Microstructure, thermal behavior, and wettability of Zn4Al3Mg–xIn solders View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2015-07-03

AUTHORS

Xin Yan, Xiaojun Yang, Wei Hu, Yongping Lei

ABSTRACT

The potential of Zn4Al3Mg–xIn alloys to replace Pb-containing solders by high-temperature soldering was studied. The microstructure, thermal behavior, and wettability of Zn4Al3Mg–xIn solders were investigated by scanning electron microscopy, X-ray diffraction, differential scanning calorimetry (DSC), and spreading tests. The influence of In content on the microstructure and characteristics of the solders was explored. Small additions of In result in grain boundary segregation because of the limited solid solubility of In in other phases, and thereby lead to more complicated microstructure of Zn4Al3Mg–xIn alloys. DSC measurements showed that the onset of melting of the Zn4Al3Mg–xIn alloys decreased with increasing In content, while the melting peak became broader. The electrical conductivity values of ZnAlMg–xIn solders were of the same order of magnitude as those of a conventional Pb-5(wt%)Sn solders. The wettability of Zn4Al3Mg–xIn solders over Cu substrate was also improved with increasing In content. More... »

PAGES

7537-7543

References to SciGraph publications

  • 2013-10-20. Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 1999-11. Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-04-28. Improvement of High-Temperature Performance of Zn-Sn Solder Joint in JOURNAL OF ELECTRONIC MATERIALS
  • 2012-01-26. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2013-05-25. Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-12-28. Shear strength of the Zn–Sn high-temperature lead-free solders in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2012-05-20. Phase formation sequence of high-temperature Zn–4Al–3Mg solder in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2012-03-09. Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2012-01-26. Thermal Properties and Wetting Behavior of High Temperature Zn-Al-In Solders in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s10854-015-3390-8

    DOI

    http://dx.doi.org/10.1007/s10854-015-3390-8

    DIMENSIONS

    https://app.dimensions.ai/details/publication/pub.1042853212


    Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
    Incoming Citations Browse incoming citations for this publication using opencitations.net

    JSON-LD is the canonical representation for SciGraph data.

    TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

    [
      {
        "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
        "about": [
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Engineering", 
            "type": "DefinedTerm"
          }, 
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Materials Engineering", 
            "type": "DefinedTerm"
          }
        ], 
        "author": [
          {
            "affiliation": {
              "alternateName": "College of Material Science and Engineering, Beijing University of Technology, Beijing, China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Material Science and Engineering, Beijing University of Technology, Beijing, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Yan", 
            "givenName": "Xin", 
            "id": "sg:person.011516354241.41", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011516354241.41"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Material Science and Engineering, Beijing University of Technology, Beijing, China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Material Science and Engineering, Beijing University of Technology, Beijing, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Yang", 
            "givenName": "Xiaojun", 
            "id": "sg:person.014436143041.56", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014436143041.56"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Material Science and Engineering, Beijing University of Technology, Beijing, China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Material Science and Engineering, Beijing University of Technology, Beijing, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Hu", 
            "givenName": "Wei", 
            "id": "sg:person.016626464441.62", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016626464441.62"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "College of Material Science and Engineering, Beijing University of Technology, Beijing, China", 
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "name": [
                "College of Material Science and Engineering, Beijing University of Technology, Beijing, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Lei", 
            "givenName": "Yongping", 
            "id": "sg:person.012521025203.12", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12"
            ], 
            "type": "Person"
          }
        ], 
        "citation": [
          {
            "id": "sg:pub.10.1007/s11664-999-0153-4", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1025891570", 
              "https://doi.org/10.1007/s11664-999-0153-4"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s10854-012-0751-4", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1030923942", 
              "https://doi.org/10.1007/s10854-012-0751-4"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11665-012-0125-3", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1015708430", 
              "https://doi.org/10.1007/s11665-012-0125-3"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11665-012-0146-y", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1009930385", 
              "https://doi.org/10.1007/s11665-012-0146-y"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-013-2620-1", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1019885484", 
              "https://doi.org/10.1007/s11664-013-2620-1"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s10854-010-0279-4", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1038389194", 
              "https://doi.org/10.1007/s10854-010-0279-4"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s10854-013-1463-0", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1023593234", 
              "https://doi.org/10.1007/s10854-013-1463-0"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11665-012-0174-7", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1041313542", 
              "https://doi.org/10.1007/s11665-012-0174-7"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/s11664-010-1233-1", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1042228909", 
              "https://doi.org/10.1007/s11664-010-1233-1"
            ], 
            "type": "CreativeWork"
          }
        ], 
        "datePublished": "2015-07-03", 
        "datePublishedReg": "2015-07-03", 
        "description": "The potential of Zn4Al3Mg\u2013xIn alloys to replace Pb-containing solders by high-temperature soldering was studied. The microstructure, thermal behavior, and wettability of Zn4Al3Mg\u2013xIn solders were investigated by scanning electron microscopy, X-ray diffraction, differential scanning calorimetry (DSC), and spreading tests. The influence of In content on the microstructure and characteristics of the solders was explored. Small additions of In result in grain boundary segregation because of the limited solid solubility of In in other phases, and thereby lead to more complicated microstructure of Zn4Al3Mg\u2013xIn alloys. DSC measurements showed that the onset of melting of the Zn4Al3Mg\u2013xIn alloys decreased with increasing In content, while the melting peak became broader. The electrical conductivity values of ZnAlMg\u2013xIn solders were of the same order of magnitude as those of a conventional Pb-5(wt%)Sn solders. The wettability of Zn4Al3Mg\u2013xIn solders over Cu substrate was also improved with increasing In content.", 
        "genre": "article", 
        "id": "sg:pub.10.1007/s10854-015-3390-8", 
        "inLanguage": "en", 
        "isAccessibleForFree": false, 
        "isPartOf": [
          {
            "id": "sg:journal.1136825", 
            "issn": [
              "0957-4522", 
              "1573-482X"
            ], 
            "name": "Journal of Materials Science: Materials in Electronics", 
            "publisher": "Springer Nature", 
            "type": "Periodical"
          }, 
          {
            "issueNumber": "10", 
            "type": "PublicationIssue"
          }, 
          {
            "type": "PublicationVolume", 
            "volumeNumber": "26"
          }
        ], 
        "keywords": [
          "high-temperature soldering", 
          "Pb-containing solders", 
          "thermal behavior", 
          "grain boundary segregation", 
          "differential scanning calorimetry", 
          "boundary segregation", 
          "complicated microstructure", 
          "electrical conductivity values", 
          "solder", 
          "limited solid solubility", 
          "microstructure", 
          "solid solubility", 
          "conductivity values", 
          "Cu substrate", 
          "wettability", 
          "small additions", 
          "onset of melting", 
          "electron microscopy", 
          "ray diffraction", 
          "scanning calorimetry", 
          "alloy", 
          "soldering", 
          "DSC measurements", 
          "same order", 
          "behavior", 
          "diffraction", 
          "melting", 
          "melting peak", 
          "content", 
          "substrate", 
          "microscopy", 
          "calorimetry", 
          "measurements", 
          "solubility", 
          "phase", 
          "influence", 
          "characteristics", 
          "segregation", 
          "test", 
          "magnitude", 
          "order", 
          "results", 
          "peak", 
          "potential", 
          "values", 
          "addition", 
          "onset", 
          "Zn4Al3Mg\u2013xIn", 
          "Zn4Al3Mg\u2013xIn solders", 
          "Zn4Al3Mg\u2013xIn alloys", 
          "ZnAlMg\u2013xIn solders"
        ], 
        "name": "Microstructure, thermal behavior, and wettability of Zn4Al3Mg\u2013xIn solders", 
        "pagination": "7537-7543", 
        "productId": [
          {
            "name": "dimensions_id", 
            "type": "PropertyValue", 
            "value": [
              "pub.1042853212"
            ]
          }, 
          {
            "name": "doi", 
            "type": "PropertyValue", 
            "value": [
              "10.1007/s10854-015-3390-8"
            ]
          }
        ], 
        "sameAs": [
          "https://doi.org/10.1007/s10854-015-3390-8", 
          "https://app.dimensions.ai/details/publication/pub.1042853212"
        ], 
        "sdDataset": "articles", 
        "sdDatePublished": "2021-12-01T19:33", 
        "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
        "sdPublisher": {
          "name": "Springer Nature - SN SciGraph project", 
          "type": "Organization"
        }, 
        "sdSource": "s3://com-springernature-scigraph/baseset/20211201/entities/gbq_results/article/article_658.jsonl", 
        "type": "ScholarlyArticle", 
        "url": "https://doi.org/10.1007/s10854-015-3390-8"
      }
    ]
     

    Download the RDF metadata as:  json-ld nt turtle xml License info

    HOW TO GET THIS DATA PROGRAMMATICALLY:

    JSON-LD is a popular format for linked data which is fully compatible with JSON.

    curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s10854-015-3390-8'

    N-Triples is a line-based linked data format ideal for batch operations.

    curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s10854-015-3390-8'

    Turtle is a human-readable linked data format.

    curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s10854-015-3390-8'

    RDF/XML is a standard XML format for linked data.

    curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s10854-015-3390-8'


     

    This table displays all metadata directly associated to this object as RDF triples.

    166 TRIPLES      22 PREDICATES      85 URIs      68 LITERALS      6 BLANK NODES

    Subject Predicate Object
    1 sg:pub.10.1007/s10854-015-3390-8 schema:about anzsrc-for:09
    2 anzsrc-for:0912
    3 schema:author N82248a29afb2499e80e14bc95adfed9c
    4 schema:citation sg:pub.10.1007/s10854-010-0279-4
    5 sg:pub.10.1007/s10854-012-0751-4
    6 sg:pub.10.1007/s10854-013-1463-0
    7 sg:pub.10.1007/s11664-010-1233-1
    8 sg:pub.10.1007/s11664-013-2620-1
    9 sg:pub.10.1007/s11664-999-0153-4
    10 sg:pub.10.1007/s11665-012-0125-3
    11 sg:pub.10.1007/s11665-012-0146-y
    12 sg:pub.10.1007/s11665-012-0174-7
    13 schema:datePublished 2015-07-03
    14 schema:datePublishedReg 2015-07-03
    15 schema:description The potential of Zn4Al3Mg–xIn alloys to replace Pb-containing solders by high-temperature soldering was studied. The microstructure, thermal behavior, and wettability of Zn4Al3Mg–xIn solders were investigated by scanning electron microscopy, X-ray diffraction, differential scanning calorimetry (DSC), and spreading tests. The influence of In content on the microstructure and characteristics of the solders was explored. Small additions of In result in grain boundary segregation because of the limited solid solubility of In in other phases, and thereby lead to more complicated microstructure of Zn4Al3Mg–xIn alloys. DSC measurements showed that the onset of melting of the Zn4Al3Mg–xIn alloys decreased with increasing In content, while the melting peak became broader. The electrical conductivity values of ZnAlMg–xIn solders were of the same order of magnitude as those of a conventional Pb-5(wt%)Sn solders. The wettability of Zn4Al3Mg–xIn solders over Cu substrate was also improved with increasing In content.
    16 schema:genre article
    17 schema:inLanguage en
    18 schema:isAccessibleForFree false
    19 schema:isPartOf N28a1e0b09db24dfaa0ec58c7bdf16275
    20 N3c0ed60663bf46bfb5b77392abf366c7
    21 sg:journal.1136825
    22 schema:keywords Cu substrate
    23 DSC measurements
    24 Pb-containing solders
    25 Zn4Al3Mg–xIn
    26 Zn4Al3Mg–xIn alloys
    27 Zn4Al3Mg–xIn solders
    28 ZnAlMg–xIn solders
    29 addition
    30 alloy
    31 behavior
    32 boundary segregation
    33 calorimetry
    34 characteristics
    35 complicated microstructure
    36 conductivity values
    37 content
    38 differential scanning calorimetry
    39 diffraction
    40 electrical conductivity values
    41 electron microscopy
    42 grain boundary segregation
    43 high-temperature soldering
    44 influence
    45 limited solid solubility
    46 magnitude
    47 measurements
    48 melting
    49 melting peak
    50 microscopy
    51 microstructure
    52 onset
    53 onset of melting
    54 order
    55 peak
    56 phase
    57 potential
    58 ray diffraction
    59 results
    60 same order
    61 scanning calorimetry
    62 segregation
    63 small additions
    64 solder
    65 soldering
    66 solid solubility
    67 solubility
    68 substrate
    69 test
    70 thermal behavior
    71 values
    72 wettability
    73 schema:name Microstructure, thermal behavior, and wettability of Zn4Al3Mg–xIn solders
    74 schema:pagination 7537-7543
    75 schema:productId N5d934fc4d0724ddcba2054991124a931
    76 Ncbefcba36bfa4255959bf3ea7434a848
    77 schema:sameAs https://app.dimensions.ai/details/publication/pub.1042853212
    78 https://doi.org/10.1007/s10854-015-3390-8
    79 schema:sdDatePublished 2021-12-01T19:33
    80 schema:sdLicense https://scigraph.springernature.com/explorer/license/
    81 schema:sdPublisher N55eafa75c31749bfa825cc0b529c19db
    82 schema:url https://doi.org/10.1007/s10854-015-3390-8
    83 sgo:license sg:explorer/license/
    84 sgo:sdDataset articles
    85 rdf:type schema:ScholarlyArticle
    86 N21d29dbec6df4935accb9c217c409798 rdf:first sg:person.016626464441.62
    87 rdf:rest N4285d5c523364dfa97a553abc5e995fa
    88 N28a1e0b09db24dfaa0ec58c7bdf16275 schema:volumeNumber 26
    89 rdf:type schema:PublicationVolume
    90 N2b4113cc6c2545ff9015ddac691dd72b rdf:first sg:person.014436143041.56
    91 rdf:rest N21d29dbec6df4935accb9c217c409798
    92 N3c0ed60663bf46bfb5b77392abf366c7 schema:issueNumber 10
    93 rdf:type schema:PublicationIssue
    94 N4285d5c523364dfa97a553abc5e995fa rdf:first sg:person.012521025203.12
    95 rdf:rest rdf:nil
    96 N55eafa75c31749bfa825cc0b529c19db schema:name Springer Nature - SN SciGraph project
    97 rdf:type schema:Organization
    98 N5d934fc4d0724ddcba2054991124a931 schema:name dimensions_id
    99 schema:value pub.1042853212
    100 rdf:type schema:PropertyValue
    101 N82248a29afb2499e80e14bc95adfed9c rdf:first sg:person.011516354241.41
    102 rdf:rest N2b4113cc6c2545ff9015ddac691dd72b
    103 Ncbefcba36bfa4255959bf3ea7434a848 schema:name doi
    104 schema:value 10.1007/s10854-015-3390-8
    105 rdf:type schema:PropertyValue
    106 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
    107 schema:name Engineering
    108 rdf:type schema:DefinedTerm
    109 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
    110 schema:name Materials Engineering
    111 rdf:type schema:DefinedTerm
    112 sg:journal.1136825 schema:issn 0957-4522
    113 1573-482X
    114 schema:name Journal of Materials Science: Materials in Electronics
    115 schema:publisher Springer Nature
    116 rdf:type schema:Periodical
    117 sg:person.011516354241.41 schema:affiliation grid-institutes:grid.28703.3e
    118 schema:familyName Yan
    119 schema:givenName Xin
    120 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011516354241.41
    121 rdf:type schema:Person
    122 sg:person.012521025203.12 schema:affiliation grid-institutes:grid.28703.3e
    123 schema:familyName Lei
    124 schema:givenName Yongping
    125 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12
    126 rdf:type schema:Person
    127 sg:person.014436143041.56 schema:affiliation grid-institutes:grid.28703.3e
    128 schema:familyName Yang
    129 schema:givenName Xiaojun
    130 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014436143041.56
    131 rdf:type schema:Person
    132 sg:person.016626464441.62 schema:affiliation grid-institutes:grid.28703.3e
    133 schema:familyName Hu
    134 schema:givenName Wei
    135 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016626464441.62
    136 rdf:type schema:Person
    137 sg:pub.10.1007/s10854-010-0279-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1038389194
    138 https://doi.org/10.1007/s10854-010-0279-4
    139 rdf:type schema:CreativeWork
    140 sg:pub.10.1007/s10854-012-0751-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1030923942
    141 https://doi.org/10.1007/s10854-012-0751-4
    142 rdf:type schema:CreativeWork
    143 sg:pub.10.1007/s10854-013-1463-0 schema:sameAs https://app.dimensions.ai/details/publication/pub.1023593234
    144 https://doi.org/10.1007/s10854-013-1463-0
    145 rdf:type schema:CreativeWork
    146 sg:pub.10.1007/s11664-010-1233-1 schema:sameAs https://app.dimensions.ai/details/publication/pub.1042228909
    147 https://doi.org/10.1007/s11664-010-1233-1
    148 rdf:type schema:CreativeWork
    149 sg:pub.10.1007/s11664-013-2620-1 schema:sameAs https://app.dimensions.ai/details/publication/pub.1019885484
    150 https://doi.org/10.1007/s11664-013-2620-1
    151 rdf:type schema:CreativeWork
    152 sg:pub.10.1007/s11664-999-0153-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1025891570
    153 https://doi.org/10.1007/s11664-999-0153-4
    154 rdf:type schema:CreativeWork
    155 sg:pub.10.1007/s11665-012-0125-3 schema:sameAs https://app.dimensions.ai/details/publication/pub.1015708430
    156 https://doi.org/10.1007/s11665-012-0125-3
    157 rdf:type schema:CreativeWork
    158 sg:pub.10.1007/s11665-012-0146-y schema:sameAs https://app.dimensions.ai/details/publication/pub.1009930385
    159 https://doi.org/10.1007/s11665-012-0146-y
    160 rdf:type schema:CreativeWork
    161 sg:pub.10.1007/s11665-012-0174-7 schema:sameAs https://app.dimensions.ai/details/publication/pub.1041313542
    162 https://doi.org/10.1007/s11665-012-0174-7
    163 rdf:type schema:CreativeWork
    164 grid-institutes:grid.28703.3e schema:alternateName College of Material Science and Engineering, Beijing University of Technology, Beijing, China
    165 schema:name College of Material Science and Engineering, Beijing University of Technology, Beijing, China
    166 rdf:type schema:Organization
     




    Preview window. Press ESC to close (or click here)


    ...