the reliability of microelectronic devices and components. Even though various methods have been proposed to study thermal stress, methodologies for studying plastic deformation of thin films are not well established. Here, we report the results of a study of plastic deformation and interfacial sliding of thin Al and Cu films on Si substrates during thermal cycling. Cross-sectional profiles of pattern-grown Al and Cu films of nominally 250 nm thickness were measured before and after thermal cycling by employing an atomic force microscope. Through statistical analysis, the size changes of the thin films induced by thermal cycling were determined. Finite element (FE) analyses were conducted to compute the stress and strain states within the thin film and at the interface, and the results were utilized to interpret the atomic force microscopy (AFM) observations. Experiments revealed that, following thermal cycling, Al films expanded relative to the Si substrate, whereas Cu films shrank, resulting in an alteration of the film-footprint on the substrate in both cases. Based on the FE calculations, this was attributed to net inelastic deformation of the thin films via creep and yielding, with the deformation being accommodated at the interface by diffusion-controlled interfacial sliding.
12 schema:genre article
13 schema:isAccessibleForFree false
14 schema:isPartOf N97792708234343ba874959f789ac9257
15 Nbe4a2d7b1bc14c0eb21fd447a0f6b00a
16 sg:journal.1136213
17 schema:keywords Al films
18 Cu films
19 Cu thin films
20 FE calculations
21 Si
22 Si substrate
23 Si substrate system
24 al
25 alterations
26 analysis
27 atomic force microscope
28 atomic force microscopy observations
29 calculations
30 cases
31 changes
32 coefficient
33 components
34 creep
35 cross-sectional profile
36 cycling
37 deformation
38 devices
39 differences
40 effect
41 element analysis
42 excursion
43 expansion coefficient
44 experiments
45 films
46 finite element analysis
47 force microscope
48 high stress
49 inelastic deformation
50 interface
51 interfacial sliding
52 large differences
53 metallic films
54 metals
55 method
56 methodology
57 microelectronic devices
58 microscope
59 microscopy observations
60 observations
61 plastic deformation
62 profile
63 pronounced effect
64 reliability
65 results
66 size changes
67 sliding
68 state
69 statistical analysis
70 step
71 stress
72 study
73 substrate
74 substrate system
75 system
76 thermal cycling
77 thermal excursions
78 thermal expansion coefficient
79 thermal stress
80 thickness
81 thin Al
82 thin films
83 thin metallic films
84 usage
85 schema:name Plastic deformation and interfacial sliding in Al and Cu thin film: Si substrate systems due to thermal cycling
86 schema:pagination 1537-1548
87 schema:productId N7e4f76e9a9ff443eb3865cca8e22cfbb
88 Nc23c786fbe404f0db8c531d858f33af7
89 schema:sameAs https://app.dimensions.ai/details/publication/pub.1001271212
90 https://doi.org/10.1007/s11664-001-0171-3
91 schema:sdDatePublished 2022-11-24T20:49
92 schema:sdLicense https://scigraph.springernature.com/explorer/license/
93 schema:sdPublisher Ne133ced9783247358b2672f88b0abac0
94 schema:url https://doi.org/10.1007/s11664-001-0171-3
95 sgo:license sg:explorer/license/
96 sgo:sdDataset articles
97 rdf:type schema:ScholarlyArticle
98 N7e4f76e9a9ff443eb3865cca8e22cfbb schema:name doi
99 schema:value 10.1007/s11664-001-0171-3
100 rdf:type schema:PropertyValue
101 N847c9f90365c484ba9b9ebc7f83dc400 rdf:first Nde81944bb2e14e23abea895e39e9c574
102 rdf:rest rdf:nil
103 N97792708234343ba874959f789ac9257 schema:volumeNumber 30
104 rdf:type schema:PublicationVolume
105 Na7b9cc697f774b08895a80e820c90a47 rdf:first sg:person.015125211260.19
106 rdf:rest Nfdfab84ce3024503abd9ff5a0193cff5
107 Nbe4a2d7b1bc14c0eb21fd447a0f6b00a schema:issueNumber 12
108 rdf:type schema:PublicationIssue
109 Nc23c786fbe404f0db8c531d858f33af7 schema:name dimensions_id
110 schema:value pub.1001271212
111 rdf:type schema:PropertyValue
112 Nde81944bb2e14e23abea895e39e9c574 schema:affiliation grid-institutes:grid.1108.8
113 schema:familyName Shultz
114 schema:givenName T.
115 rdf:type schema:Person
116 Ne133ced9783247358b2672f88b0abac0 schema:name Springer Nature - SN SciGraph project
117 rdf:type schema:Organization
118 Nf33ab9a336ec40c3b823af22bc53476c rdf:first sg:person.01160237434.34
119 rdf:rest Na7b9cc697f774b08895a80e820c90a47
120 Nfdfab84ce3024503abd9ff5a0193cff5 rdf:first sg:person.011177024277.06
121 rdf:rest N847c9f90365c484ba9b9ebc7f83dc400
122 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
123 schema:name Engineering
124 rdf:type schema:DefinedTerm
125 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
126 schema:name Materials Engineering
127 rdf:type schema:DefinedTerm
128 sg:journal.1136213 schema:issn 0361-5235
129 1543-186X
130 schema:name Journal of Electronic Materials
131 schema:publisher Springer Nature
132 rdf:type schema:Periodical
133 sg:person.011177024277.06 schema:affiliation grid-institutes:grid.1108.8
134 schema:familyName Peterson
135 schema:givenName K.
136 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011177024277.06
137 rdf:type schema:Person
138 sg:person.01160237434.34 schema:affiliation grid-institutes:grid.1108.8
139 schema:familyName Dutta
140 schema:givenName I.
141 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.01160237434.34
142 rdf:type schema:Person
143 sg:person.015125211260.19 schema:affiliation grid-institutes:grid.1108.8
144 schema:familyName Chen
145 schema:givenName M. W.
146 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015125211260.19
147 rdf:type schema:Person
148 sg:pub.10.1007/bf02666659 schema:sameAs https://app.dimensions.ai/details/publication/pub.1028696296
149 https://doi.org/10.1007/bf02666659
150 rdf:type schema:CreativeWork
151 sg:pub.10.1007/s11664-997-0253-y schema:sameAs https://app.dimensions.ai/details/publication/pub.1053518902
152 https://doi.org/10.1007/s11664-997-0253-y
153 rdf:type schema:CreativeWork
154 sg:pub.10.1557/jmr.1993.1845 schema:sameAs https://app.dimensions.ai/details/publication/pub.1033288255
155 https://doi.org/10.1557/jmr.1993.1845
156 rdf:type schema:CreativeWork
157 sg:pub.10.1557/jmr.1995.1200 schema:sameAs https://app.dimensions.ai/details/publication/pub.1013748989
158 https://doi.org/10.1557/jmr.1995.1200
159 rdf:type schema:CreativeWork
160 sg:pub.10.1557/proc-564-373 schema:sameAs https://app.dimensions.ai/details/publication/pub.1067945306
161 https://doi.org/10.1557/proc-564-373
162 rdf:type schema:CreativeWork
163 grid-institutes:grid.1108.8 schema:alternateName Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, 93943, Monterey, CA
164 schema:name Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, 93943, Monterey, CA
165 rdf:type schema:Organization
 




Preview window. Press ESC to close (or click here)


...