Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2017-06-19

AUTHORS

Jundong Wang, Xu Long, Yao Yao

ABSTRACT

Thermal aging effects on the tensile and fatigue properties of Sn-3.0Ag-0.5Cu (wt%, SAC305) solder joint are investigated. Three series of experiments were conducted at different temperatures, including uniaxial tension experiments for specimens after aging for 24 and 72 h, and low cycle fatigue experiments for specimens after aging for 72 h. The tensile strength and fatigue life of SAC305 solder joint were analyzed statistically by using a modified Weibull distribution model, which takes the thermal aging effect into account and the results agrees well with the experimental data. The maximum tensile strength after aging for 24 h was obtained by aging at room temperature. After aging for 72 h, the maximum tensile strength and longest fatigue life were obtained by aging at the cryogenic temperature. With elevated aging temperatures, the tensile strength and fatigue life decrease. Microstructure observations on the solder joints reveal that with reducing of aging temperatures, the Ag3Sn phase gradually grows and occupies more volume while Cu6Sn5 phase occupies less volume. The high content of Ag3Sn phase can embrittle the solder joint and dominate the tensile failure. More... »

PAGES

14884-14892

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s10854-017-7360-1

DOI

http://dx.doi.org/10.1007/s10854-017-7360-1

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1086097276


Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
Incoming Citations Browse incoming citations for this publication using opencitations.net

JSON-LD is the canonical representation for SciGraph data.

TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0906", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Electrical and Electronic Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "School of Mechanics and Civil Engineering, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.440588.5", 
          "name": [
            "School of Mechanics and Civil Engineering, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Wang", 
        "givenName": "Jundong", 
        "id": "sg:person.016001652421.95", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016001652421.95"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "School of Mechanics and Civil Engineering, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.440588.5", 
          "name": [
            "School of Mechanics and Civil Engineering, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Long", 
        "givenName": "Xu", 
        "id": "sg:person.010352721063.26", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010352721063.26"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "School of Mechanics and Civil Engineering, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.440588.5", 
          "name": [
            "School of Mechanics and Civil Engineering, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Yao", 
        "givenName": "Yao", 
        "id": "sg:person.011313423711.63", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011313423711.63"
        ], 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1023/b:jmsl.0000005417.39465.35", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1008098808", 
          "https://doi.org/10.1023/b:jmsl.0000005417.39465.35"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1038/nature14674", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1014001816", 
          "https://doi.org/10.1038/nature14674"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1023/a:1006712809728", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1018590498", 
          "https://doi.org/10.1023/a:1006712809728"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2017-06-19", 
    "datePublishedReg": "2017-06-19", 
    "description": "Thermal aging effects on the tensile and fatigue properties of Sn-3.0Ag-0.5Cu (wt%, SAC305) solder joint are investigated. Three series of experiments were conducted at different temperatures, including uniaxial tension experiments for specimens after aging for 24 and 72\u00a0h, and low cycle fatigue experiments for specimens after aging for 72\u00a0h. The tensile strength and fatigue life of SAC305 solder joint were analyzed statistically by using a modified Weibull distribution model, which takes the thermal aging effect into account and the results agrees well with the experimental data. The maximum tensile strength after aging for 24\u00a0h was obtained by aging at room temperature. After aging for 72\u00a0h, the maximum tensile strength and longest fatigue life were obtained by aging at the cryogenic temperature. With elevated aging temperatures, the tensile strength and fatigue life decrease. Microstructure observations on the solder joints reveal that with reducing of aging temperatures, the Ag3Sn phase gradually grows and occupies more volume while Cu6Sn5 phase occupies less volume. The high content of Ag3Sn phase can embrittle the solder joint and dominate the tensile failure.", 
    "genre": "article", 
    "id": "sg:pub.10.1007/s10854-017-7360-1", 
    "isAccessibleForFree": false, 
    "isFundedItemOf": [
      {
        "id": "sg:grant.8263985", 
        "type": "MonetaryGrant"
      }, 
      {
        "id": "sg:grant.8124494", 
        "type": "MonetaryGrant"
      }
    ], 
    "isPartOf": [
      {
        "id": "sg:journal.1136825", 
        "issn": [
          "0957-4522", 
          "1573-482X"
        ], 
        "name": "Journal of Materials Science: Materials in Electronics", 
        "publisher": "Springer Nature", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "19", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "28"
      }
    ], 
    "keywords": [
      "solder joints", 
      "maximum tensile strength", 
      "tensile strength", 
      "fatigue life", 
      "Ag3Sn phase", 
      "low-cycle fatigue experiments", 
      "uniaxial tension experiments", 
      "SAC305 solder joints", 
      "longer fatigue life", 
      "thermal aging effect", 
      "fatigue life decreases", 
      "fatigue behavior", 
      "fatigue properties", 
      "Weibull distribution model", 
      "fatigue experiments", 
      "microstructure observation", 
      "tensile failure", 
      "tension experiments", 
      "Cu6Sn5 phase", 
      "cryogenic temperatures", 
      "aging effect", 
      "room temperature", 
      "different temperatures", 
      "experimental data", 
      "temperature", 
      "series of experiments", 
      "strength", 
      "joints", 
      "life decreases", 
      "less volume", 
      "phase", 
      "more volume", 
      "high content", 
      "specimens", 
      "experiments", 
      "distribution model", 
      "properties", 
      "volume", 
      "effect", 
      "behavior", 
      "model", 
      "content", 
      "account", 
      "results", 
      "failure", 
      "decrease", 
      "observations", 
      "series", 
      "life", 
      "data"
    ], 
    "name": "Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints", 
    "pagination": "14884-14892", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1086097276"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/s10854-017-7360-1"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/s10854-017-7360-1", 
      "https://app.dimensions.ai/details/publication/pub.1086097276"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2022-12-01T06:35", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-springernature-scigraph/baseset/20221201/entities/gbq_results/article/article_727.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://doi.org/10.1007/s10854-017-7360-1"
  }
]
 

Download the RDF metadata as:  json-ld nt turtle xml License info

HOW TO GET THIS DATA PROGRAMMATICALLY:

JSON-LD is a popular format for linked data which is fully compatible with JSON.

curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s10854-017-7360-1'

N-Triples is a line-based linked data format ideal for batch operations.

curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s10854-017-7360-1'

Turtle is a human-readable linked data format.

curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s10854-017-7360-1'

RDF/XML is a standard XML format for linked data.

curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s10854-017-7360-1'


 

This table displays all metadata directly associated to this object as RDF triples.

141 TRIPLES      21 PREDICATES      78 URIs      66 LITERALS      6 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/s10854-017-7360-1 schema:about anzsrc-for:09
2 anzsrc-for:0906
3 anzsrc-for:0912
4 schema:author N4c055af476d04cafb44c3e0013c63ba5
5 schema:citation sg:pub.10.1023/a:1006712809728
6 sg:pub.10.1023/b:jmsl.0000005417.39465.35
7 sg:pub.10.1038/nature14674
8 schema:datePublished 2017-06-19
9 schema:datePublishedReg 2017-06-19
10 schema:description Thermal aging effects on the tensile and fatigue properties of Sn-3.0Ag-0.5Cu (wt%, SAC305) solder joint are investigated. Three series of experiments were conducted at different temperatures, including uniaxial tension experiments for specimens after aging for 24 and 72 h, and low cycle fatigue experiments for specimens after aging for 72 h. The tensile strength and fatigue life of SAC305 solder joint were analyzed statistically by using a modified Weibull distribution model, which takes the thermal aging effect into account and the results agrees well with the experimental data. The maximum tensile strength after aging for 24 h was obtained by aging at room temperature. After aging for 72 h, the maximum tensile strength and longest fatigue life were obtained by aging at the cryogenic temperature. With elevated aging temperatures, the tensile strength and fatigue life decrease. Microstructure observations on the solder joints reveal that with reducing of aging temperatures, the Ag3Sn phase gradually grows and occupies more volume while Cu6Sn5 phase occupies less volume. The high content of Ag3Sn phase can embrittle the solder joint and dominate the tensile failure.
11 schema:genre article
12 schema:isAccessibleForFree false
13 schema:isPartOf N0aa067a54e4d495a9df96d3497764326
14 N7819bc6d844741b8a9580a8ae9b097dc
15 sg:journal.1136825
16 schema:keywords Ag3Sn phase
17 Cu6Sn5 phase
18 SAC305 solder joints
19 Weibull distribution model
20 account
21 aging effect
22 behavior
23 content
24 cryogenic temperatures
25 data
26 decrease
27 different temperatures
28 distribution model
29 effect
30 experimental data
31 experiments
32 failure
33 fatigue behavior
34 fatigue experiments
35 fatigue life
36 fatigue life decreases
37 fatigue properties
38 high content
39 joints
40 less volume
41 life
42 life decreases
43 longer fatigue life
44 low-cycle fatigue experiments
45 maximum tensile strength
46 microstructure observation
47 model
48 more volume
49 observations
50 phase
51 properties
52 results
53 room temperature
54 series
55 series of experiments
56 solder joints
57 specimens
58 strength
59 temperature
60 tensile failure
61 tensile strength
62 tension experiments
63 thermal aging effect
64 uniaxial tension experiments
65 volume
66 schema:name Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints
67 schema:pagination 14884-14892
68 schema:productId Nbcab181f2a434c04a096b2d2c6c14dd4
69 Nc03dcbc208eb4ad0abfad81690984774
70 schema:sameAs https://app.dimensions.ai/details/publication/pub.1086097276
71 https://doi.org/10.1007/s10854-017-7360-1
72 schema:sdDatePublished 2022-12-01T06:35
73 schema:sdLicense https://scigraph.springernature.com/explorer/license/
74 schema:sdPublisher Nf82058b34cdf4d2a9dc2aa18b8f9c7bf
75 schema:url https://doi.org/10.1007/s10854-017-7360-1
76 sgo:license sg:explorer/license/
77 sgo:sdDataset articles
78 rdf:type schema:ScholarlyArticle
79 N0aa067a54e4d495a9df96d3497764326 schema:issueNumber 19
80 rdf:type schema:PublicationIssue
81 N4c055af476d04cafb44c3e0013c63ba5 rdf:first sg:person.016001652421.95
82 rdf:rest N7296c5fb98f241ccb77ba45d1aea4f27
83 N7296c5fb98f241ccb77ba45d1aea4f27 rdf:first sg:person.010352721063.26
84 rdf:rest Nf64f60ab61224b84a170faa5aa778bed
85 N7819bc6d844741b8a9580a8ae9b097dc schema:volumeNumber 28
86 rdf:type schema:PublicationVolume
87 Nbcab181f2a434c04a096b2d2c6c14dd4 schema:name dimensions_id
88 schema:value pub.1086097276
89 rdf:type schema:PropertyValue
90 Nc03dcbc208eb4ad0abfad81690984774 schema:name doi
91 schema:value 10.1007/s10854-017-7360-1
92 rdf:type schema:PropertyValue
93 Nf64f60ab61224b84a170faa5aa778bed rdf:first sg:person.011313423711.63
94 rdf:rest rdf:nil
95 Nf82058b34cdf4d2a9dc2aa18b8f9c7bf schema:name Springer Nature - SN SciGraph project
96 rdf:type schema:Organization
97 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
98 schema:name Engineering
99 rdf:type schema:DefinedTerm
100 anzsrc-for:0906 schema:inDefinedTermSet anzsrc-for:
101 schema:name Electrical and Electronic Engineering
102 rdf:type schema:DefinedTerm
103 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
104 schema:name Materials Engineering
105 rdf:type schema:DefinedTerm
106 sg:grant.8124494 http://pending.schema.org/fundedItem sg:pub.10.1007/s10854-017-7360-1
107 rdf:type schema:MonetaryGrant
108 sg:grant.8263985 http://pending.schema.org/fundedItem sg:pub.10.1007/s10854-017-7360-1
109 rdf:type schema:MonetaryGrant
110 sg:journal.1136825 schema:issn 0957-4522
111 1573-482X
112 schema:name Journal of Materials Science: Materials in Electronics
113 schema:publisher Springer Nature
114 rdf:type schema:Periodical
115 sg:person.010352721063.26 schema:affiliation grid-institutes:grid.440588.5
116 schema:familyName Long
117 schema:givenName Xu
118 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010352721063.26
119 rdf:type schema:Person
120 sg:person.011313423711.63 schema:affiliation grid-institutes:grid.440588.5
121 schema:familyName Yao
122 schema:givenName Yao
123 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011313423711.63
124 rdf:type schema:Person
125 sg:person.016001652421.95 schema:affiliation grid-institutes:grid.440588.5
126 schema:familyName Wang
127 schema:givenName Jundong
128 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016001652421.95
129 rdf:type schema:Person
130 sg:pub.10.1023/a:1006712809728 schema:sameAs https://app.dimensions.ai/details/publication/pub.1018590498
131 https://doi.org/10.1023/a:1006712809728
132 rdf:type schema:CreativeWork
133 sg:pub.10.1023/b:jmsl.0000005417.39465.35 schema:sameAs https://app.dimensions.ai/details/publication/pub.1008098808
134 https://doi.org/10.1023/b:jmsl.0000005417.39465.35
135 rdf:type schema:CreativeWork
136 sg:pub.10.1038/nature14674 schema:sameAs https://app.dimensions.ai/details/publication/pub.1014001816
137 https://doi.org/10.1038/nature14674
138 rdf:type schema:CreativeWork
139 grid-institutes:grid.440588.5 schema:alternateName School of Mechanics and Civil Engineering, Northwestern Polytechnical University, 710072, Xi’an, People’s Republic of China
140 schema:name School of Mechanics and Civil Engineering, Northwestern Polytechnical University, 710072, Xi’an, People’s Republic of China
141 rdf:type schema:Organization
 




Preview window. Press ESC to close (or click here)


...