Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy View Full Text


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Article Info

DATE

2009-06-13

AUTHORS

Hu Hao, Yaowu Shi, Zhidong Xia, Yongping Lei, Fu Guo

ABSTRACT

Rapid tin whisker growth has been found in Sn-3.8Ag-0.7Cu1.0Er solder joints. The morphology of the tin whiskers changes from rodlike to threadlike when the storage temperature increases from 25 °C to 150 °C. The compressive stress induced by the lattice expansion of the oxidized ErSn3 phase provides the driving force and the tin atoms released from the oxidization of the ErSn3 phase provide the material source for the tin whisker growth. More... »

PAGES

2016-2021

References to SciGraph publications

  • 2006-09-22. Impact of the ROHS Directive on high-performance electronic systems in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2007-09-11. Tin Whisker Growth Induced by High Electron Current Density in JOURNAL OF ELECTRONIC MATERIALS
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    http://scigraph.springernature.com/pub.10.1007/s11661-009-9871-8

    DOI

    http://dx.doi.org/10.1007/s11661-009-9871-8

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