Corrosion effects on sintered nano-silver joints and the secondary biological hazards View Full Text


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Article Info

DATE

2020-04-03

AUTHORS

He Gong, Yao Yao, Fanfan Zhao

ABSTRACT

Corrosion can affect the service life and reliability of electronic devices, in addition, corrosion products may flow out with sweat and enter the body through skin. In the current study, mechanical and biological corrosion experiments were performed to explore the mechanical properties and secondary biological hazards of nano-silver paste in the corrosive environment. The effects of corrosion time on shear strength and corrosion products of sintered nano-silver joints on biological organism were investigated. The survival rate of hamster lung cells was measured by MTT assay and flow cytometry after cultured in nutrient solution containing different concentration of nano-silver particles. Experimental analysis reveals that the shear strength of sintered nano-silver joint decreases drastically with the increasing of corrosion time, and the fracture mode changes from interlayer to interfacial fracture. A modified Weibull statistical model was proposed to predict the average failure strength and probability of sintered nano-silver joints at different corrosion time. In addition, biological experiment demonstrates that with increasing of nano-silver particles concentration, the survival rate of hamster lung cells firstly increases and then decreases. More... »

PAGES

7649-7662

References to SciGraph publications

  • 2014-12-09. Three-Dimensional Visualization of the Crack-Growth Behavior of Nano-Silver Joints During Shear Creep in JOURNAL OF ELECTRONIC MATERIALS
  • 2019-12-01. Interfacial fracture toughness of sintered hybrid silver interconnects in JOURNAL OF MATERIALS SCIENCE
  • 2014-01-17. Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? in JOURNAL OF ELECTRONIC MATERIALS
  • 2005-06-29. Interaction of silver nanoparticles with HIV-1 in JOURNAL OF NANOBIOTECHNOLOGY
  • 2016-07-20. Effect of aluminum addition on the electrochemical corrosion behavior of Sn–3Ag–0.5Cu solder alloy in 3.5 wt% NaCl solution in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2007-09-11. Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection in JOURNAL OF ELECTRONIC MATERIALS
  • 2019-07-30. Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography in JOURNAL OF ELECTRONIC MATERIALS
  • 2012-10-29. Silver nanoparticles: mechanism of antimicrobial action, synthesis, medical applications, and toxicity effects in INTERNATIONAL NANO LETTERS
  • 2018-10-26. Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2014-05-16. Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-06-19. Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
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    http://scigraph.springernature.com/pub.10.1007/s10854-020-03301-1

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    http://dx.doi.org/10.1007/s10854-020-03301-1

    DIMENSIONS

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