Viscoplastic behavior of bulk solder material under cyclic loading and compression of spherical joint-scale granules View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2021-07-09

AUTHORS

Xu He, Shaobing Wang, Yuexing Wang, Lu Liu, Yawei Dong, Yao Yao

ABSTRACT

The viscoplastic behavior of solder material is investigated from different scales. Due to the thermal stress in Sn–3.0Ag–0.5Cu alloy at elevated temperatures, the continuous accumulation of unrecoverable deformation becomes the key of interconnections failure in microelectronic packaging. In the current study, the rate and temperature dependence of inelastic deformation and cyclic hardening properties of Sn–3.0Ag–0.5Cu alloy under different loading conditions are studied. A novel phenomenological constitutive model is developed to describe the deformation of lead-free solder interconnections in the microelectronic packaging. The developed model is verified by comparing with the experimental data of bulk solder materials. The results show that the proposed model can accurately describe the viscoplastic properties of bulk solder materials and shows excellent numerical stability. For understanding better the overall deformation behaviors of solder joins, especially the strain–stress relationship, uniaxial compression experiments of spherical joint-scale granules were conducted under different loading rates. The developed model is applied to simulate the compression testing of granules. It shows that the developed model can characterize the viscoplastic compression deformation of Sn–3.0Ag–0.5Cu solder on joint-scale with reasonable accuracy. More... »

PAGES

20640-20650

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s10854-021-06573-3

DOI

http://dx.doi.org/10.1007/s10854-021-06573-3

DIMENSIONS

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192 School of Mechanics and Civil Engineering, Northwestern Polytechnical University, 710072, Xi’an, People’s Republic of China
193 rdf:type schema:Organization
194 grid-institutes:grid.453246.2 schema:alternateName National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology, College of Electronic and Optical Engineering & College of Microelectronics, Nanjing University of Posts and Telecommunications, 210023, Nanjing, People’s Republic of China
195 schema:name National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology, College of Electronic and Optical Engineering & College of Microelectronics, Nanjing University of Posts and Telecommunications, 210023, Nanjing, People’s Republic of China
196 rdf:type schema:Organization
 




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