Significance of Interface Design Aspects and Characteristics in Cu/SiCp Composites Fabricated by the Powder Metallurgy Route View Full Text


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Article Info

DATE

2019-04

AUTHORS

T. S. Kavithaa, L. Rangaraj, S. S. Avadhani

ABSTRACT

The research focuses on the interfacial design characteristics of Cu/SiCp composites by the provision of a metallic (NiP2) and a ceramic oxide (Y2O3) coating on SiCp for achieving better barrier or wetting properties. The research work further aims at the optimization of the powder metallurgy (PM) process parameters for compaction of interface-tailored Cu/SiCp composites. The microstructural and thermal property evaluation of the developed Cu/SiCp composite systems is described. The research evidences the best achievable thermal properties of developed Cu/SiCp composites and emphasizes the possible feasibility of establishing a materials development strategy toward their successful implementation as a novel thermal management material for aerospace electronic packages. More... »

PAGES

1902-1913

References to SciGraph publications

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s11661-018-5089-y

DOI

http://dx.doi.org/10.1007/s11661-018-5089-y

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1111370779


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