Effect of deep cryogenic treatment on mechanical properties and microstructure of Sn3.0Ag0.5Cu solder View Full Text


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Article Info

DATE

2017-12-09

AUTHORS

Yao Yao, Xiao Li, Xu He

ABSTRACT

The effect of deep cryogenic treatment on the performance of steels and alloys has attracted wide attention in the past decades. Deep cryogenic treatment can improve the strength and hardness of steel at room temperature, provide microstructure stability and improve wear or fatigue resistance of material. In the current study, the effect of deep cryogenic treatment on the microstructure and mechanical properties of Sn3.0Ag0.5Cu solders are investigated. The influence to microstructure, tensile strength and ductility improvement are discussed. Experimental analysis shows that the tensile strength of Sn3.0Ag0.5Cu solder increases from 36.76 to 46.27 MPa after 600 h of deep cryogenic treatment at 77 K (− 196 °C), the observed strength-time relation is similar to the Taylor theory for the yield strength and dislocation density. Large particles presented in the fracture of Sn3.0Ag0.5Cu samples are caused by the high cooling rate as well as the concentration difference between the β-Sn and the eutectic system. The precipitated Ag3Sn particles exhibit relatively uniform distribution in deep cryogenic treated Sn-rich matrix, and the size of Ag3Sn particles becomes smaller with longer deep cryogenic treatment time. It is noted that deep cryogenic treatment can increase the internal stress and the dislocation density, higher dislocation density and good ductility lead to movement of the pre-existing dislocations and specific dislocation configurations. Microscopic experiments on solder joints were performed to investigate the microstructure change. The Intermetallic layers were measured which showed negligible change in thickness. A unified creep and plasticity constitutive model is proposed to simulate the stress–strain relationship under deep cryogenic treatment, the predictions show good agreement compared with experimental results. More... »

PAGES

4517-4525

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s10854-017-8400-6

DOI

http://dx.doi.org/10.1007/s10854-017-8400-6

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1099701908


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[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "School of Mechanics, Civil Engineering & Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.440588.5", 
          "name": [
            "School of Mechanics, Civil Engineering & Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Yao", 
        "givenName": "Yao", 
        "id": "sg:person.011313423711.63", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011313423711.63"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "School of Mechanics, Civil Engineering & Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.440588.5", 
          "name": [
            "School of Mechanics, Civil Engineering & Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Li", 
        "givenName": "Xiao", 
        "id": "sg:person.012055316201.79", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012055316201.79"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "School of Mechanics, Civil Engineering & Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.440588.5", 
          "name": [
            "School of Mechanics, Civil Engineering & Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "He", 
        "givenName": "Xu", 
        "id": "sg:person.012335270321.31", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012335270321.31"
        ], 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1007/s10853-014-8527-2", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1048556768", 
          "https://doi.org/10.1007/s10853-014-8527-2"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1038/nature14674", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1014001816", 
          "https://doi.org/10.1038/nature14674"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11661-014-2202-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1042413374", 
          "https://doi.org/10.1007/s11661-014-2202-8"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s00170-010-2935-5", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1053307594", 
          "https://doi.org/10.1007/s00170-010-2935-5"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11837-003-0142-7", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1048486273", 
          "https://doi.org/10.1007/s11837-003-0142-7"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2017-12-09", 
    "datePublishedReg": "2017-12-09", 
    "description": "The effect of deep cryogenic treatment on the performance of steels and alloys has attracted wide attention in the past decades. Deep cryogenic treatment can improve the strength and hardness of steel at room temperature, provide microstructure stability and improve wear or fatigue resistance of material. In the current study, the effect of deep cryogenic treatment on the microstructure and mechanical properties of Sn3.0Ag0.5Cu solders are investigated. The influence to microstructure, tensile strength and ductility improvement are discussed. Experimental analysis shows that the tensile strength of Sn3.0Ag0.5Cu solder increases from 36.76 to 46.27\u00a0MPa after 600\u00a0h of deep cryogenic treatment at 77\u00a0K (\u2212\u2009196\u00a0\u00b0C), the observed strength-time relation is similar to the Taylor theory for the yield strength and dislocation density. Large particles presented in the fracture of Sn3.0Ag0.5Cu samples are caused by the high cooling rate as well as the concentration difference between the \u03b2-Sn and the eutectic system. The precipitated Ag3Sn particles exhibit relatively uniform distribution in deep cryogenic treated Sn-rich matrix, and the size of Ag3Sn particles becomes smaller with longer deep cryogenic treatment time. It is noted that deep cryogenic treatment can increase the internal stress and the dislocation density, higher dislocation density and good ductility lead to movement of the pre-existing dislocations and specific dislocation configurations. Microscopic experiments on solder joints were performed to investigate the microstructure change. The Intermetallic layers were measured which showed negligible change in thickness. A unified creep and plasticity constitutive model is proposed to simulate the stress\u2013strain relationship under deep cryogenic treatment, the predictions show good agreement compared with experimental results.", 
    "genre": "article", 
    "id": "sg:pub.10.1007/s10854-017-8400-6", 
    "isAccessibleForFree": false, 
    "isFundedItemOf": [
      {
        "id": "sg:grant.8124494", 
        "type": "MonetaryGrant"
      }
    ], 
    "isPartOf": [
      {
        "id": "sg:journal.1136825", 
        "issn": [
          "0957-4522", 
          "1573-482X"
        ], 
        "name": "Journal of Materials Science: Materials in Electronics", 
        "publisher": "Springer Nature", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "6", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "29"
      }
    ], 
    "keywords": [
      "deep cryogenic treatment", 
      "cryogenic treatment", 
      "dislocation density", 
      "Ag3Sn particles", 
      "mechanical properties", 
      "tensile strength", 
      "performance of steel", 
      "Sn-rich matrix", 
      "hardness of steel", 
      "plasticity constitutive model", 
      "high dislocation density", 
      "high cooling rate", 
      "stress-strain relationship", 
      "pre-existing dislocations", 
      "specific dislocation configurations", 
      "deep cryogenic", 
      "unified creep", 
      "ductility improvement", 
      "yield strength", 
      "solder joints", 
      "intermetallic layer", 
      "constitutive model", 
      "microstructure stability", 
      "solder increases", 
      "internal stress", 
      "microstructure changes", 
      "fatigue resistance", 
      "cooling rate", 
      "dislocation configurations", 
      "\u03b2-Sn", 
      "steel", 
      "large particles", 
      "solder", 
      "microstructure", 
      "uniform distribution", 
      "room temperature", 
      "experimental analysis", 
      "Taylor theory", 
      "eutectic system", 
      "experimental results", 
      "good agreement", 
      "strength", 
      "wide attention", 
      "particles", 
      "negligible change", 
      "treatment time", 
      "density", 
      "alloy", 
      "creep", 
      "MPa", 
      "wear", 
      "cryogenics", 
      "hardness", 
      "microscopic experiments", 
      "properties", 
      "concentration difference", 
      "thickness", 
      "layer", 
      "temperature", 
      "materials", 
      "joints", 
      "dislocations", 
      "configuration", 
      "stability", 
      "performance", 
      "matrix", 
      "fractures", 
      "stress", 
      "effect", 
      "resistance", 
      "prediction", 
      "agreement", 
      "influence", 
      "system", 
      "experiments", 
      "size", 
      "distribution", 
      "model", 
      "improvement", 
      "results", 
      "lead", 
      "increase", 
      "time", 
      "past decade", 
      "rate", 
      "analysis", 
      "samples", 
      "changes", 
      "theory", 
      "movement", 
      "attention", 
      "study", 
      "treatment", 
      "current study", 
      "decades", 
      "relation", 
      "differences", 
      "relationship"
    ], 
    "name": "Effect of deep cryogenic treatment on mechanical properties and microstructure of Sn3.0Ag0.5Cu solder", 
    "pagination": "4517-4525", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1099701908"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/s10854-017-8400-6"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/s10854-017-8400-6", 
      "https://app.dimensions.ai/details/publication/pub.1099701908"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2022-11-24T21:02", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-springernature-scigraph/baseset/20221124/entities/gbq_results/article/article_743.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://doi.org/10.1007/s10854-017-8400-6"
  }
]
 

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This table displays all metadata directly associated to this object as RDF triples.

191 TRIPLES      21 PREDICATES      127 URIs      114 LITERALS      6 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/s10854-017-8400-6 schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author Ne8d2b0040f564d3d9074fe48dadf9a91
4 schema:citation sg:pub.10.1007/s00170-010-2935-5
5 sg:pub.10.1007/s10853-014-8527-2
6 sg:pub.10.1007/s11661-014-2202-8
7 sg:pub.10.1007/s11837-003-0142-7
8 sg:pub.10.1038/nature14674
9 schema:datePublished 2017-12-09
10 schema:datePublishedReg 2017-12-09
11 schema:description The effect of deep cryogenic treatment on the performance of steels and alloys has attracted wide attention in the past decades. Deep cryogenic treatment can improve the strength and hardness of steel at room temperature, provide microstructure stability and improve wear or fatigue resistance of material. In the current study, the effect of deep cryogenic treatment on the microstructure and mechanical properties of Sn3.0Ag0.5Cu solders are investigated. The influence to microstructure, tensile strength and ductility improvement are discussed. Experimental analysis shows that the tensile strength of Sn3.0Ag0.5Cu solder increases from 36.76 to 46.27 MPa after 600 h of deep cryogenic treatment at 77 K (− 196 °C), the observed strength-time relation is similar to the Taylor theory for the yield strength and dislocation density. Large particles presented in the fracture of Sn3.0Ag0.5Cu samples are caused by the high cooling rate as well as the concentration difference between the β-Sn and the eutectic system. The precipitated Ag3Sn particles exhibit relatively uniform distribution in deep cryogenic treated Sn-rich matrix, and the size of Ag3Sn particles becomes smaller with longer deep cryogenic treatment time. It is noted that deep cryogenic treatment can increase the internal stress and the dislocation density, higher dislocation density and good ductility lead to movement of the pre-existing dislocations and specific dislocation configurations. Microscopic experiments on solder joints were performed to investigate the microstructure change. The Intermetallic layers were measured which showed negligible change in thickness. A unified creep and plasticity constitutive model is proposed to simulate the stress–strain relationship under deep cryogenic treatment, the predictions show good agreement compared with experimental results.
12 schema:genre article
13 schema:isAccessibleForFree false
14 schema:isPartOf N042846a2df5041c1a6f79ca43d6d2263
15 Nf52b019f66c9412e8fee7e8ffa5bd6a2
16 sg:journal.1136825
17 schema:keywords Ag3Sn particles
18 MPa
19 Sn-rich matrix
20 Taylor theory
21 agreement
22 alloy
23 analysis
24 attention
25 changes
26 concentration difference
27 configuration
28 constitutive model
29 cooling rate
30 creep
31 cryogenic treatment
32 cryogenics
33 current study
34 decades
35 deep cryogenic
36 deep cryogenic treatment
37 density
38 differences
39 dislocation configurations
40 dislocation density
41 dislocations
42 distribution
43 ductility improvement
44 effect
45 eutectic system
46 experimental analysis
47 experimental results
48 experiments
49 fatigue resistance
50 fractures
51 good agreement
52 hardness
53 hardness of steel
54 high cooling rate
55 high dislocation density
56 improvement
57 increase
58 influence
59 intermetallic layer
60 internal stress
61 joints
62 large particles
63 layer
64 lead
65 materials
66 matrix
67 mechanical properties
68 microscopic experiments
69 microstructure
70 microstructure changes
71 microstructure stability
72 model
73 movement
74 negligible change
75 particles
76 past decade
77 performance
78 performance of steel
79 plasticity constitutive model
80 pre-existing dislocations
81 prediction
82 properties
83 rate
84 relation
85 relationship
86 resistance
87 results
88 room temperature
89 samples
90 size
91 solder
92 solder increases
93 solder joints
94 specific dislocation configurations
95 stability
96 steel
97 strength
98 stress
99 stress-strain relationship
100 study
101 system
102 temperature
103 tensile strength
104 theory
105 thickness
106 time
107 treatment
108 treatment time
109 unified creep
110 uniform distribution
111 wear
112 wide attention
113 yield strength
114 β-Sn
115 schema:name Effect of deep cryogenic treatment on mechanical properties and microstructure of Sn3.0Ag0.5Cu solder
116 schema:pagination 4517-4525
117 schema:productId N155b1b3595544f16a78f928211ab3a1a
118 N78b32852de064021b7972a98d10af14b
119 schema:sameAs https://app.dimensions.ai/details/publication/pub.1099701908
120 https://doi.org/10.1007/s10854-017-8400-6
121 schema:sdDatePublished 2022-11-24T21:02
122 schema:sdLicense https://scigraph.springernature.com/explorer/license/
123 schema:sdPublisher Nb25a93e7459945b48f467bea68fb2f89
124 schema:url https://doi.org/10.1007/s10854-017-8400-6
125 sgo:license sg:explorer/license/
126 sgo:sdDataset articles
127 rdf:type schema:ScholarlyArticle
128 N042846a2df5041c1a6f79ca43d6d2263 schema:issueNumber 6
129 rdf:type schema:PublicationIssue
130 N155b1b3595544f16a78f928211ab3a1a schema:name doi
131 schema:value 10.1007/s10854-017-8400-6
132 rdf:type schema:PropertyValue
133 N717c7f3b578f4d26aa6e08875e6e83b6 rdf:first sg:person.012055316201.79
134 rdf:rest Nba14167217d04173a758ef2e380a244c
135 N78b32852de064021b7972a98d10af14b schema:name dimensions_id
136 schema:value pub.1099701908
137 rdf:type schema:PropertyValue
138 Nb25a93e7459945b48f467bea68fb2f89 schema:name Springer Nature - SN SciGraph project
139 rdf:type schema:Organization
140 Nba14167217d04173a758ef2e380a244c rdf:first sg:person.012335270321.31
141 rdf:rest rdf:nil
142 Ne8d2b0040f564d3d9074fe48dadf9a91 rdf:first sg:person.011313423711.63
143 rdf:rest N717c7f3b578f4d26aa6e08875e6e83b6
144 Nf52b019f66c9412e8fee7e8ffa5bd6a2 schema:volumeNumber 29
145 rdf:type schema:PublicationVolume
146 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
147 schema:name Engineering
148 rdf:type schema:DefinedTerm
149 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
150 schema:name Materials Engineering
151 rdf:type schema:DefinedTerm
152 sg:grant.8124494 http://pending.schema.org/fundedItem sg:pub.10.1007/s10854-017-8400-6
153 rdf:type schema:MonetaryGrant
154 sg:journal.1136825 schema:issn 0957-4522
155 1573-482X
156 schema:name Journal of Materials Science: Materials in Electronics
157 schema:publisher Springer Nature
158 rdf:type schema:Periodical
159 sg:person.011313423711.63 schema:affiliation grid-institutes:grid.440588.5
160 schema:familyName Yao
161 schema:givenName Yao
162 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011313423711.63
163 rdf:type schema:Person
164 sg:person.012055316201.79 schema:affiliation grid-institutes:grid.440588.5
165 schema:familyName Li
166 schema:givenName Xiao
167 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012055316201.79
168 rdf:type schema:Person
169 sg:person.012335270321.31 schema:affiliation grid-institutes:grid.440588.5
170 schema:familyName He
171 schema:givenName Xu
172 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012335270321.31
173 rdf:type schema:Person
174 sg:pub.10.1007/s00170-010-2935-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1053307594
175 https://doi.org/10.1007/s00170-010-2935-5
176 rdf:type schema:CreativeWork
177 sg:pub.10.1007/s10853-014-8527-2 schema:sameAs https://app.dimensions.ai/details/publication/pub.1048556768
178 https://doi.org/10.1007/s10853-014-8527-2
179 rdf:type schema:CreativeWork
180 sg:pub.10.1007/s11661-014-2202-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1042413374
181 https://doi.org/10.1007/s11661-014-2202-8
182 rdf:type schema:CreativeWork
183 sg:pub.10.1007/s11837-003-0142-7 schema:sameAs https://app.dimensions.ai/details/publication/pub.1048486273
184 https://doi.org/10.1007/s11837-003-0142-7
185 rdf:type schema:CreativeWork
186 sg:pub.10.1038/nature14674 schema:sameAs https://app.dimensions.ai/details/publication/pub.1014001816
187 https://doi.org/10.1038/nature14674
188 rdf:type schema:CreativeWork
189 grid-institutes:grid.440588.5 schema:alternateName School of Mechanics, Civil Engineering & Architecture, Northwestern Polytechnical University, 710072, Xi’an, People’s Republic of China
190 schema:name School of Mechanics, Civil Engineering & Architecture, Northwestern Polytechnical University, 710072, Xi’an, People’s Republic of China
191 rdf:type schema:Organization
 




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