Strain Measurements of Silicon Dioxide Microspecimens by Digital Imaging Processing View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2007-10

AUTHORS

W. N. Sharpe, J. Pulskamp, D. S. Gianola, C. Eberl, R. G. Polcawich, R. J. Thompson

ABSTRACT

Silicon dioxide thin film is a common component in electronic devices and in MEMS, but its mechanical properties have rarely been studied. Techniques have been adapted and developed to conduct tensile tests on 1.0 μm thick silicon dioxide specimens that are 100, 150, and 200 μm wide and either 1 or 2 mm long. One end of the specimen remains fastened to the substrate, and the other is glued to a silicon carbide fiber attached to a 30 g load cell mounted on a piezoelectric translation stage. Strain is measured by digital imaging of two gold lines applied to the gage section of the transparent specimen. Twenty-five tests yield a Young’s modulus of 60.1 ± 3.4 GPa and a fracture strength of 364 ± 57 MPa. More... »

PAGES

649-658

References to SciGraph publications

  • 2004-09. Techniques for testing thin films in tension in EXPERIMENTAL TECHNIQUES
  • 2002-03. In-situ tensile testing of nano-scale specimens in SEM and TEM in EXPERIMENTAL MECHANICS
  • 1999-09. Tensile testing of polysilicon in EXPERIMENTAL MECHANICS
  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s11340-006-9010-z

    DOI

    http://dx.doi.org/10.1007/s11340-006-9010-z

    DIMENSIONS

    https://app.dimensions.ai/details/publication/pub.1047118935


    Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
    Incoming Citations Browse incoming citations for this publication using opencitations.net

    JSON-LD is the canonical representation for SciGraph data.

    TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

    [
      {
        "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
        "about": [
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Materials Engineering", 
            "type": "DefinedTerm"
          }, 
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Engineering", 
            "type": "DefinedTerm"
          }
        ], 
        "author": [
          {
            "affiliation": {
              "alternateName": "Johns Hopkins University", 
              "id": "https://www.grid.ac/institutes/grid.21107.35", 
              "name": [
                "Department of Mechanical Engineering, Johns Hopkins University, 21218, Baltimore, MD, USA"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Sharpe", 
            "givenName": "W. N.", 
            "id": "sg:person.011226451175.09", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011226451175.09"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "United States Army Research Laboratory", 
              "id": "https://www.grid.ac/institutes/grid.420282.e", 
              "name": [
                "Sensors and Electron Devices Directorate, US Army Research Laboratory, 20783, Adelphi, MD, USA"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Pulskamp", 
            "givenName": "J.", 
            "id": "sg:person.014745633027.76", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014745633027.76"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "Johns Hopkins University", 
              "id": "https://www.grid.ac/institutes/grid.21107.35", 
              "name": [
                "Department of Mechanical Engineering, Johns Hopkins University, 21218, Baltimore, MD, USA"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Gianola", 
            "givenName": "D. S.", 
            "id": "sg:person.01333375201.44", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.01333375201.44"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "Johns Hopkins University", 
              "id": "https://www.grid.ac/institutes/grid.21107.35", 
              "name": [
                "Department of Mechanical Engineering, Johns Hopkins University, 21218, Baltimore, MD, USA"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Eberl", 
            "givenName": "C.", 
            "id": "sg:person.0600070001.02", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.0600070001.02"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "United States Army Research Laboratory", 
              "id": "https://www.grid.ac/institutes/grid.420282.e", 
              "name": [
                "Sensors and Electron Devices Directorate, US Army Research Laboratory, 20783, Adelphi, MD, USA"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Polcawich", 
            "givenName": "R. G.", 
            "id": "sg:person.01105505275.87", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.01105505275.87"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "Johns Hopkins University", 
              "id": "https://www.grid.ac/institutes/grid.21107.35", 
              "name": [
                "Department of Mechanical Engineering, Johns Hopkins University, 21218, Baltimore, MD, USA"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Thompson", 
            "givenName": "R. J.", 
            "type": "Person"
          }
        ], 
        "citation": [
          {
            "id": "https://doi.org/10.1016/s0304-3991(02)00089-x", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1006890854"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1111/j.1747-1567.2004.tb00182.x", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1007386825", 
              "https://doi.org/10.1111/j.1747-1567.2004.tb00182.x"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1111/j.1747-1567.2004.tb00182.x", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1007386825", 
              "https://doi.org/10.1111/j.1747-1567.2004.tb00182.x"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/bf02323548", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1009096758", 
              "https://doi.org/10.1007/bf02323548"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/bf02323548", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1009096758", 
              "https://doi.org/10.1007/bf02323548"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/bf02411059", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1017494670", 
              "https://doi.org/10.1007/bf02411059"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/bf02411059", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1017494670", 
              "https://doi.org/10.1007/bf02411059"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1016/s1359-6454(99)00294-3", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1021979228"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1557/jmr.1988.0931", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1022182547"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1557/jmr.1993.1542", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1022936379"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1016/s0924-4247(99)00363-5", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1027315928"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1016/s0040-6090(96)09346-7", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1045788009"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1117/12.395616", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1049345328"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1016/j.jmps.2003.07.001", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1053255170"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1063/1.1708831", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1057777655"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1063/1.325870", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1057926251"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1063/1.370146", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1058004234"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1109/84.623107", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1061240586"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1109/84.946774", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1061240830"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1109/jmems.2003.814130", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1061289795"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1109/proc.1982.12331", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1061444988"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1109/proc.1982.12331", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1061444988"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1109/proc.1982.12331", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1061444988"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1109/proc.1982.12331", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1061444988"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1116/1.1319691", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1062165734"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1520/stp10994s", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1088513221"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1109/memsys.1997.581921", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1094595432"
            ], 
            "type": "CreativeWork"
          }
        ], 
        "datePublished": "2007-10", 
        "datePublishedReg": "2007-10-01", 
        "description": "Silicon dioxide thin film is a common component in electronic devices and in MEMS, but its mechanical properties have rarely been studied. Techniques have been adapted and developed to conduct tensile tests on 1.0 \u03bcm thick silicon dioxide specimens that are 100, 150, and 200 \u03bcm wide and either 1 or 2 mm long. One end of the specimen remains fastened to the substrate, and the other is glued to a silicon carbide fiber attached to a 30 g load cell mounted on a piezoelectric translation stage. Strain is measured by digital imaging of two gold lines applied to the gage section of the transparent specimen. Twenty-five tests yield a Young\u2019s modulus of 60.1 \u00b1 3.4 GPa and a fracture strength of 364 \u00b1 57 MPa.", 
        "genre": "research_article", 
        "id": "sg:pub.10.1007/s11340-006-9010-z", 
        "inLanguage": [
          "en"
        ], 
        "isAccessibleForFree": false, 
        "isPartOf": [
          {
            "id": "sg:journal.1039819", 
            "issn": [
              "0014-4851", 
              "1741-2765"
            ], 
            "name": "Experimental Mechanics", 
            "type": "Periodical"
          }, 
          {
            "issueNumber": "5", 
            "type": "PublicationIssue"
          }, 
          {
            "type": "PublicationVolume", 
            "volumeNumber": "47"
          }
        ], 
        "name": "Strain Measurements of Silicon Dioxide Microspecimens by Digital Imaging Processing", 
        "pagination": "649-658", 
        "productId": [
          {
            "name": "readcube_id", 
            "type": "PropertyValue", 
            "value": [
              "e075b3a2d76596c2e92ca2bb298300c708cd19d16b5f69843aa530aa1f67fb54"
            ]
          }, 
          {
            "name": "doi", 
            "type": "PropertyValue", 
            "value": [
              "10.1007/s11340-006-9010-z"
            ]
          }, 
          {
            "name": "dimensions_id", 
            "type": "PropertyValue", 
            "value": [
              "pub.1047118935"
            ]
          }
        ], 
        "sameAs": [
          "https://doi.org/10.1007/s11340-006-9010-z", 
          "https://app.dimensions.ai/details/publication/pub.1047118935"
        ], 
        "sdDataset": "articles", 
        "sdDatePublished": "2019-04-10T23:27", 
        "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
        "sdPublisher": {
          "name": "Springer Nature - SN SciGraph project", 
          "type": "Organization"
        }, 
        "sdSource": "s3://com-uberresearch-data-dimensions-target-20181106-alternative/cleanup/v134/2549eaecd7973599484d7c17b260dba0a4ecb94b/merge/v9/a6c9fde33151104705d4d7ff012ea9563521a3ce/jats-lookup/v90/0000000001_0000000264/records_8693_00000524.jsonl", 
        "type": "ScholarlyArticle", 
        "url": "http://link.springer.com/10.1007%2Fs11340-006-9010-z"
      }
    ]
     

    Download the RDF metadata as:  json-ld nt turtle xml License info

    HOW TO GET THIS DATA PROGRAMMATICALLY:

    JSON-LD is a popular format for linked data which is fully compatible with JSON.

    curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s11340-006-9010-z'

    N-Triples is a line-based linked data format ideal for batch operations.

    curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s11340-006-9010-z'

    Turtle is a human-readable linked data format.

    curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s11340-006-9010-z'

    RDF/XML is a standard XML format for linked data.

    curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s11340-006-9010-z'


     

    This table displays all metadata directly associated to this object as RDF triples.

    164 TRIPLES      21 PREDICATES      48 URIs      19 LITERALS      7 BLANK NODES

    Subject Predicate Object
    1 sg:pub.10.1007/s11340-006-9010-z schema:about anzsrc-for:09
    2 anzsrc-for:0912
    3 schema:author N65fb21158a6d430397c487b099160ca7
    4 schema:citation sg:pub.10.1007/bf02323548
    5 sg:pub.10.1007/bf02411059
    6 sg:pub.10.1111/j.1747-1567.2004.tb00182.x
    7 https://doi.org/10.1016/j.jmps.2003.07.001
    8 https://doi.org/10.1016/s0040-6090(96)09346-7
    9 https://doi.org/10.1016/s0304-3991(02)00089-x
    10 https://doi.org/10.1016/s0924-4247(99)00363-5
    11 https://doi.org/10.1016/s1359-6454(99)00294-3
    12 https://doi.org/10.1063/1.1708831
    13 https://doi.org/10.1063/1.325870
    14 https://doi.org/10.1063/1.370146
    15 https://doi.org/10.1109/84.623107
    16 https://doi.org/10.1109/84.946774
    17 https://doi.org/10.1109/jmems.2003.814130
    18 https://doi.org/10.1109/memsys.1997.581921
    19 https://doi.org/10.1109/proc.1982.12331
    20 https://doi.org/10.1116/1.1319691
    21 https://doi.org/10.1117/12.395616
    22 https://doi.org/10.1520/stp10994s
    23 https://doi.org/10.1557/jmr.1988.0931
    24 https://doi.org/10.1557/jmr.1993.1542
    25 schema:datePublished 2007-10
    26 schema:datePublishedReg 2007-10-01
    27 schema:description Silicon dioxide thin film is a common component in electronic devices and in MEMS, but its mechanical properties have rarely been studied. Techniques have been adapted and developed to conduct tensile tests on 1.0 μm thick silicon dioxide specimens that are 100, 150, and 200 μm wide and either 1 or 2 mm long. One end of the specimen remains fastened to the substrate, and the other is glued to a silicon carbide fiber attached to a 30 g load cell mounted on a piezoelectric translation stage. Strain is measured by digital imaging of two gold lines applied to the gage section of the transparent specimen. Twenty-five tests yield a Young’s modulus of 60.1 ± 3.4 GPa and a fracture strength of 364 ± 57 MPa.
    28 schema:genre research_article
    29 schema:inLanguage en
    30 schema:isAccessibleForFree false
    31 schema:isPartOf N2797425e2cea4398b9bbfa0bfe33f29f
    32 Nf7fa88e5fc7c4b2dbaeb716225ea966e
    33 sg:journal.1039819
    34 schema:name Strain Measurements of Silicon Dioxide Microspecimens by Digital Imaging Processing
    35 schema:pagination 649-658
    36 schema:productId N256246b3f0964009a3a45fd8f6cc2e26
    37 N8f221a6de73f4935ad14b6ced16b1351
    38 Nf8721f6a87eb42f698ff327d8c927979
    39 schema:sameAs https://app.dimensions.ai/details/publication/pub.1047118935
    40 https://doi.org/10.1007/s11340-006-9010-z
    41 schema:sdDatePublished 2019-04-10T23:27
    42 schema:sdLicense https://scigraph.springernature.com/explorer/license/
    43 schema:sdPublisher Nfec8dd2ed5f94854b3e4c0d697047cee
    44 schema:url http://link.springer.com/10.1007%2Fs11340-006-9010-z
    45 sgo:license sg:explorer/license/
    46 sgo:sdDataset articles
    47 rdf:type schema:ScholarlyArticle
    48 N02e7dc517739414192e447fd8df560f0 rdf:first sg:person.01333375201.44
    49 rdf:rest N6da7e8b7597841cc8435b3f61c92ec2e
    50 N256246b3f0964009a3a45fd8f6cc2e26 schema:name dimensions_id
    51 schema:value pub.1047118935
    52 rdf:type schema:PropertyValue
    53 N2797425e2cea4398b9bbfa0bfe33f29f schema:issueNumber 5
    54 rdf:type schema:PublicationIssue
    55 N5d432e90d6a6420eb3bcc6532bcc82d5 schema:affiliation https://www.grid.ac/institutes/grid.21107.35
    56 schema:familyName Thompson
    57 schema:givenName R. J.
    58 rdf:type schema:Person
    59 N65fb21158a6d430397c487b099160ca7 rdf:first sg:person.011226451175.09
    60 rdf:rest Nb39be85fe3aa4c72a5412b3366b33e6e
    61 N6da7e8b7597841cc8435b3f61c92ec2e rdf:first sg:person.0600070001.02
    62 rdf:rest Nc1ef6bbf1e3e4b72811fd9526e8d67d0
    63 N8f221a6de73f4935ad14b6ced16b1351 schema:name readcube_id
    64 schema:value e075b3a2d76596c2e92ca2bb298300c708cd19d16b5f69843aa530aa1f67fb54
    65 rdf:type schema:PropertyValue
    66 Nb39be85fe3aa4c72a5412b3366b33e6e rdf:first sg:person.014745633027.76
    67 rdf:rest N02e7dc517739414192e447fd8df560f0
    68 Nc1ef6bbf1e3e4b72811fd9526e8d67d0 rdf:first sg:person.01105505275.87
    69 rdf:rest Nc47ea6fb1eea4e229ca8a0b3776ca629
    70 Nc47ea6fb1eea4e229ca8a0b3776ca629 rdf:first N5d432e90d6a6420eb3bcc6532bcc82d5
    71 rdf:rest rdf:nil
    72 Nf7fa88e5fc7c4b2dbaeb716225ea966e schema:volumeNumber 47
    73 rdf:type schema:PublicationVolume
    74 Nf8721f6a87eb42f698ff327d8c927979 schema:name doi
    75 schema:value 10.1007/s11340-006-9010-z
    76 rdf:type schema:PropertyValue
    77 Nfec8dd2ed5f94854b3e4c0d697047cee schema:name Springer Nature - SN SciGraph project
    78 rdf:type schema:Organization
    79 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
    80 schema:name Engineering
    81 rdf:type schema:DefinedTerm
    82 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
    83 schema:name Materials Engineering
    84 rdf:type schema:DefinedTerm
    85 sg:journal.1039819 schema:issn 0014-4851
    86 1741-2765
    87 schema:name Experimental Mechanics
    88 rdf:type schema:Periodical
    89 sg:person.01105505275.87 schema:affiliation https://www.grid.ac/institutes/grid.420282.e
    90 schema:familyName Polcawich
    91 schema:givenName R. G.
    92 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.01105505275.87
    93 rdf:type schema:Person
    94 sg:person.011226451175.09 schema:affiliation https://www.grid.ac/institutes/grid.21107.35
    95 schema:familyName Sharpe
    96 schema:givenName W. N.
    97 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011226451175.09
    98 rdf:type schema:Person
    99 sg:person.01333375201.44 schema:affiliation https://www.grid.ac/institutes/grid.21107.35
    100 schema:familyName Gianola
    101 schema:givenName D. S.
    102 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.01333375201.44
    103 rdf:type schema:Person
    104 sg:person.014745633027.76 schema:affiliation https://www.grid.ac/institutes/grid.420282.e
    105 schema:familyName Pulskamp
    106 schema:givenName J.
    107 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014745633027.76
    108 rdf:type schema:Person
    109 sg:person.0600070001.02 schema:affiliation https://www.grid.ac/institutes/grid.21107.35
    110 schema:familyName Eberl
    111 schema:givenName C.
    112 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.0600070001.02
    113 rdf:type schema:Person
    114 sg:pub.10.1007/bf02323548 schema:sameAs https://app.dimensions.ai/details/publication/pub.1009096758
    115 https://doi.org/10.1007/bf02323548
    116 rdf:type schema:CreativeWork
    117 sg:pub.10.1007/bf02411059 schema:sameAs https://app.dimensions.ai/details/publication/pub.1017494670
    118 https://doi.org/10.1007/bf02411059
    119 rdf:type schema:CreativeWork
    120 sg:pub.10.1111/j.1747-1567.2004.tb00182.x schema:sameAs https://app.dimensions.ai/details/publication/pub.1007386825
    121 https://doi.org/10.1111/j.1747-1567.2004.tb00182.x
    122 rdf:type schema:CreativeWork
    123 https://doi.org/10.1016/j.jmps.2003.07.001 schema:sameAs https://app.dimensions.ai/details/publication/pub.1053255170
    124 rdf:type schema:CreativeWork
    125 https://doi.org/10.1016/s0040-6090(96)09346-7 schema:sameAs https://app.dimensions.ai/details/publication/pub.1045788009
    126 rdf:type schema:CreativeWork
    127 https://doi.org/10.1016/s0304-3991(02)00089-x schema:sameAs https://app.dimensions.ai/details/publication/pub.1006890854
    128 rdf:type schema:CreativeWork
    129 https://doi.org/10.1016/s0924-4247(99)00363-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1027315928
    130 rdf:type schema:CreativeWork
    131 https://doi.org/10.1016/s1359-6454(99)00294-3 schema:sameAs https://app.dimensions.ai/details/publication/pub.1021979228
    132 rdf:type schema:CreativeWork
    133 https://doi.org/10.1063/1.1708831 schema:sameAs https://app.dimensions.ai/details/publication/pub.1057777655
    134 rdf:type schema:CreativeWork
    135 https://doi.org/10.1063/1.325870 schema:sameAs https://app.dimensions.ai/details/publication/pub.1057926251
    136 rdf:type schema:CreativeWork
    137 https://doi.org/10.1063/1.370146 schema:sameAs https://app.dimensions.ai/details/publication/pub.1058004234
    138 rdf:type schema:CreativeWork
    139 https://doi.org/10.1109/84.623107 schema:sameAs https://app.dimensions.ai/details/publication/pub.1061240586
    140 rdf:type schema:CreativeWork
    141 https://doi.org/10.1109/84.946774 schema:sameAs https://app.dimensions.ai/details/publication/pub.1061240830
    142 rdf:type schema:CreativeWork
    143 https://doi.org/10.1109/jmems.2003.814130 schema:sameAs https://app.dimensions.ai/details/publication/pub.1061289795
    144 rdf:type schema:CreativeWork
    145 https://doi.org/10.1109/memsys.1997.581921 schema:sameAs https://app.dimensions.ai/details/publication/pub.1094595432
    146 rdf:type schema:CreativeWork
    147 https://doi.org/10.1109/proc.1982.12331 schema:sameAs https://app.dimensions.ai/details/publication/pub.1061444988
    148 rdf:type schema:CreativeWork
    149 https://doi.org/10.1116/1.1319691 schema:sameAs https://app.dimensions.ai/details/publication/pub.1062165734
    150 rdf:type schema:CreativeWork
    151 https://doi.org/10.1117/12.395616 schema:sameAs https://app.dimensions.ai/details/publication/pub.1049345328
    152 rdf:type schema:CreativeWork
    153 https://doi.org/10.1520/stp10994s schema:sameAs https://app.dimensions.ai/details/publication/pub.1088513221
    154 rdf:type schema:CreativeWork
    155 https://doi.org/10.1557/jmr.1988.0931 schema:sameAs https://app.dimensions.ai/details/publication/pub.1022182547
    156 rdf:type schema:CreativeWork
    157 https://doi.org/10.1557/jmr.1993.1542 schema:sameAs https://app.dimensions.ai/details/publication/pub.1022936379
    158 rdf:type schema:CreativeWork
    159 https://www.grid.ac/institutes/grid.21107.35 schema:alternateName Johns Hopkins University
    160 schema:name Department of Mechanical Engineering, Johns Hopkins University, 21218, Baltimore, MD, USA
    161 rdf:type schema:Organization
    162 https://www.grid.ac/institutes/grid.420282.e schema:alternateName United States Army Research Laboratory
    163 schema:name Sensors and Electron Devices Directorate, US Army Research Laboratory, 20783, Adelphi, MD, USA
    164 rdf:type schema:Organization
     




    Preview window. Press ESC to close (or click here)


    ...