Creep behavior of micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints under electro-thermo-mechanical coupled loads View Full Text


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Article Info

DATE

2016-12

AUTHORS

W. Y. Li, H. Jin, W. Yue, M. Y. Tan, X. P. Zhang

ABSTRACT

The creep behavior of line-type micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints under electro-thermo-mechanical coupled loads with a high current density of 1.0 × 104 A/cm2 was characterized, in comparison with those without current stressing. Results show that under electro-thermo-mechanical coupled loads all joints exhibit typical three-stage creep characteristics similar with that of joints under the mechanical stress only, implying that the mechanical stress still dominates the creep deformation process of joints. The steady-state creep rate increases with the externally applied stress and temperature regardless of current stressing. Notably, the creep of joints under electro-thermo-mechanical coupled loads is accelerated in terms of an increase in the steady-state creep rate, compared with that without current stressing. The essential factors influencing the steady-state creep rate of joints are the damage effect and Joule heating induced by electro-thermo-mechanical coupled loads. Moreover, the results manifest that the creep activation energy and stress exponent of joints are independent of current stressing. The creep mechanisms of solder joints under electro-thermo-mechanical coupled loads and without current stressing are lattice diffusion. More... »

PAGES

13022-13033

References to SciGraph publications

  • 2009-10. Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-12. Effect of DC Current on the Creep Deformation of Tin in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-12. Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 1973-09. Creep of metals under the influence of electric current in STRENGTH OF MATERIALS
  • 2008-04. Thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections under different stress levels in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 1982-10. Influence of pulsed current peak on the creep rate of zinc crystals in STRENGTH OF MATERIALS
  • 1997-07. Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-12. The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-06. Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2004-11. Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder—Part I: As-cast condition in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-06. The creep properties of lead-free solder joints in JOM
  • 2002-06. Electromigration in solder joints and solder lines in JOM
  • 2009-01. Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-02. The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder in JOURNAL OF ELECTRONIC MATERIALS
  • 1983-01. X-ray diffraction study of subgrain misorientation during high temperature creep of tin single crystals in METALLURGICAL TRANSACTIONS A
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    URI

    http://scigraph.springernature.com/pub.10.1007/s10854-016-5443-z

    DOI

    http://dx.doi.org/10.1007/s10854-016-5443-z

    DIMENSIONS

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